<![CDATA[ Latest from Tom's Hardware in Manufacturing ]]> https://www.tomshardware.com/tech-industry/manufacturing Mon, 01 Jun 2026 14:04:50 +0000 en <![CDATA[ Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led to all 3,600 staff being evacuated ]]> https://www.tomshardware.com/tech-industry/semiconductors/seven-hospitalized-after-toxic-gas-fire-at-sk-hynix-advanced-memory-plant-cheongju-4th-campus-incident-today-led-to-all-3-600-staff-being-evacuated dADiHx9qvmfB7cKnyLFUdN Mon, 01 Jun 2026 14:04:50 +0000 <![CDATA[ TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China's dependence on US chipmakers ]]> https://www.tomshardware.com/tech-industry/semiconductors/tiktok-owner-bytedance-is-reportedly-developing-its-own-custom-ai-cpus-company-looks-to-ease-chinas-dependence-on-us-chipmakers iPRkAbiLdjxxXqVodXjz7 Fri, 29 May 2026 16:24:49 +0000 <![CDATA[ Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing strategies and IP ]]> https://www.tomshardware.com/tech-industry/semiconductors/the-trailing-edge-foundry-roadmap-examined BY3oQroZdkMr4EB95eP8B4 Thu, 28 May 2026 16:16:35 +0000 <![CDATA[ Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management ]]> https://www.tomshardware.com/tech-industry/semiconductors/peking-university-builds-3d-chip-design-tool-tailored-to-huaweis-logicfolding-architecture pyny2hNLQsbPpEc3M2vz4m Thu, 28 May 2026 11:10:00 +0000 <![CDATA[ China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues ]]> https://www.tomshardware.com/tech-industry/semiconductors/china-certifies-nine-domestic-ai-chips-for-government-procurement jxzFMWvsMd6pRayLjXNb6n Wed, 27 May 2026 12:28:46 +0000 <![CDATA[ SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers ]]> https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-unveils-ihbm-thermal-architecture-that-cools-ai-memory-at-the-source-integrated-cooling-elements-inside-hbm-interface-cut-thermal-resistance-by-30-percent-target-next-gen-hbm5-accelerators-and-dense-ai-data-centers L8c64SuBJpDRzJfjArVMy Tue, 26 May 2026 11:49:14 +0000 Tue, 26 May 2026 13:18:24 +0000 <![CDATA[ Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines ]]> https://www.tomshardware.com/tech-industry/semiconductors/imec-builds-worlds-first-high-na-euv-fabricated-quantum-dot-qubit-device-breakthrough-could-pull-quantum-computing-onto-the-same-manufacturing-roadmap-as-next-gen-ai-processors-compressing-timelines ycgawUDPmsyeuPz5nhE7rE Mon, 25 May 2026 15:27:00 +0000 Tue, 26 May 2026 09:24:06 +0000 <![CDATA[ Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law ]]> https://www.tomshardware.com/tech-industry/semiconductors/huawei-claims-sanctions-busting-breakthrough-with-1-4nm-class-chips-by-2031-claims-55-percent-higher-transistor-density-firm-claims-new-logicfolding-chip-architecture-can-bypass-euv-restrictions-introduces-tau-scaling-law-to-replace-moores-law 43HroesXXoiEK6kKiEC85c Mon, 25 May 2026 13:10:31 +0000 <![CDATA[ Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt ]]> https://www.tomshardware.com/tech-industry/samsungs-bonus-dispute-spreads-to-chip-packaging-divisions-threatening-hbm-delivery-schedules i4VUQHDE9N95oAy3HNEug7 Sat, 23 May 2026 13:49:57 +0000 <![CDATA[ The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond ]]> https://www.tomshardware.com/tech-industry/semiconductors/custom-ai-asics-examined-from-broadcom-to-mtia FC6Yw4sks9JBxCWWk8V646 Thu, 21 May 2026 12:43:38 +0000 Thu, 21 May 2026 12:48:28 +0000 <![CDATA[ AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap ]]> https://www.tomshardware.com/tech-industry/semiconductors/amd-begins-production-ramp-of-256-core-epyc-venice-on-tsmcs-2nm-node JZqYQF9wNudrDehKxRuq8R Thu, 21 May 2026 12:12:15 +0000 Thu, 21 May 2026 13:41:40 +0000 <![CDATA[ Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for critical October PDK release ]]> https://www.tomshardware.com/tech-industry/semiconductors/intel-kicks-off-development-on-next-decade-10a-and-7a-process-technologies-14a-node-remains-on-track-for-critical-october-pdk-release GeTnWfQK49EYUc7PxCVhZn Wed, 20 May 2026 12:49:12 +0000 <![CDATA[ SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins ]]> https://www.tomshardware.com/tech-industry/semiconductors/smic-founder-and-amec-ceo-urge-chinese-fabs-to-test-domestic-chip-tools-on-production-lines RDxsEKRdNK9paeiezVbNKb Tue, 19 May 2026 16:01:15 +0000 <![CDATA[ Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air ]]> https://www.tomshardware.com/tech-industry/semiconductors/russias-mikron-is-selling-framed-test-wafers-with-up-to-120-000-processors-as-souvenirs-12-designs-priced-around-usd170-each-sold-alongside-usd2-vials-of-cleanroom-air UXBRLqMWFiARAmdF2v9UnA Sun, 17 May 2026 12:55:00 +0000 <![CDATA[ Trump calls $14 billion Taiwan arms deal a 'negotiating chip' with China after Xi said Taiwan issue could lead to 'clashes and even conflicts' — Trump says 'Taiwan would be very smart to cool it a little bit' ]]> https://www.tomshardware.com/tech-industry/trump-calls-taiwan-arms-deal-a-negotiating-chip-with-china B6JV296RxfMVy3p3dPPNxd Sat, 16 May 2026 14:40:24 +0000 <![CDATA[ Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond ]]> https://www.tomshardware.com/tech-industry/semiconductors/leading-edge-foundry-roadmaps-for-tsmc-intel-and-samsung-outlining-the-path-to-1-4nm-nodes-and-beyond ywM5W9e6g3vC2xT8byAw4U Thu, 14 May 2026 11:55:32 +0000 <![CDATA[ TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa rules ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-allocates-usd20-billion-to-arizona-expansion-project-faces-water-and-labor-shortages-complicated-by-visa-rules GcQSFPuXM77WUUD4ZKRr8K Tue, 12 May 2026 14:53:55 +0000 <![CDATA[ NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars ]]> https://www.tomshardware.com/tech-industry/semiconductors/nasa-partners-with-microchip-to-build-next-generation-spaceflight-chips-with-100x-the-power-of-current-offerings-chip-designed-to-withstand-radiation-for-extended-missions-on-the-moon-and-mars ruRzJQeMW2R9267Hh9VAzN Tue, 12 May 2026 11:11:26 +0000 <![CDATA[ Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration ]]> https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-shares-surge-to-all-time-high-on-reports-of-intel-emib-partnership tverasTHgt8PAc7wfSWCrh Mon, 11 May 2026 11:08:28 +0000 <![CDATA[ Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary agreement for Intel to make processors for Cupertino ]]> https://www.tomshardware.com/tech-industry/semiconductors/apple-reportedly-strikes-deal-for-intel-to-make-some-of-its-chips-two-tech-giants-reached-a-preliminary-agreement-for-intel-to-make-processors-for-cupertino DabcPXFNiSEDWSjniKhxw9 Fri, 08 May 2026 18:09:03 +0000 Fri, 08 May 2026 18:09:07 +0000 <![CDATA[ Global semiconductor sales hit nearly $300 billion in Q1 2026 — chips are on track to top $1 trillion for this year, says report ]]> https://www.tomshardware.com/tech-industry/semiconductors/global-semiconductor-sales-hit-nearly-usd300-billion-in-q1-2026-chips-are-on-track-to-top-usd1-trillion-for-this-year-says-report EYTHDPRiWmSZZuQZXdUTcX Wed, 06 May 2026 10:00:00 +0000 <![CDATA[ Apple considering Intel and Samsung for US chip production, report claims — consumer electronics giant looks to diversify supply chain amid chip shortages ]]> https://www.tomshardware.com/tech-industry/semiconductors/apple-considering-intel-and-samsung-for-us-chip-production-report-claims-consumer-electronics-giant-looks-to-diversify-supply-chain-amid-chip-shortages PGYGCNLrro6BnV8BA5pFwL Tue, 05 May 2026 12:30:03 +0000 <![CDATA[ China pushes for 70% homegrown silicon wafer use as domestic firm ramps up 12-inch production — government seeking to localize critical chip supply chain amid AI boom and export restrictions ]]> https://www.tomshardware.com/tech-industry/semiconductors/china-pushes-for-70-percent-homegrown-silicon-wafer-use-as-domestic-firm-ramps-up-12-inch-production-government-seeking-to-localize-critical-chip-supply-chain-amid-ai-boom-and-export-restrictions HcBCWnbxYZACBvsYJgaPXV Tue, 05 May 2026 11:06:00 +0000 <![CDATA[ ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond ]]> https://www.tomshardware.com/tech-industry/semiconductors/asml-lithograpy-roadmap-examined-from-duv-to-hyper-na 7ed3LXXnYBaagaiv6Eox85 Fri, 01 May 2026 11:30:00 +0000 Mon, 04 May 2026 11:44:09 +0000 <![CDATA[ Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50% ]]> https://www.tomshardware.com/tech-industry/semiconductors/intel-details-18a-p-process-node-touts-higher-performance-lower-power-and-better-thermals-9-percent-more-performance-thermal-conductivity-improved-by-50-percent w7939LKmvd7KTJE8zCVAj7 Fri, 01 May 2026 11:00:00 +0000 <![CDATA[ TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-soic-3d-stacking-roadmap-outlines-path-from-6-micron-pitches-today-to-4-5-micron-in-2029-fujitsus-monaka-cpu-to-benefit-from-face-to-face-chiplet-stacking 6kZ8tvMfTvVegPYuJgUsTg Wed, 29 Apr 2026 13:26:22 +0000 <![CDATA[ Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale — network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators ]]> https://www.tomshardware.com/tech-industry/semiconductors/google-splits-its-tpu-into-two-chips-for-the-first-time-with-training-and-inference-variants tFhyFYMQWTBHFvxPFLMzrF Mon, 27 Apr 2026 17:12:59 +0000 Mon, 27 Apr 2026 18:22:37 +0000 <![CDATA[ TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and additional memory bandwidth jump ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmcs-details-next-gen-cowos-roadmap-over-14-reticle-packages-and-48x-leap-in-compute-power-expected-by-2029-massive-size-enables-24-hbm5e-stacks-and-additional-memory-bandwidth-jump TLEw3GLGo7qwNMuRwf9CrK Mon, 27 Apr 2026 11:56:06 +0000 <![CDATA[ Bolt Graphics tapes out its first Zeus GPU test chip on TSMC 12nm — firm touts 17x lower cost of compute ]]> https://www.tomshardware.com/tech-industry/semiconductors/bolt-graphics-tapes-out-its-first-zeus-gpu-test-chip-on-tsmc-12nm ryLfbkJ9bRvmvGXcazWTXZ Thu, 23 Apr 2026 10:20:00 +0000 <![CDATA[ Elon Musk says his TeraFab facilities will use Intel's 14A process technology to make AI chips — SpaceX will be responsible for high-volume chip manufacturing in likely Intel tech licensing deal ]]> https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-says-terafab-will-use-intels-14a-process-technology-to-make-ai-chips-spacex-will-be-responsible-for-high-volume-chip-manufacturing-in-liekly-intel-tech-licensing-deal cb6i67PLPoQLMLKRXQMjpS Thu, 23 Apr 2026 01:24:43 +0000 Thu, 23 Apr 2026 01:30:27 +0000 <![CDATA[ TSMC unveils process technology roadmap through 2029 — A12, A13, N2U announced, A16 slips to 2027 ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-unveils-process-technology-roadmap-through-2029-a12-a13-n2u-announced-a16-slips-to-2027 zFxjuPkJJCr79WVEdRGNND Wed, 22 Apr 2026 20:44:57 +0000 Thu, 23 Apr 2026 01:29:28 +0000 <![CDATA[ Congress moves to strip the DoC of chip-export discretion with the MATCH Act — DUV lithography machines among those targeted in chipmaking tool crackdown ]]> https://www.tomshardware.com/tech-industry/semiconductors/congress-moves-to-strip-commerce-of-chip-export-discretion-with-the-match-act CKLu89mfDWPzAtoeehz4MN Wed, 22 Apr 2026 11:30:00 +0000 <![CDATA[ US lawmakers amend new restrictions on Chinese chipmakers — MATCH Act's blanket restrictions removed from select chipmaking tools ]]> https://www.tomshardware.com/tech-industry/semiconductors/us-lawmakers-amend-new-restrictions-on-chinese-chipmakers-match-acts-blanket-restrictions-removed-from-select-chipmaking-tools BqBUUt69EvUiJgdpdRFTbM Fri, 17 Apr 2026 18:00:25 +0000 <![CDATA[ Intel hires tenured Samsung exec to lead Foundry Services — signals company focus on winning business from potential Foundry suitors ]]> https://www.tomshardware.com/tech-industry/semiconductors/intel-hires-tenured-samsung-exec-to-lead-foundry-services-signals-company-focus-on-winning-business-from-potential-foundry-suitors 3G6swYmSS7XK5Q6Er7HwqY Fri, 17 Apr 2026 13:13:48 +0000 <![CDATA[ Elon Musk pushing forward with Terafab at 'light speed' — staff reaching out to various suppliers and are reportedly willing to pay a premium to gain priority ]]> https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-pushing-forward-with-terafab-at-ight-speed-staff-reaching-out-to-various-suppliers-and-are-reportedly-willing-to-pay-a-premium-to-gain-priority AXZz7Tfyh4HFXW5fsy9wP3 Fri, 17 Apr 2026 13:07:34 +0000 Fri, 17 Apr 2026 13:24:23 +0000 <![CDATA[ TSMC ups revenue guidance and CapEx, buoyed by 'multiyear AI megatrend' — warns Middle East conflict may impact profitability as costs increase ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-ups-revenue-guidance-and-capex-buoyed-by-multiyear-ai-megatrend-warns-middle-east-conflict-may-impact-profitability-as-costs-increase 8xW8u4uwTdnnJJjSxsRKNU Fri, 17 Apr 2026 12:00:00 +0000 <![CDATA[ TSMC warns of Intel Foundry's growing prowess during the company's latest earnings call — 'We view Intel as our formidable competitor and do not underestimate them' ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-warns-of-intel-foundrys-growing-prowess-during-the-companys-latest-earnings-call-we-view-intel-as-our-formidable-competitor-and-do-not-underestimate-them nwsugZQok4rCMjZkuxWXRd Fri, 17 Apr 2026 09:58:04 +0000 <![CDATA[ YMTC's third Wuhan fab clears Beijing's 50% local tooling threshold as two more are planned — move positions company toward 3D NAND production to capitalize on wafer bonding strengths ]]> https://www.tomshardware.com/tech-industry/semiconductors/ymtcs-third-wuhan-fab-clears-beijings-50-percent-domestic-tooling-threshold-as-two-more-are-planned ZNgPaBNTBg6bbZhYFAjnKZ Wed, 15 Apr 2026 15:40:56 +0000 Wed, 15 Apr 2026 15:58:34 +0000 <![CDATA[ China's premiere memory-maker YMTC plans two additional Wuhan fabs using homegrown chipmaking tools — Phase 3 crosses 50% domestic tooling threshold ]]> https://www.tomshardware.com/tech-industry/semiconductors/ymtc-planms-two-additional-wuhan-fabs h3Dj82wgmFAiXptpETMjgL Tue, 14 Apr 2026 14:31:08 +0000 Tue, 14 Apr 2026 14:38:46 +0000 <![CDATA[ Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited,EMIB-T is preparing for advanced AI accelerator designs ]]> https://www.tomshardware.com/tech-industry/semiconductors/intels-emib-t-heads-for-fab-rollout-this-year hbfWSogC8qvBzKdZCC8J3T Thu, 09 Apr 2026 15:09:42 +0000 <![CDATA[ China intensifies efforts to poach semiconductor talent from Taiwan, claims report — international restrictions motivate illicit efforts to obtain talent and equipment ]]> https://www.tomshardware.com/tech-industry/semiconductors/china-intensifies-efforts-to-poach-semiconductor-talent-from-taiwan-claims-report-international-restrictions-motivate-illicit-efforts-to-obtain-talent-and-equipment q63K7ACEh6aUKTNgHt2REA Wed, 08 Apr 2026 10:05:58 +0000 <![CDATA[ Intel joins Elon Musk's TeraFab project — 'Intel is proud to join the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology' ]]> https://www.tomshardware.com/tech-industry/semiconductors/intel-joins-elon-musks-terafab-project-intel-is-proud-to-join-the-terafab-project-with-spacex-xai-and-tesla-to-help-refactor-silicon-fab-technology Y4c2XZUsEj3z82hNbMob3P Tue, 07 Apr 2026 15:34:11 +0000 <![CDATA[ Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year ]]> https://www.tomshardware.com/tech-industry/semiconductors/intel-reportedly-in-talks-with-google-and-amazon-over-advanced-packaging R9v4bPm2qH4kadaKa6jpzL Tue, 07 Apr 2026 10:20:00 +0000 <![CDATA[ US lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China — bipartisan proposal would ban lithography equipment for Huawei, SMIC, and others ]]> https://www.tomshardware.com/tech-industry/semiconductors/u-s-lawmakers-aim-to-ban-export-of-duv-chipmaking-and-etching-tools-to-leading-firms-in-china-bipartisan-proposal-would-ban-lithography-equipment-for-huawei-smic-and-others 9QRBKuxYcLaGqsLn9P2stN Mon, 06 Apr 2026 19:59:55 +0000 Mon, 06 Apr 2026 20:00:06 +0000 <![CDATA[ TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-reportedly-plans-to-build-12-fabs-four-packaging-facilities-in-arizona-plan-purportedly-part-of-taiwans-agreed-usd500-million-investment-in-the-us YKRchnjUZSTowntfkuUBLX Fri, 03 Apr 2026 11:55:07 +0000 <![CDATA[ Intel buys back 49% stake in Ireland Fab Joint Venture — takes full control over Fab 34 ]]> https://www.tomshardware.com/tech-industry/semiconductors/intel-buys-back-49-percent-stake-in-ireland-fab-jv-gains-full-control-over-fab-34 LLbx2zJbFRWS2jMGjFMZHH Thu, 02 Apr 2026 10:40:00 +0000 <![CDATA[ The global helium shortage is a direct threat to the chipmaking supply chain — disruption impacts critical processes, high-capacity HDDs, and alternative supplies are plagued by delays ]]> https://www.tomshardware.com/tech-industry/semiconductors/the-global-helium-shortage-is-a-direct-threat-to-chipmaking unttriv5VxABSXisR5qMpc Tue, 31 Mar 2026 13:20:26 +0000 Wed, 01 Apr 2026 16:58:09 +0000 <![CDATA[ TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case — former engineer accused of stealing 2nm technical info, faces a total of up to 20 years in prison if found guilty ]]> https://www.tomshardware.com/tech-industry/semiconductors/tsmc-industrial-espionage-saga-heading-to-verdict-next-month-in-unprecedented-taiwan-national-security-act-case-former-engineer-accused-of-stealing-2nm-technical-info-faces-a-total-of-up-to-20-years-in-prison-if-found-guilty AmCZ7Ymv4hzV2dL8L9zTGd Mon, 30 Mar 2026 16:33:29 +0000 <![CDATA[ Analyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an unattainable dream? ]]> https://www.tomshardware.com/tech-industry/semiconductors/analyzing-elon-musks-terafab-a-step-towards-tesla-and-spacexs-partial-vertical-integration-or-an-unattainable-dream zcqyejWUP6Ni6CyCQN9Mwk Mon, 30 Mar 2026 15:51:26 +0000 <![CDATA[ Chinese chip industry leaders admit the country lags five to ten years behind in AI data center chips — AI demand is straining equipment and talent supply ]]> https://www.tomshardware.com/tech-industry/semiconductors/chinese-chip-industry-leaders-say-ai-demand-is-straining-equipment-and-talent-supply QLqzXz7yvSupWaPP3v3mgB Mon, 30 Mar 2026 13:27:40 +0000