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                            <title><![CDATA[ Latest from Tom's Hardware in High-na ]]></title>
                <link>https://www.tomshardware.com/tag/high-na</link>
        <description><![CDATA[ All the latest high-na content from the Tom's Hardware team ]]></description>
                                    <lastBuildDate>Tue, 24 Feb 2026 12:01:57 +0000</lastBuildDate>
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                                                            <title><![CDATA[ ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-makes-breakthrough-in-euv-chipmaking-tech-plans-to-increase-speed-by-50-percent-by-2030-new-1-000-watt-light-source-fires-three-lasers-at-100-000-tin-droplets-every-second</link>
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                            <![CDATA[ ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond. ]]>
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                                                                        <pubDate>Tue, 24 Feb 2026 12:01:57 +0000</pubDate>                                                                                                                                <updated>Wed, 25 Feb 2026 10:24:40 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MqQcLuXtcS9FPhQiZeDavC-1280-80.jpg">
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                                                            <title><![CDATA[ Intel installs industry's first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-installs-industrys-first-commercial-high-na-euv-lithography-tool-asml-twinscan-exe-5200b-sets-the-stage-for-14a</link>
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                            <![CDATA[ Intel has installed and qualified ASML's TWINSCAN EXE:5200B, the first High-NA EUV lithography tool designed for commercial production, reiterating Intel's plans to use High-NA EUV patterning for 14A process technology and onwards. ]]>
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                                                                        <pubDate>Wed, 17 Dec 2025 12:25:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ 'Beyond EUV' chipmaking tech pushes Soft X-Ray lithography closer to challenging Hyper-NA EUV — 'B-EUV' uses new resist chemistry to make smaller chips ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/beyond-euv-chipmaking-tech-pushes-soft-x-ray-lithography-closer-to-challenging-hyper-na-euv-b-euv-uses-new-resist-chemistry-to-make-smaller-chips</link>
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                            <![CDATA[ Researchers at Johns Hopkins University have developed a new resist chemistry and deposition method optimized for 6.5 nm B-EUV light, marking a key step toward future Soft X-ray lithography. However, major challenges like light sources and tool infrastructure remain unresolved. ]]>
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                                                                        <pubDate>Wed, 17 Sep 2025 11:38:04 +0000</pubDate>                                                                                                                                <updated>Wed, 17 Sep 2025 20:56:59 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
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                                                            <title><![CDATA[ ASML and SK hynix assemble industry-first 'commercial' High-NA EUV system at fab in South Korea ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-and-sk-hynix-assemble-industry-first-commercial-high-na-euv-system-at-fab-in-south-korea</link>
                                                                            <description>
                            <![CDATA[ SK hynix is the first memory maker to assemble ASML's High-NA EUV lithography system NXE:5200B at its M16 fab in Icheon to use it for R&D of next-generation process technologies before transitioning to full High-NA-based production later this decade. ]]>
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                                                                        <pubDate>Wed, 03 Sep 2025 09:58:25 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Intel will cancel 14A and following nodes if it can't win a major external customer — move would cede leading-edge nodes to TSMC and Samsung ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-might-cancel-14a-process-node-development-and-the-following-nodes-if-it-cant-win-a-major-external-customer-move-would-cede-leading-edge-market-to-tsmc-and-samsung</link>
                                                                            <description>
                            <![CDATA[ Intel admits that it may halt or cancel development of its 14A (1.4nm-class) process node — its first to use High-NA EUV — if it fails to secure a major external customer or meet key milestones, which would likely mean its exit from the leading-edge semiconductor race. ]]>
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                                                                        <pubDate>Thu, 24 Jul 2025 22:36:54 +0000</pubDate>                                                                                                                                <updated>Fri, 25 Jul 2025 09:56:22 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/iHJSp7cXP3UeHRdZqukkZQ-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
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                                                            <title><![CDATA[ Plans to shrink particle accelerators by 1,000x could speed chipmaking by 15X - Inversion Semiconductor proposes 'tabletop' particle accelerators with petawatt lasers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/plans-to-shrink-particle-accelerators-by-1000x-could-speed-chipmaking-by-15x-inversion-semiconductor-proposes-tabletop-particle-accelerators-with-petawatt-lasers</link>
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                            <![CDATA[ Inversion Semiconductor, a 2024 startup backed by Y Combinator, aims to develop a compact, LWFA-based light source that 10 times more powerful than ASML's current EUV light sources while also targeting even shorter wavelengths. ]]>
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                                                                        <pubDate>Mon, 09 Jun 2025 17:09:56 +0000</pubDate>                                                                                                                                <updated>Tue, 09 Sep 2025 18:27:54 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/f5P7a7qwfopDaA4MsgPPoa-1280-80.jpg">
                                                            <media:credit><![CDATA[Inversion Lithography]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Inversion Lithography]]></media:description>                                                            <media:text><![CDATA[Inversion Lithography]]></media:text>
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                                                            <title><![CDATA[ TSMC reiterates it doesn't need High-NA EUV for 1.4nm-class process technology ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-reiterates-it-doesnt-need-high-na-euv-for-1-4nm-class-process-technology</link>
                                                                            <description>
                            <![CDATA[ TSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV tools combined with internal innovations provide sufficient scaling and performance benefits. ]]>
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                                                                        <pubDate>Wed, 28 May 2025 20:27:42 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Intel has championed High-NA EUV chipmaking tools, but costs and other limitations could delay industry-wide adoption: Report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/intel-has-championed-high-na-euv-chipmaking-tools-but-costs-and-other-limitations-could-delay-industry-wide-adoption-report</link>
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                            <![CDATA[ Intel has taken an early lead in High-NA EUV lithography, but widespread adoption remains constrained by high tool costs, limited exposure field size, and potential need for substantial ecosystem upgrades. ]]>
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                                                                        <pubDate>Wed, 16 Apr 2025 16:36:03 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:43:31 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ ASML teams up with Imec for sub-2nm process technologies with High-NA EUV chipmaking tools ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-teams-up-with-imec-for-sub-2nm-process-technologies-with-high-na-euv-chipmaking-tools</link>
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                            <![CDATA[ ASML to install its High-NA EUV lithography tools in Imec's pilot production line to give research and development personnel access to leading-edge equipment. ]]>
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                                                                        <pubDate>Wed, 12 Mar 2025 11:05:27 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:41:56 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/fdxw9P4zVFbAmcs3MtwjDE-1280-80.jpg">
                                                            <media:credit><![CDATA[Imec]]></media:credit>
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                                                            <title><![CDATA[ Intel has processed 30,000 wafers with High-NA EUV chipmaking tool ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/intel-has-processed-30-000-wafers-with-high-na-euv-chipmaking-tool</link>
                                                                            <description>
                            <![CDATA[ Intel says ASML's High-NA EUV tools have produced 30,000 wafers in a single quarter. ]]>
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                                                                        <pubDate>Tue, 25 Feb 2025 17:21:36 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:53:44 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ American lab is developing a BAT laser that could enable 'beyond EUV' lithography, provide 10X power efficiency boost ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/american-lab-is-developing-a-bat-laser-that-could-enable-beyond-euv-lithography-provide-10x-power-efficiency-boost</link>
                                                                            <description>
                            <![CDATA[ Petawatt-class thulium lasers could replace CO2 lasers in lithography machines down the road. ]]>
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                                                                        <pubDate>Sun, 05 Jan 2025 14:00:45 +0000</pubDate>                                                                                                                                <updated>Sun, 05 Jan 2025 16:24:56 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/uNfbwnmHxf6Ve2h6mtiBaE-1280-80.jpg">
                                                            <media:credit><![CDATA[Lawrence Livermore National Laboratory]]></media:credit>
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                                                            <title><![CDATA[ ASML made a $230 Lego kit version of its $380 million semiconductor tool — world's first High-NA EUV machine immortalized in small form for your mantle ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-made-a-usd230-lego-kit-version-of-its-usd380-million-semiconductor-tool-worlds-first-high-na-euv-machine-immortalized-in-small-form-for-your-mantle</link>
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                            <![CDATA[ ASML has added the TWINSCAN EXE:5000 Lego set to its growing portfolio of gifts. ]]>
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                                                                        <pubDate>Sun, 01 Dec 2024 15:11:30 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:44:29 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ADb4ttFWLkqmvuGmWG5Ug7-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[ASML lego gifts]]></media:description>                                                            <media:text><![CDATA[ASML lego gifts]]></media:text>
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                                                            <title><![CDATA[ TSMC rumored to receive High NA EUV machines from ASML this year ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-rumored-to-receive-high-na-euv-machines-from-asml-this-year</link>
                                                                            <description>
                            <![CDATA[ TSMC is set to receive its first shipment of ASML's High NA EUV machine later this year. ]]>
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                                                                        <pubDate>Sun, 03 Nov 2024 14:37:06 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 09:48:01 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Analyst firm raises alarm about EUV chipmaking tools — each consumes as much power as a small city, fabs to consume 54,000 Gigawatts by 2030 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/each-euv-chipmaking-tool-consumes-as-much-power-as-a-small-city-euv-fabs-to-consume-54-000-gigawatts-by-2030-more-than-singapore</link>
                                                                            <description>
                            <![CDATA[ Leading-edge semiconductor fabs to consume 54,000  Gigawatts a year by 2030, which is more than some countries consume today. ]]>
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                                                                        <pubDate>Thu, 31 Oct 2024 13:01:34 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:06:34 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/yQaGAkqxhQh83Cd9CuzDWg-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC fab]]></media:description>                                                            <media:text><![CDATA[TSMC fab]]></media:text>
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                                                            <title><![CDATA[ Corning's Extreme ULE glass debuts for next-gen High-NA EUV chipmaking ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/corning-unveils-extreme-ule-glass-for-use-in-next-generation-microchip-production</link>
                                                                            <description>
                            <![CDATA[ Corning introduces new Extreme ULE glass for photomasks and mirrors to be used with next-generation EUV and High-NA EUV tools. ]]>
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                                                                        <pubDate>Wed, 02 Oct 2024 14:37:44 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/Vu6N9RDjut8Yy6FiGKNSCB-1280-80.png">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Mask]]></media:description>                                                            <media:text><![CDATA[Mask]]></media:text>
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                                                            <title><![CDATA[ TSMC's first High-NA EUV litho tool to begin installation this month say industry insiders ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/tsmcs-first-high-na-euv-litho-tool-to-begin-installation-this-month-according-to-industry-insiders</link>
                                                                            <description>
                            <![CDATA[ TSMC to start installing High-NA EUV system for R&D purposes this month. ]]>
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                                                                        <pubDate>Tue, 10 Sep 2024 12:19:10 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:55:33 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
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                                                            <title><![CDATA[ Samsung may start installing its first High-NA EUV litho tool in late 2024 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/samsung-may-start-installing-its-first-high-na-euv-litho-tool-in-late-2024</link>
                                                                            <description>
                            <![CDATA[ Samsung will be about a year behind Intel in installing ASML's Twinscan EXE:5000 High-NA litho tool for development purposes. ]]>
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                                                                        <pubDate>Thu, 15 Aug 2024 15:40:40 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:45:33 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/fdxw9P4zVFbAmcs3MtwjDE-1280-80.jpg">
                                                            <media:credit><![CDATA[Imec]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Imec]]></media:description>                                                            <media:text><![CDATA[Imec]]></media:text>
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                                                            <title><![CDATA[ TSMC says it doesn't need High-NA EUV chipmaking tools for 1.6nm-class node, but Intel has championed the tech ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/tsmc-says-it-doesnt-need-high-na-chipmaking-tools-for-16nm-class-node-in-contrast-intel-has-championed-the-tech</link>
                                                                            <description>
                            <![CDATA[ TSMC says it will not need a high-NA litho tool for its A16 technology but will keep exploring it for A16 and beyond. ]]>
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                                                                        <pubDate>Thu, 25 Apr 2024 14:23:16 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:42:25 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/8UBxmFkiTpTJkoES5eRCPi-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/cpus/intel-completes-assembly-of-first-commercial-high-na-euv-chipmaking-tool-as-it-preps-for-14a-process</link>
                                                                            <description>
                            <![CDATA[ Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon. ]]>
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                                                                        <pubDate>Thu, 18 Apr 2024 14:02:33 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:57:56 +0000</updated>
                                                                                                                                            <category><![CDATA[CPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ palcorn@outlook.com (Paul Alcorn) ]]></author>                    <dc:creator><![CDATA[ Paul Alcorn ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/bHSbvCbG6PVyGaVVhqDCpi-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
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                                                            <title><![CDATA[ ASML ships its second High-NA EUV litho tool to unspecified client ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-ships-its-second-high-na-euv-litho-tool-to-unspecified-client</link>
                                                                            <description>
                            <![CDATA[ ASML begins to ship its High-NA EUV lithography system to the second customer ]]>
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                                                                        <pubDate>Wed, 17 Apr 2024 23:34:32 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:10:22 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ ASML sets density record with latest chipmaking tools — High-NA EUV equipment prints first patterns ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-sets-density-record-with-latest-chipmaking-tools-high-na-euv-equipment-prints-first-patterns</link>
                                                                            <description>
                            <![CDATA[ ASML has reached another milestone with its Twinscan EXE:5000 lithography system. ]]>
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                                                                        <pubDate>Wed, 17 Apr 2024 15:55:21 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 09:49:22 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/dpptX8fNMiGo3jBGfgMb9j-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Samsung rep says High-NA EUV is good for logic fabrication but might have cost issues for memory — Intel, ASML, and others share more bullish views ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/samsung-rep-says-high-na-euv-is-good-for-logic-but-might-have-cost-issues-for-memory-fabrication-intel-asml-and-others-are-more-bullish</link>
                                                                            <description>
                            <![CDATA[ Samsung shares its views on High-NA EIV costs, while other companies present more bullish views. ]]>
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                                                                        <pubDate>Sat, 09 Mar 2024 15:55:10 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:53:41 +0000</updated>
                                                                                                                                            <category><![CDATA[Manufacturing]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/gnSjUMTXWUw4U9XVjK4Kri-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Intel shares biggest unboxing video ever as ASML’s $380 million High-NA lithography machine is installed in Oregon fab ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-shares-biggest-unboxing-video-ever-as-asmls-dollar380-million-high-na-lithography-machine-is-installed-in-oregon-fab</link>
                                                                            <description>
                            <![CDATA[ Intel posts video showing the arrival and installation of its cutting-edge High-NA lithography machine. ]]>
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                                                                        <pubDate>Mon, 04 Mar 2024 17:36:33 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:56:32 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/dG7mDqfcpGmepGDasSdhDV-1280-80.png">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
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                                                            <title><![CDATA[ Intel and ASML achieve 'First Light' milestone with world's most advanced chipmaking tool — High-NA tools' EUV light source and mirrors are functional ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/intel-and-asml-achieve-first-light-milestone-with-worlds-most-advanced-chipmaking-tool-high-na-tools-euv-light-source-and-mirrors-are-functional</link>
                                                                            <description>
                            <![CDATA[ ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time. ]]>
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                                                                        <pubDate>Wed, 28 Feb 2024 18:51:16 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 09:53:00 +0000</updated>
                                                                                                                                            <category><![CDATA[Manufacturing]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/VeUsd9vM4WBszDumWSs7gJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
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                                                            <title><![CDATA[ ASML explores Hyper-NA chipmaking tools as the next step in shrinking transistors — tools would debut in 2030, but significant technology and cost hurdles remain  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/asml-explores-hyper-na-chipmaking-tools-as-the-next-step-in-shrinking-transistors-tools-would-debut-in-2030-but-significant-technology-and-cost-hurdles-remain</link>
                                                                            <description>
                            <![CDATA[ ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s. ]]>
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                                                                        <pubDate>Fri, 16 Feb 2024 17:44:55 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:44:27 +0000</updated>
                                                                                                                                            <category><![CDATA[Manufacturing]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
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                                                            <title><![CDATA[ Evidence mounts that TSMC won't adopt next-gen EUV chipmaking tools until 1nm debuts in the 2030 timeframe ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/evidence-mounts-that-tsmc-wont-adopt-next-gen-euv-chipmaking-tools-until-1nm-debuts-in-the-2030-timeframe</link>
                                                                            <description>
                            <![CDATA[ Fab toolmaker tells DigiTimes that TSMC will likely adopt High-NA at 1nm. ]]>
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                                                                        <pubDate>Wed, 07 Feb 2024 16:02:49 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 09:50:58 +0000</updated>
                                                                                                                                            <category><![CDATA[Manufacturing]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
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                                                            <title><![CDATA[ ASML fires back at accusations that its next-gen High-NA EUV chipmaking tools are too expensive ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/asml-fires-back-at-accusations-that-its-next-gen-high-na-euv-chipmaking-tools-are-too-expensive</link>
                                                                            <description>
                            <![CDATA[ ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools. ]]>
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                                                                        <pubDate>Wed, 31 Jan 2024 12:51:44 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:56:47 +0000</updated>
                                                                                                                                            <category><![CDATA[Manufacturing]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC won't adopt advanced High-NA EUV chipmaking tools until 2030 or later — Intel just received its first tool this week: Report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/tsmc-to-adopt-high-na-euv-tools-in-2030-or-later-report</link>
                                                                            <description>
                            <![CDATA[ According to China Renaissance, TSMC might adopt High-NA EUV lithography for a post-1nm process technology in 2030 or later. ]]>
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                                                                        <pubDate>Sat, 06 Jan 2024 14:28:27 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:58:59 +0000</updated>
                                                                                                                                            <category><![CDATA[Manufacturing]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
                                <media:title type="plain"><![CDATA[ASML EUV machine]]></media:title>
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                                                            <title><![CDATA[ ASML ships groundbreaking new chipmaking tool to Intel — High-NA lithography tool needed for next-gen process nodes could cost ~$400 million ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/cpus/asml-ships-groundbreaking-new-chipmaking-tool-to-intel-high-na-lithography-tool-needed-for-next-gen-process-nodes-could-cost-dollar400-million</link>
                                                                            <description>
                            <![CDATA[ ASML on Thursday announced that it had begun shipping the industry's first extreme ultraviolet (EUV) lithography tool with a 0.55 numerical aperture (High-NA) to Intel. ]]>
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                                                                        <pubDate>Thu, 21 Dec 2023 19:19:11 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:55:14 +0000</updated>
                                                                                                                                            <category><![CDATA[CPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/nimzstaxwMtaqmU3zp8fsd-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML staff in front of a truck with part of a High-NA lithography machine.]]></media:description>                                                            <media:text><![CDATA[ASML staff in front of a truck with part of a High-NA lithography machine.]]></media:text>
                                <media:title type="plain"><![CDATA[ASML staff in front of a truck with part of a High-NA lithography machine.]]></media:title>
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                                                            <title><![CDATA[ Intel is buying leading-edge lithography tools — report says Intel will acquire 6 of 10 High-NA EUV tools produced by ASML next year ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/cpus/intel-is-buying-leading-edge-lithography-tools-report-says-intel-will-acquire-six-of-10-high-na-euv-tools-produced-by-asml-next-year</link>
                                                                            <description>
                            <![CDATA[ Intel is gearing up to be high-NA EUV lithography champ with orders for six additional Twinscan EXE machines. ]]>
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                                                                        <pubDate>Wed, 20 Dec 2023 17:52:31 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:44:47 +0000</updated>
                                                                                                                                            <category><![CDATA[CPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/n5rnmT2a6hGJaGhpwtnCm5-1280-80.png">
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                                                            <title><![CDATA[ ASML to Ship First High-NA EUV Tool This Year: $300 Million per Scanner ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/news/asml-to-ship-first-high-na-euv-tool-this-year-dollar300-million-per-scanner</link>
                                                                            <description>
                            <![CDATA[ ASML expects its partners to start using High-NA EUV scanners in 2025 and beyond. ]]>
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                                                                        <pubDate>Wed, 06 Sep 2023 18:50:19 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:43:41 +0000</updated>
                                                                                                                                            <category><![CDATA[CPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/n5rnmT2a6hGJaGhpwtnCm5-1280-80.png">
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                                                            <title><![CDATA[ ASML: Demand for Chip Tools Hits Record, Backlog Exceeds $38 Billion ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/news/asml-demand-for-chip-tools-hits-record-backlog-exceeds-dollar38-billion</link>
                                                                            <description>
                            <![CDATA[ ASML sees record demand for chip production equipment despite U.S. sanctions against Chinese chip sector. ]]>
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                                                                        <pubDate>Wed, 19 Oct 2022 16:16:00 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:41:54 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
                                <media:title type="plain"><![CDATA[ASML EUV machine]]></media:title>
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                                                            <title><![CDATA[ Intel Orders Second High-NA EUV Scanner: On-Track for Mass Production in 2025 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/news/intel-orders-second-twinscan-exe-high-na-euv-tool</link>
                                                                            <description>
                            <![CDATA[ Intel orders ASML's TWINSCAN EXE:5200 scanner. ]]>
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                                                                        <pubDate>Wed, 19 Jan 2022 15:54:00 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:09:36 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/n5rnmT2a6hGJaGhpwtnCm5-1280-80.png">
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