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                    <title><![CDATA[ Latest from Tom's Hardware in Manufacturing ]]></title>
                <link>https://www.tomshardware.com/tech-industry/manufacturing</link>
        <description><![CDATA[ All the latest manufacturing content from the Tom's Hardware team ]]></description>
                                    <lastBuildDate>Thu, 09 Apr 2026 15:09:42 +0000</lastBuildDate>
                            <language>en</language>
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                                                            <title><![CDATA[ Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited,EMIB-T is preparing for advanced AI accelerator designs ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intels-emib-t-heads-for-fab-rollout-this-year</link>
                                                                            <description>
                            <![CDATA[ If these “billions per year” in deals close, it’d mark quite the turnaround for Intel Foundry, which generated just $307 million in external revenue last year. ]]>
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                                                                        <pubDate>Thu, 09 Apr 2026 15:09:42 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/qXjw6K9cVJzeNZurs6CD3H-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / Justin Sullivan]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel Headquarters, with people walking by ]]></media:description>                                                            <media:text><![CDATA[Intel Headquarters, with people walking by ]]></media:text>
                                <media:title type="plain"><![CDATA[Intel Headquarters, with people walking by ]]></media:title>
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                                                            <title><![CDATA[ China intensifies efforts to poach semiconductor talent from Taiwan, claims report — international restrictions motivate illicit efforts to obtain talent and equipment  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-intensifies-efforts-to-poach-semiconductor-talent-from-taiwan-claims-report-international-restrictions-motivate-illicit-efforts-to-obtain-talent-and-equipment</link>
                                                                            <description>
                            <![CDATA[ Taiwan's National Security Bureau claims that China is intensifying efforts to steal semiconductor process technologies and other chip-related know-how from Taiwan as international restrictions get more severe. ]]>
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                                                                        <pubDate>Wed, 08 Apr 2026 10:05:58 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/jNq3T5Z4DQqsDU65zadz5A-1280-80.png">
                                                            <media:credit><![CDATA[SMIC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SMIC]]></media:description>                                                            <media:text><![CDATA[SMIC]]></media:text>
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                                                            <title><![CDATA[ Intel joins Elon Musk's TeraFab project — 'Intel is proud to join the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology' ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-joins-elon-musks-terafab-project-intel-is-proud-to-join-the-terafab-project-with-spacex-xai-and-tesla-to-help-refactor-silicon-fab-technology</link>
                                                                            <description>
                            <![CDATA[ As Intel joins Elon Musk's TeraFab project, Lip-Bu Tan expects Elon Musk to reimagine the semiconductor industry. ]]>
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                                                                        <pubDate>Tue, 07 Apr 2026 15:34:11 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EZCTC9MCaqNdiAMUCqPqEK-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel/X.com]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
                                <media:title type="plain"><![CDATA[Intel]]></media:title>
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                                                            <title><![CDATA[ Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-reportedly-in-talks-with-google-and-amazon-over-advanced-packaging</link>
                                                                            <description>
                            <![CDATA[ Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs. ]]>
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                                                                        <pubDate>Tue, 07 Apr 2026 10:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/mmPcxQxEVpUKNJBz8zqMnA-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Justin Sullivan]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel logo]]></media:description>                                                            <media:text><![CDATA[Intel logo]]></media:text>
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                                                            <title><![CDATA[ US lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China — bipartisan proposal would ban lithography equipment for Huawei, SMIC, and others ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/u-s-lawmakers-aim-to-ban-export-of-duv-chipmaking-and-etching-tools-to-leading-firms-in-china-bipartisan-proposal-would-ban-lithography-equipment-for-huawei-smic-and-others</link>
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                            <![CDATA[ Bipartisan group of U.S. senators propose to impose blanket ban on export of advanced DUV lithography and etching tools to Chinese companies known to have worked with China's military, such as CXMT, Huawei, SMIC, and YMTC. ]]>
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                                                                        <pubDate>Mon, 06 Apr 2026 19:59:55 +0000</pubDate>                                                                                                                                <updated>Mon, 06 Apr 2026 20:00:06 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/5Mq4J9jfCyPqV9qsyhUWe8-1280-80.jpg">
                                                            <media:credit><![CDATA[SMIC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SMIC]]></media:description>                                                            <media:text><![CDATA[SMIC]]></media:text>
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                                                            <title><![CDATA[ TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-reportedly-plans-to-build-12-fabs-four-packaging-facilities-in-arizona-plan-purportedly-part-of-taiwans-agreed-usd500-million-investment-in-the-us</link>
                                                                            <description>
                            <![CDATA[ New rumor indicates that TSMC is looking forward to expand its presence in the U.S. to 12 fabs and four packaging facilities. ]]>
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                                                                        <pubDate>Fri, 03 Apr 2026 11:55:07 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
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                                                            <title><![CDATA[ Intel buys back 49% stake in Ireland Fab Joint Venture — takes full control over Fab 34 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-buys-back-49-percent-stake-in-ireland-fab-jv-gains-full-control-over-fab-34</link>
                                                                            <description>
                            <![CDATA[ In a mutually beneficial deal, Intel repurchases 49% of Fab 34 from Apollo for $14.2 billion, reducing pressure on its margins, but paying a hefty $3 billion premium to the financial company. ]]>
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                                                                        <pubDate>Thu, 02 Apr 2026 10:40:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XSmGCAUBerwsBhZgUEkxS-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ The global helium shortage is a direct threat to the chipmaking supply chain — disruption impacts critical processes, high-capacity HDDs, and alternative supplies are plagued by delays ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/the-global-helium-shortage-is-a-direct-threat-to-chipmaking</link>
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                            <![CDATA[ Some industry analysts expect it will take Qatar around five years to regain lost capacity. ]]>
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                                                                        <pubDate>Tue, 31 Mar 2026 13:20:26 +0000</pubDate>                                                                                                                                <updated>Wed, 01 Apr 2026 16:58:09 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/kYurY4V2cEYRJHFrJ2ALxf-1280-80.png">
                                                            <media:credit><![CDATA[QatarEnergy]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[QatarEnergy Ras Laffan]]></media:description>                                                            <media:text><![CDATA[QatarEnergy Ras Laffan]]></media:text>
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                                                            <title><![CDATA[ TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case — former engineer accused of stealing 2nm technical info, faces a total of up to 20 years in prison if found guilty ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-industrial-espionage-saga-heading-to-verdict-next-month-in-unprecedented-taiwan-national-security-act-case-former-engineer-accused-of-stealing-2nm-technical-info-faces-a-total-of-up-to-20-years-in-prison-if-found-guilty</link>
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                            <![CDATA[ One of the three landmark cases involving the theft of trade secrets from TSMC has run through investigative and court proceedings, and a verdict is scheduled for April 27. ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 16:33:29 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Bruno Ferreira) ]]></author>                    <dc:creator><![CDATA[ Bruno Ferreira ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/BgRfzQhj7htYiYMyXELhKa-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Corporate espionage]]></media:description>                                                            <media:text><![CDATA[Corporate espionage]]></media:text>
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                                                            <title><![CDATA[ Analyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an unattainable dream? ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/analyzing-elon-musks-terafab-a-step-towards-tesla-and-spacexs-partial-vertical-integration-or-an-unattainable-dream</link>
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                            <![CDATA[ Elon Musk's TeraFab has been announced, and the first employees are now being hired. But can this venture scale to all of its terawatt glory? Or will it just help Tesla, SpaceX, and xAI land additional chips they cannot get from regular partners? ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 15:51:26 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/yQaGAkqxhQh83Cd9CuzDWg-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
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                                                            <title><![CDATA[ Chinese chip industry leaders admit the country lags five to ten years behind in AI data center chips — AI demand is straining equipment and talent supply  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chinese-chip-industry-leaders-say-ai-demand-is-straining-equipment-and-talent-supply</link>
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                            <![CDATA[ Senior Chinese semiconductor executives said AI-driven demand is creating bottlenecks across equipment, passive components, and workforce capacity. ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 13:27:40 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ScWkdXEcbCzcmrjizukTn7-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / NurPhoto]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Chip IC with Chinese flag above]]></media:description>                                                            <media:text><![CDATA[Chip IC with Chinese flag above]]></media:text>
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                                                            <title><![CDATA[ Air Liquide opens Taiwan factory as helium shortage tightens around chip makers — 200 specialized helium containers stranded near the Strait of Hormuz ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/air-liquide-opens-taiwan-factory-as-helium-shortage-tightens-around-chip-makers</link>
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                            <![CDATA[ French industrial gas supplier Air Liquide opened a new factory near the port of Taichung, Taiwan, on Wednesday, as the semiconductor industry faces a worsening helium shortage. ]]>
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                                                                        <pubDate>Fri, 27 Mar 2026 16:22:19 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Mar 2026 16:24:44 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/vyGvmuYuEW77t9igShPB4U-1280-80.png">
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                                                                                                                                                                                                                                    <media:description><![CDATA[The Strait of Hormuz]]></media:description>                                                            <media:text><![CDATA[The Strait of Hormuz]]></media:text>
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                                                            <title><![CDATA[ Elon Musk's Terafab semiconductor project could cost $5 trillion, Bernstein claims — herculean effort would cost more than 70% of the total yearly US government budget ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musks-terafab-semiconductor-project-could-cost-usd5-trillion-bernstein-claims-herculean-effort-would-cost-more-than-70-percent-of-the-total-yearly-us-government-budget</link>
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                            <![CDATA[ To build 1 TW of AI silicon per year, Elon Musk's TeraFab would need to process 22.4 million Rubin Ultra GPU wafers, 2.716 million Vera CPU wafers, and 15.824 million HBM4E wafers annually using from 142 to 358 fabs, according to Bernstein. ]]>
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                                                                        <pubDate>Thu, 26 Mar 2026 10:40:40 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Mar 2026 12:41:33 +0000</updated>
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                                                    <category><![CDATA[Tech Industry]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XSmGCAUBerwsBhZgUEkxS-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                        <media:description><![CDATA[To build compute chips that consume 1 TW per year, Elon Musk&#039;s TeraFab project will need to operate up to 358 modern fabs worth $5 trillion, according to Bernstein. ]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ SK hynix places record $8 billion order for ASML EUV lithography machines — should pay for up to 30 EUV machines over two years, serving HBM and advanced DRAM production ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-places-record-8-billion-order-for-asml-euv-lithography-machines</link>
                                                                            <description>
                            <![CDATA[ SK hynix disclosed in a regulatory filing on Tuesday that it will purchase 11.9 trillion won ($7.9 billion) worth of EUV lithography equipment from ASML. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 16:38:01 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/NzktnSTcWDJPvdfKLwMi9F-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Bloomberg]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK hynix]]></media:description>                                                            <media:text><![CDATA[SK hynix]]></media:text>
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                                                            <title><![CDATA[ Microsoft-backed start-up raises $40 million for helium atom beam lithography that could print chips at atomic resolution — 0.1nm beam is 135 times narrower than ASML's EUV light ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/norwegian-start-up-raises-40-million-for-helium-atom-beam-lithography</link>
                                                                            <description>
                            <![CDATA[ Lace Lithography raised $40 million in Series A funding on Monday to develop a chipmaking tool that uses a helium atom beam instead of light to pattern silicon wafers. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 13:02:21 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/iiBPT3tVuXkSdD4xCKSR9m-1280-80.png">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Trump administration targets $4 trillion Pax Silica investment fund for semiconductors — the US will start with a $250 million investment for global consortium ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/trump-administration-targets-4-trillion-pax-silica-investment-fund-for-semiconductors</link>
                                                                            <description>
                            <![CDATA[ The Trump administration is targeting $4 trillion Pax Silica investment for semiconductors. It’s not currently clear how the Trump administration arrived at the $4 trillion figure, or how it will ultimately materialize. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 10:30:00 +0000</pubDate>                                                                                                                                <updated>Thu, 26 Mar 2026 14:55:22 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/L4SJRSyzF4WTiszKTik7Fe-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel Xe Graphics]]></media:description>                                                            <media:text><![CDATA[Intel Xe Graphics]]></media:text>
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                                                            <title><![CDATA[ 'Silicon' is a new five-pound art book charting the semiconductor revolution with full-page die shots and commentary — 384 page tome is $99 to pre-order now ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/silicon-is-a-new-five-pound-art-book-charting-the-semiconductor-revolution-with-full-page-die-shots-and-commentary-384-page-tome-is-usd99-to-pre-order-now</link>
                                                                            <description>
                            <![CDATA[ Silicon, Arena’s stylish and premium “coffee table book like no other,” is up for pre-order now priced at $99. ]]>
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                                                                        <pubDate>Sun, 22 Mar 2026 12:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/KCXJiXMNkv46M7ty4Dy7HT-1280-80.jpg">
                                                            <media:credit><![CDATA[Arena Magazine]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Silicon]]></media:description>                                                            <media:text><![CDATA[Silicon]]></media:text>
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                                                            <title><![CDATA[ City has roads named Tape Drive and Disk Drive from bygone HDD-making era — area was once home to the StorageTek empire ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/city-has-roads-named-tape-drive-and-disk-drive-from-bygone-hdd-making-era-area-was-once-home-to-the-storagetek-empire</link>
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                            <![CDATA[ Tape Drive and Disk Drive rods in the Louisville/Broomfield area are a relic of the STK diskmaker's time in the city. ]]>
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                                                                        <pubDate>Sun, 22 Mar 2026 11:42:30 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/iHEUQ4gETHFMysH2NXRjvU-1280-80.jpg">
                                                            <media:credit><![CDATA[Google Maps]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Some techy street names]]></media:description>                                                            <media:text><![CDATA[Some techy street names]]></media:text>
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                                                            <title><![CDATA[ Supermicro employees accused of smuggling $2.5 billion worth of Nvidia hardware to China — perps used a hairdryer to move serial numbers between real hardware and thousands of dummy servers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/super-micro-employees-accused-of-smuggling-usd2-5-billion-worth-of-nvidia-hardware-to-china-perps-used-a-hairdryer-to-move-serial-numbers-between-real-hardware-and-thousands-of-dummy-servers</link>
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                            <![CDATA[ Three Super Micro employees have been charged with conspiring to unlawfully divert cutting edge U.S. artificial intelligence technology to China. ]]>
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                                                                        <pubDate>Fri, 20 Mar 2026 13:05:10 +0000</pubDate>                                                                                                                                <updated>Fri, 20 Mar 2026 17:28:39 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/7V9ueZXh85UyPKGS7ipzR8-1280-80.jpg">
                                                            <media:credit><![CDATA[US DOJ]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[CCTV scenes from the Southeast Asia warehouse]]></media:description>                                                            <media:text><![CDATA[CCTV scenes from the Southeast Asia warehouse]]></media:text>
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                                                            <title><![CDATA[ Tesla hiring semiconductor fabs construction manager — Elon Musk's ambitious Terafab project begins ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tesla-hiring-semiconductor-fabs-construction-manager-elon-musks-ambitious-terafab-project-begins</link>
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                            <![CDATA[ Tesla begins to form a core team behind its Terafab project, which will define the fab and spearhead its construction and tamp. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 16:47:53 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/b7s6fZ6YvGNVJ486EieMkF-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Fabrice Coffrini]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Elon Musk]]></media:description>                                                            <media:text><![CDATA[Elon Musk]]></media:text>
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                                                            <title><![CDATA[ US trade deficit hits a record $1.2 trillion as AI hardware imports surge under the Trump administration — massive demand for chips from Asia outpaces domestic production, fueling a 60% increase in imports in 12 months ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/us-trade-deficit-hits-a-record-usd1-2-trillion-as-ai-hardware-imports-surge-under-the-trump-administration-massive-demand-for-chips-from-asia-outpaces-domestic-production-fueling-a-60-percent-increase-in-imports-in-12-months</link>
                                                                            <description>
                            <![CDATA[ AI-related imports across the computing and electronics sector have led to a big increase in the U.S. trade deficit, hitting a record $1.2 trillion in 2025, despite efforts from the Trump administration to reduce the gap. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 16:25:21 +0000</pubDate>                                                                                                                                <updated>Thu, 26 Mar 2026 18:24:27 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Ben Stockton ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Um95qeB8aWAJ86memLYAnL-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[A container ship with containers at sea]]></media:description>                                                            <media:text><![CDATA[A container ship with containers at sea]]></media:text>
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                                                            <title><![CDATA[ How Nvidia's $20 billion Groq 3 LPU deal reshapes the Nvidia Vera Rubin Platform — Samsung 4nm process serves as bedrock for SRAM-based AI accelerator chip ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/nvidias-20-billion-groq-deal-produces-its-first-chip</link>
                                                                            <description>
                            <![CDATA[ Nvidia unveiled the Groq 3 language processing unit at GTC 2026 in San Jose on Monday, marking the first chip to emerge from its $20 billion licensing and talent deal with Groq. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 15:45:10 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/49QX9DhQjJDwWiR2NPT9tD-1280-80.jpg">
                                                            <media:credit><![CDATA[Nvidia]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Rubin GPU next to Groq LPU]]></media:description>                                                            <media:text><![CDATA[Rubin GPU next to Groq LPU]]></media:text>
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                                                            <title><![CDATA[ Researchers reach superconductivity at ambient pressure, record high temperature — milestone of -122°C reached by using pressure quenching, still 140 degrees off room temperature target ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/researchers-reach-superconductivity-at-ambient-pressure-record-high-temperature-milestone-of-122-c-reached-by-using-pressure-quenching-still-140-degrees-off-room-temperature-target</link>
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                            <![CDATA[ Researchers from the University of Houston managed to increase the critical temperature for superconductivity by about 18 K at ambient pressure, but at −122°C, they are still 140°C away from the target. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 13:27:31 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/wS6jkGXv2vnZpFsMSa6kZN-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ AMD and Samsung ink memory supply memorandum for EPYC and Instinct products — unprecedented deal also includes scope for foundry partnership ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/amd-and-samsung-ink-memory-supply-memorandum-for-epyc-and-instinct-products-unprecedented-deal-also-includes-scope-for-foundry-partnership</link>
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                            <![CDATA[ Samsung to remain primary HBM memory supplier for AMD's AI accelerators as the companies look into possible foundry relationship. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 11:18:47 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/SUTR9jxWe8aiYRjXPCPnVj-1280-80.jpg">
                                                            <media:credit><![CDATA[AMD]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[AMD]]></media:description>                                                            <media:text><![CDATA[AMD]]></media:text>
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                                                            <title><![CDATA[ Australian researchers develop quantum battery proof-of-concept which uses lasers to charge near-instantly — breakthrough could pave the way for ultra-fast wireless charging for EVs and drones in the future, say researchers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/australian-researchers-develop-quantum-battery-proof-of-concept-which-uses-lasers-to-charge-near-instantly-breakthrough-could-pave-the-way-for-ultra-fast-wireless-charging-for-evs-and-drones-in-the-future-say-researchers</link>
                                                                            <description>
                            <![CDATA[ Australian researchers have reportedly created the world's first quantum battery prototype. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 10:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Manufacturing]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Ben Stockton ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vDLqXCW7UXpwZhdDfus5EJ-1280-80.jpg">
                                                            <media:credit><![CDATA[Tom&#039;s Hardware]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Quantum battery]]></media:description>                                                            <media:text><![CDATA[Quantum battery]]></media:text>
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                                                            <title><![CDATA[ Meta's new MTIA lineup joins hyperscalers' unified push for dedicated inferencing chips — companies diversify AI chips in effort to diversify from sole reliance on Nvidia ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/metas-mtia-chip-lineup-joins-hyperscaler-push-to-replace-nvidia-at-inference</link>
                                                                            <description>
                            <![CDATA[ As Meta introduces its lineup of new AI chips, the company joins other tech giants in diversifying the AI accelerators used for specific workloads, and says that mainstream GPUs built for large-scale pre-training are less cost-effective for inference workloads. ]]>
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                                                                        <pubDate>Mon, 16 Mar 2026 18:19:56 +0000</pubDate>                                                                                                                                <updated>Fri, 20 Mar 2026 13:59:25 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/SeB9TjZd9YKNR5bhshrE4j-1280-80.png">
                                                            <media:credit><![CDATA[Meta]]></media:credit>
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                                                            <title><![CDATA[ Intel's roadmaps examined  — 14A, Nova Lake, Diamond Rapids & AI accelerator push  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-chip-roadmap-2026-2028</link>
                                                                            <description>
                            <![CDATA[ Intel's CPU roadmap is unlike any the company has published in recent years, because its manufacturing ambitions and its product launches have to succeed simultaneously. ]]>
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                                                                        <pubDate>Mon, 16 Mar 2026 14:29:44 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/zpfmSdxDgRQ2Lyi93oxRt-1280-80.jpg">
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                                                            <title><![CDATA[ STMicro to deploy humanoid robots to its legacy fabs in Europe — over 100 humanoid robots to be used for routine and physically demanding tasks in fight for efficiency ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/stmicro-to-deploy-humanoid-robots-to-its-legacy-fabs-in-europe-over-100-humanoid-robots-to-be-used-for-routine-and-physically-demanding-tasks-in-fight-for-efficiency</link>
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                            <![CDATA[ As cheap Chinese chips threaten to invade various sectors of the economy in Europe, STMicroelectronics is on track to improve the efficiency of its own fabs ]]>
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                                                                        <pubDate>Mon, 16 Mar 2026 11:56:08 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
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                                                            <title><![CDATA[ Elon Musk says his chipmaking 'Terafab Project' venture will launch in seven days — Musk's latest moonshot multi-billion project launches on a Saturday ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-says-his-terafab-project-chipmaking-venture-will-launch-in-seven-days-musks-latest-moonshot-multi-billion-project-launches-on-a-saturday</link>
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                            <![CDATA[ Elon Musk plans to start his 'Terafab Project' semiconductor production venture in a week. ]]>
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                                                                        <pubDate>Sun, 15 Mar 2026 11:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/wS6jkGXv2vnZpFsMSa6kZN-1280-80.jpg">
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                                                            <title><![CDATA[ IBM and Lam's new partnership paves the way toward sub-1nm logic using High-NA EUV — Albany lab to pioneer dry resist process integration  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ibm-and-lam-team-up-on-high-na-euv</link>
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                            <![CDATA[ Under the new agreement, the focus will shift to validating full process flows for nanosheet and nanostack device architectures and backside power delivery. ]]>
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                                                                        <pubDate>Thu, 12 Mar 2026 17:14:55 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MbJuoNWEqCE8C6u4onRCcA-1280-80.jpg">
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                                                            <title><![CDATA[ Meta reveals four new MTIA chips built for AI inference — to be released on a six-month cadence ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/meta-reveals-four-new-mtia-chips-built-for-ai-inference</link>
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                            <![CDATA[ All four chips have been developed in partnership with Broadcom and are scheduled for deployment within the next two years. ]]>
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                                                                        <pubDate>Thu, 12 Mar 2026 10:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/SeB9TjZd9YKNR5bhshrE4j-1280-80.png">
                                                            <media:credit><![CDATA[Meta]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Meta MTIA]]></media:description>                                                            <media:text><![CDATA[Meta MTIA]]></media:text>
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                                                            <title><![CDATA[ IBM and Lam Research team up on High NA EUV dry resist to push chip scaling past 1nm ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ibm-and-lam-research-team-up-on-high-na-euv</link>
                                                                            <description>
                            <![CDATA[ The two companies have worked together for more than a decade, with IBM unveiling what it described as the world's first 2nm node chip in 2021 as part of the partnership. ]]>
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                                                                        <pubDate>Wed, 11 Mar 2026 14:48:23 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/xK2nhXf72MxBA8MfKcgZge-1280-80.png">
                                                            <media:credit><![CDATA[IBM Research]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[IBM-Lam partnership PR photo]]></media:description>                                                            <media:text><![CDATA[IBM-Lam partnership PR photo]]></media:text>
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                                                            <title><![CDATA[ Ambitious semiconductor enthusiast builds DIY 'class 100 cleanroom' in his garden shed — contains a plasma etcher, vacuum furnace, and even custom software-driven lithography machine ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ambitious-semiconductor-enthusiast-builds-diy-class-100-cleanroom-in-his-garden-shed-contains-a-plasma-etcher-vacuum-furnace-and-even-custom-software-driven-lithography-machine</link>
                                                                            <description>
                            <![CDATA[ A TechTuber called Dr. Semiconductor has successfully created a ‘Class 100 cleanroom’  (ISO 5) in his garden shed. ]]>
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                                                                        <pubDate>Wed, 11 Mar 2026 10:50:10 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/CJ8J8GveMHjqyn8pu2FoGh-1280-80.jpg">
                                                            <media:credit><![CDATA[Dr. Semiconductor ]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[DIY cleanroom in a shed]]></media:description>                                                            <media:text><![CDATA[DIY cleanroom in a shed]]></media:text>
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                                                            <title><![CDATA[ China's top chip execs claim ASML alternative 'small, fragmented, and weak' — Chinese industry titans call for national effort to invest in advanced chipmaking tools ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chinas-top-chip-execs-admit-fragmentation-is-undermining-the-countrys-asml-alternative</link>
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                            <![CDATA[ China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML. ]]>
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                                                                        <pubDate>Thu, 05 Mar 2026 18:09:39 +0000</pubDate>                                                                                                                                <updated>Thu, 05 Mar 2026 18:15:47 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/iiBPT3tVuXkSdD4xCKSR9m-1280-80.png">
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                                                            <title><![CDATA[ Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-ceo-recognizes-its-18a-node-for-external-customers-as-18a-p-gets-inbound-interest-company-cites-increasing-yields</link>
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                            <![CDATA[ Intel sees 'inbound interest' for 18A-P process technology despite 18A process variability. ]]>
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                                                                        <pubDate>Thu, 05 Mar 2026 11:21:51 +0000</pubDate>                                                                                                                                <updated>Thu, 05 Mar 2026 11:25:39 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/fJDMeVAgTgJrUtvsaJJdYe-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
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                                                            <title><![CDATA[ ISSCC 2026: Rebellions details industry's first quad-chiplet AI solution with UCIe interconnects — claims Rebel100 AI accelerator equals the power of Nvidia H200 with lower power envelope ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/isscc-2026-rebellions-ucie-rebel-100</link>
                                                                            <description>
                            <![CDATA[ Rebellions details how it developed one of the world's first quad-chiplet AI accelerator with UCIe interconnects and how it did not use all of the technologies that the UCIe 1.0 specifications includes. ]]>
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                                                                        <pubDate>Mon, 02 Mar 2026 16:03:23 +0000</pubDate>                                                                                                                                <updated>Tue, 03 Mar 2026 19:57:43 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/rWdHT5SLeyUQVnKviKvckN-1280-80.jpg">
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                                                            <title><![CDATA[ ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count — 'We are actually matching the performance of the more expensive and complex GB200' ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/inside-the-instinct-mi355x</link>
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                            <![CDATA[ Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor, ]]>
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                                                                        <pubDate>Fri, 27 Feb 2026 15:42:05 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/KwPfqTmxLYhxsfwpKJmimK-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / Bloomberg]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Lisa Su at CES 2026]]></media:description>                                                            <media:text><![CDATA[Lisa Su at CES 2026]]></media:text>
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                                                            <title><![CDATA[ Rapidus secures $1.7 billion from Japan’s government and private investors for 2nm chip production — company says it is in active discussions with more than 60 potential customers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/rapidus-secures-1-7-billion-from-japans-government-and-private-investors</link>
                                                                            <description>
                            <![CDATA[ Under the arrangement, the government will initially hold roughly 10% of Rapidus's voting shares and the majority of its stake in non-voting stock. ]]>
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                                                                        <pubDate>Fri, 27 Feb 2026 13:51:15 +0000</pubDate>                                                                                                                                <updated>Mon, 02 Mar 2026 23:30:57 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/CNRC5mKbBV9kPUbFeSa6wC-1280-80.jpg">
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                                                            <title><![CDATA[ Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips — 20% gain in photoresist improvement from increased oxygen concentration ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/imecs-new-post-exposure-bake-method-speeds-up-euv-chipmaking-tools-boosting-production-for-the-most-advanced-chips-20-percent-gain-in-photoresist-improvement-from-increased-oxygen-concentration</link>
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                            <![CDATA[ Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings. ]]>
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                                                                        <pubDate>Fri, 27 Feb 2026 11:37:39 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Feb 2026 13:58:08 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/qdjf7gmQx8hqLLbHXFrNwN-1280-80.jpg">
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                                                                                                                                                                        <media:description><![CDATA[A photograph of the BEFORCE tool, short for ‘Bake and EUV system with FTIR&lt;br&gt;and Outgas measurement for Resist evaluation in Controlled Environment’.]]></media:description>                                                            <media:text><![CDATA[Imec]]></media:text>
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                                                            <title><![CDATA[ Intel Foundry boss leaves for Qualcomm — Naga Chandrasekaran takes charge of the unit ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-foundry-boss-leaves-for-qualcomm-naga-chandrasekaran-takes-charge-of-the-unit</link>
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                            <![CDATA[ Naga Chandrasekaran promoted to Chief Technology and Operations Officer as well as the general manager of Intel Foundry responsible for development of advanced process technologies and day-to-day operations. ]]>
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                                                                        <pubDate>Thu, 26 Feb 2026 20:46:38 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Feb 2026 15:33:59 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/kG5MBVaExJPkbMPYX84SQM-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
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                                                            <title><![CDATA[ Chipmakers still suffering from rare earth shortages, says report — US-China trade truce apparently still hasn’t eased pressures despite agreement taking place in October last year ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chipmakers-still-suffering-from-rare-earth-shortages-says-report-us-china-trade-truce-apparently-still-hasnt-eased-pressures-despite-agreement-taking-place-in-october-last-year</link>
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                            <![CDATA[ Sources told Reuters that some U.S. chipmaking firms are running low on scandium — a crucial rare earth material for making 5G chips — as they suffer delays from acquiring export licenses from Beijing. ]]>
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                                                                        <pubDate>Thu, 26 Feb 2026 12:48:17 +0000</pubDate>                                                                                                                                <updated>Thu, 26 Feb 2026 14:16:10 +0000</updated>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/cRBzkRhDrFM2F9aiddrVBD-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Annealed neodymium]]></media:description>                                                            <media:text><![CDATA[Annealed neodymium]]></media:text>
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                                                            <title><![CDATA[ China to increase leading-edge chip output by 5x in two years, report claims — aims to lift 7nm and 5nm production to 100,000 wafers per month, targeting half a million monthly by 2030 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-to-increase-leading-edge-chip-output-by-5x-in-two-years-report-claims-aims-to-lift-7nm-and-5nm-production-to-100-000-wafers-per-month-targeting-half-a-million-monthly-by-2030</link>
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                            <![CDATA[ Chinese foundries looking to increase 7nm and below capacity to 100,000 wafer starts per month in one or two years, says Nikkei. ]]>
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                                                                        <pubDate>Wed, 25 Feb 2026 15:12:20 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/5Mq4J9jfCyPqV9qsyhUWe8-1280-80.jpg">
                                                            <media:credit><![CDATA[SMIC]]></media:credit>
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                                                            <title><![CDATA[ US gov't warned Nvidia CEO Jensen Huang, Tim Cook, and Lisa Su that China could invade Taiwan by 2027 — Apple CEO reportedly said he sleeps 'with one eye open' ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/us-govt-warned-nvidia-ceo-jensen-huang-tim-cook-and-lisa-su-that-china-could-invade-taiwan-by-2027-apple-ceo-reportedly-said-he-sleeps-with-one-eye-open</link>
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                            <![CDATA[ A new investigative report from The New York Times reveals that, in July 2023, senior US intelligence officials privately briefed some of the tech industry's most powerful executives on classified assessments regarding China and Taiwan. ]]>
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                                                                        <pubDate>Tue, 24 Feb 2026 16:15:41 +0000</pubDate>                                                                                                                                <updated>Tue, 24 Feb 2026 16:16:45 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Zak Killian ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/rRkrXA6GgwA7rCfhPBp6E7-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Tim Cook, Jensen Huang, and Christine Lagarde listening to a speech by Donald Trump at the WEF.]]></media:description>                                                            <media:text><![CDATA[Tim Cook, Jensen Huang, and Christine Lagarde listening to a speech by Donald Trump at the WEF.]]></media:text>
                                <media:title type="plain"><![CDATA[Tim Cook, Jensen Huang, and Christine Lagarde listening to a speech by Donald Trump at the WEF.]]></media:title>
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                                                            <title><![CDATA[ ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-makes-breakthrough-in-euv-chipmaking-tech-plans-to-increase-speed-by-50-percent-by-2030-new-1-000-watt-light-source-fires-three-lasers-at-100-000-tin-droplets-every-second</link>
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                            <![CDATA[ ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond. ]]>
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                                                                        <pubDate>Tue, 24 Feb 2026 12:01:57 +0000</pubDate>                                                                                                                                <updated>Wed, 25 Feb 2026 10:24:40 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MqQcLuXtcS9FPhQiZeDavC-1280-80.jpg">
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                                                            <title><![CDATA[ The state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress — examining the original 'Made in China 2025' initiative ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/the-state-of-chinas-decade-long-semiconductor-push-still-a-decade-behind-despite-hundreds-of-billions-spent-and-significant-progress-examining-the-original-made-in-china-2025-initiative</link>
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                            <![CDATA[ After 10 years and hundreds of billions of investments, China's semiconductor supply chain is still decades behind chip supply chain in America and Taiwan. ]]>
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                                                                        <pubDate>Fri, 20 Feb 2026 11:01:27 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/RmKSV8SvrYbNQgaijK8PEL-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[SMIC Shenzhen]]></media:description>                                                            <media:text><![CDATA[SMIC Shenzhen]]></media:text>
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                                                            <title><![CDATA[ TSMC considers an additional $100 billion investment into Arizona fabs to bolster American chipmaking efforts — move would help TSMC's chips avoid tariffs due to local production ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-considers-an-additional-usd100-billion-investment-into-arizona-fabs-to-bolster-american-chipmaking-efforts-move-would-help-tsmcs-chips-avoid-tariffs-due-to-local-production</link>
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                            <![CDATA[ TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules. ]]>
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                                                                        <pubDate>Mon, 16 Feb 2026 15:36:58 +0000</pubDate>                                                                                                                                <updated>Mon, 09 Mar 2026 16:13:40 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/j3Ro53SeHZN9ixgrWeXRDX-1280-80.jpg">
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                                                            <title><![CDATA[ Chinese scientists 3D print tiny items in half a second using holographic light fields — scientists precision fabricate complex millimeter-scale objects in record time ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/3d-printing/chinese-scientists-3d-print-tiny-items-in-half-a-second-using-holographic-light-fields-scientists-precision-fabricate-complex-millimeter-scale-objects-in-record-time</link>
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                            <![CDATA[ A team of scientists have revealed a new technique for the super-high-speed 3D printing of complex objects. ]]>
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                                                                        <pubDate>Sun, 15 Feb 2026 14:45:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[3D Printing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/sMKdN7Mg4amBja6hsg83QS-1280-80.jpg">
                                                            <media:credit><![CDATA[Tsinghua University research paper on Nature]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[DISH 3D printing tech]]></media:description>                                                            <media:text><![CDATA[DISH 3D printing tech]]></media:text>
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                                                            <title><![CDATA[ iFixIt calls BMW’s new anti-consumer security screws 'a logo-shaped middle finger to right to repair,' Adafruit 3D prints a solution — BMW's connector reverse engineered using patent filing as a design blueprint ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/manufacturing/ifixit-calls-bmws-new-anti-consumer-security-screws-a-logo-shaped-middle-finger-to-right-to-repair-adafruit-3d-prints-a-solution-bmws-connector-reverse-engineered-using-patent-filing-as-a-design-blueprint</link>
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                            <![CDATA[ Automaker BMW has filed a patent for a new fastener which takes design cues from the its iconic segmented roundel logo. but it has been accused of creating this design for service and repair gatekeeping. ]]>
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                                                                        <pubDate>Sat, 14 Feb 2026 11:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Manufacturing]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/zUtYuskC85Mya2wyUii52j-1280-80.jpg">
                                                            <media:credit><![CDATA[Robocat]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[BMW wants to patent this logo-inspired fastener]]></media:description>                                                            <media:text><![CDATA[BMW wants to patent this logo-inspired fastener]]></media:text>
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                                                            <title><![CDATA[ Rapidus targets mass 2nm chip production in 2027, quadruples capacity ramp up — company plans to scale to 25,000 wafer starts per month in just one year ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/rapidus-targets-2nm-mass-production-in-2027-with-a-four-times-capacity-ramp</link>
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                            <![CDATA[ Japan’s state-backed foundry Rapidus plans to begin production of 2nm-class semiconductors in the second half of its fiscal year 2027, with full-scale production expected in 2028. ]]>
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                                                                        <pubDate>Fri, 13 Feb 2026 16:53:21 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/6XNsxLNku9zF5v8CmnRGAd-1280-80.jpg">
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                                                            <title><![CDATA[ Tachyum forced to shutter R&D office due to unpaid rent, wages, and taxes — firm still claims forthcoming Prodigy chip will have a 21x performance leap on Nvidia Rubin Ultra ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tachyum-forced-to-shutter-r-and-d-office-due-to-unpaid-rent-wages-and-taxes-firm-still-claims-forthcoming-prodigy-chip-will-have-a-21x-performance-leap-on-nvidia-rubin-ultra</link>
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                            <![CDATA[ Tachyum forced to vacate R&D office due to unpaid rent, wages, and taxes ]]>
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                                                                        <pubDate>Fri, 13 Feb 2026 10:33:52 +0000</pubDate>                                                                                                                                <updated>Fri, 13 Feb 2026 15:33:11 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Bruno Ferreira ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/UEJthTbqFTfLBjfMo8CRwb-1280-80.jpg">
                                                            <media:credit><![CDATA[Tachyum]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Tachyum]]></media:description>                                                            <media:text><![CDATA[Tachyum]]></media:text>
                                <media:title type="plain"><![CDATA[Tachyum]]></media:title>
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