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                    <title><![CDATA[ Latest from Tom's Hardware in Tsmc ]]></title>
                <link>https://www.tomshardware.com/tag/tsmc</link>
        <description><![CDATA[ All the latest tsmc content from the Tom's Hardware team ]]></description>
                                    <lastBuildDate>Fri, 03 Apr 2026 11:55:07 +0000</lastBuildDate>
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                                                            <title><![CDATA[ TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-reportedly-plans-to-build-12-fabs-four-packaging-facilities-in-arizona-plan-purportedly-part-of-taiwans-agreed-usd500-million-investment-in-the-us</link>
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                            <![CDATA[ New rumor indicates that TSMC is looking forward to expand its presence in the U.S. to 12 fabs and four packaging facilities. ]]>
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                                                                        <pubDate>Fri, 03 Apr 2026 11:55:07 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
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                                                            <title><![CDATA[ Global semiconductor foundry market hit a record $320 billion in 2025 as TSMC pulled further ahead  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/global-semiconductor-foundry-market-hit-a-record-320-billion-in-2025</link>
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                            <![CDATA[ The global semiconductor foundry market generated a record $320 billion in revenue in 2025, growing 16% year-over-year, according to Counterpoint Research's Foundry Market Supply Tracker. ]]>
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                                                                        <pubDate>Thu, 02 Apr 2026 10:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/4eZrCtk8yyPbygdoere4cc-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC]]></media:description>                                                            <media:text><![CDATA[TSMC]]></media:text>
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                                                            <title><![CDATA[ TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case — former engineer accused of stealing 2nm technical info, faces a total of up to 20 years in prison if found guilty ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-industrial-espionage-saga-heading-to-verdict-next-month-in-unprecedented-taiwan-national-security-act-case-former-engineer-accused-of-stealing-2nm-technical-info-faces-a-total-of-up-to-20-years-in-prison-if-found-guilty</link>
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                            <![CDATA[ One of the three landmark cases involving the theft of trade secrets from TSMC has run through investigative and court proceedings, and a verdict is scheduled for April 27. ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 16:33:29 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Bruno Ferreira) ]]></author>                    <dc:creator><![CDATA[ Bruno Ferreira ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/BgRfzQhj7htYiYMyXELhKa-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Corporate espionage]]></media:description>                                                            <media:text><![CDATA[Corporate espionage]]></media:text>
                                <media:title type="plain"><![CDATA[Corporate espionage]]></media:title>
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                                                            <title><![CDATA[ Elon Musk's Terafab semiconductor project could cost $5 trillion, Bernstein claims — herculean effort would cost more than 70% of the total yearly US government budget ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musks-terafab-semiconductor-project-could-cost-usd5-trillion-bernstein-claims-herculean-effort-would-cost-more-than-70-percent-of-the-total-yearly-us-government-budget</link>
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                            <![CDATA[ To build 1 TW of AI silicon per year, Elon Musk's TeraFab would need to process 22.4 million Rubin Ultra GPU wafers, 2.716 million Vera CPU wafers, and 15.824 million HBM4E wafers annually using from 142 to 358 fabs, according to Bernstein. ]]>
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                                                                        <pubDate>Thu, 26 Mar 2026 10:40:40 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Mar 2026 12:41:33 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XSmGCAUBerwsBhZgUEkxS-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                        <media:description><![CDATA[To build compute chips that consume 1 TW per year, Elon Musk&#039;s TeraFab project will need to operate up to 358 modern fabs worth $5 trillion, according to Bernstein. ]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ Elon Musk says his chipmaking 'Terafab Project' venture will launch in seven days — Musk's latest moonshot multi-billion project launches on a Saturday ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-says-his-terafab-project-chipmaking-venture-will-launch-in-seven-days-musks-latest-moonshot-multi-billion-project-launches-on-a-saturday</link>
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                            <![CDATA[ Elon Musk plans to start his 'Terafab Project' semiconductor production venture in a week. ]]>
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                                                                        <pubDate>Sun, 15 Mar 2026 11:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/wS6jkGXv2vnZpFsMSa6kZN-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ Trump tariff turbulence risks handing TSMC a win over American chip manufacturers — prior exemptions for onshoring manufacturing may hinder the likes of Intel  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/trump-tariff-turbulence-risks-handing-tsmc-a-win-over-american-chip-manufacturers-prior-exemptions-for-onshoring-manufacturing-may-hinder-the-likes-of-intel</link>
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                            <![CDATA[ The Trump Administrations' new sweeping tariffs for all American imports could end up hurting American companies and benefitting their international competition at the same time, thanks to existing tariff carve-outs and rising material costs for U.S. producers. ]]>
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                                                                        <pubDate>Mon, 23 Feb 2026 15:06:46 +0000</pubDate>                                                                                                                                <updated>Thu, 02 Apr 2026 17:24:18 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Jon Martindale ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/j8pwbrHbqua7uuv29932uD-1280-80.jpg">
                                                            <media:credit><![CDATA[Kevin Dietsch via Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Sad looking Trump.]]></media:description>                                                            <media:text><![CDATA[Sad looking Trump.]]></media:text>
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                                                            <title><![CDATA[ TSMC considers an additional $100 billion investment into Arizona fabs to bolster American chipmaking efforts — move would help TSMC's chips avoid tariffs due to local production ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-considers-an-additional-usd100-billion-investment-into-arizona-fabs-to-bolster-american-chipmaking-efforts-move-would-help-tsmcs-chips-avoid-tariffs-due-to-local-production</link>
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                            <![CDATA[ TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules. ]]>
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                                                                        <pubDate>Mon, 16 Feb 2026 15:36:58 +0000</pubDate>                                                                                                                                <updated>Mon, 09 Mar 2026 16:13:40 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/j3Ro53SeHZN9ixgrWeXRDX-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
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                                                            <title><![CDATA[ U.S. government plans tariff exemptions for TSMC, if it follows through on American investment — $165 billion already pledged to increase production capacity, but details of the deal are still murky ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/u-s-government-plans-tariff-exemptions-for-tsmc-if-it-follows-through-on-american-investment-usd165-billion-already-pledged-to-increase-production-capacity-but-details-of-the-deal-are-still-murky</link>
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                            <![CDATA[ Following the announcement of impending chip import tariffs in January, the Trump Administration is now planning to offer major U.S. tech companies like Google, Microsoft, and Amazon the ability to circumvent them.  However, the number of TSMC-made chips exempt from the tariffs may be directly tied to the Taiwanese chipmaker's scale of investment in American operations. ]]>
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                                                                        <pubDate>Wed, 11 Feb 2026 13:23:02 +0000</pubDate>                                                                                                                                <updated>Thu, 02 Apr 2026 17:21:31 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Jon Martindale ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/k5i2cpGKhmrjZokB9b2L2c-1280-80.jpg">
                                                            <media:credit><![CDATA[The Washington Post via Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Donald Trump and TSMC CEO at press conference.]]></media:description>                                                            <media:text><![CDATA[Donald Trump and TSMC CEO at press conference.]]></media:text>
                                <media:title type="plain"><![CDATA[Donald Trump and TSMC CEO at press conference.]]></media:title>
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                                                            <title><![CDATA[ Memory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers — forecasts suggest that 2026 revenue will skyrocket thanks to data center demand ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/memory-makers-are-set-to-earn-usd551-billion-from-the-ai-boom-twice-as-much-as-contract-chip-manufacturers-forecasts-suggest-that-2026-revenue-will-skyrocket-thanks-to-data-center-demand</link>
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                            <![CDATA[ While all makers of microelectronics are set to benefit from the AI supercycle, the memory industry is projected to generate more than twice the revenue of the foundry industry. ]]>
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                                                                        <pubDate>Tue, 10 Feb 2026 18:04:28 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pU95E8pwfvrx8dWfwg7X8M-1280-80.jpg">
                                                            <media:credit><![CDATA[Samsung]]></media:credit>
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                                                            <title><![CDATA[ White House mulling tariff exemptions for Big Tech — Amazon, Google, Microsoft, other AI hyperscalers to be spared worst of import duties with U.S.-Taiwan deal ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/big-tech/white-house-mulling-tariff-exemptions-for-big-tech-amazon-google-microsoft-other-ai-hyperscalers-to-be-spared-worst-of-import-duties-with-u-s-taiwan-deal</link>
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                            <![CDATA[ The White House is considering a tariff carve-out for big AI tech companies, like Amazon, Google, and Microsoft, allowing them to purchase imported AI chips from TSMC without getting slapped with an import tax. ]]>
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                                                                        <pubDate>Tue, 10 Feb 2026 17:32:16 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Big Tech]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/UygtZowxYgbcyDJtKt6u2Z-1280-80.jpg">
                                                            <media:credit><![CDATA[The White House]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[The White House]]></media:description>                                                            <media:text><![CDATA[The White House]]></media:text>
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                                                            <title><![CDATA[ TSMC's board approves $45 billion spending package on new fabs — record sign off signals aggressive expansion to grow capacity ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmcs-board-approves-usd45-billion-spending-package-on-new-fabs-record-sign-off-signals-aggressive-expansion-to-grow-capacity</link>
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                            <![CDATA[ TSMC's board of directors approves spending on new production capacities and promotes a key executive leading the development of A10 fabrication process due in 2030 or later. ]]>
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                                                                        <pubDate>Tue, 10 Feb 2026 14:08:14 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/p2QqhVFP7dTRWfeVBCYBYV-1280-80.jpg">
                                                            <media:credit><![CDATA[tsmc]]></media:credit>
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                                                            <title><![CDATA[ Taiwan rejects possibility of transferring 40% of the island's semiconductor capacity to U.S. — production on Taiwan expected to increase in lockstep with increases in U.S.-based production ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/taiwan-rejects-possibility-of-transferring-40-percent-of-the-islands-semiconductor-capacity-to-u-s-production-on-taiwan-expected-to-increase-in-lockstep-with-increases-in-u-s-based-production</link>
                                                                            <description>
                            <![CDATA[ Taiwan authorities have no problems with TSMC investing in the U.S. as long the bulk of its fabs and leading-edge process technologies remain in Taiwan. ]]>
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                                                                        <pubDate>Mon, 09 Feb 2026 13:42:30 +0000</pubDate>                                                                                                                                <updated>Mon, 09 Feb 2026 14:20:11 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/PGNTDiXGdxuJom9fs2agMB-1280-80.png">
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                                                            <title><![CDATA[ TSMC is on track to have more employees than Intel for the first time in history — TSMC's explosive growth stands in contrast to Intel's rapid contraction ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-is-on-track-to-have-more-employees-than-intel-for-the-first-time-in-history-tsmcs-explosive-growth-stands-in-contrast-to-intels-rapid-contraction</link>
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                            <![CDATA[ After years of job cuts, Intel is about to get behind TSMC in terms of the headcount. ]]>
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                                                                        <pubDate>Fri, 06 Feb 2026 13:43:52 +0000</pubDate>                                                                                                                                <updated>Fri, 06 Feb 2026 16:46:56 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/QZU4LiEEqJKst2rDMTv64b-1280-80.jpg">
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                                                            <title><![CDATA[ Photonics and high-speed data movement is the next big AI bottleneck — following copper, power, DRAM, and NAND ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/photonics-and-high-speed-data-movement-is-the-next-big-ai-bottleneck-following-copper-power-dram-and-nand</link>
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                            <![CDATA[ Generative AI is pushing demand in all areas of the industry, and data interconnects, such as Silicon Photonics, may well be the next big bottleneck that hyperscalers need to be paying attention to. ]]>
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                                                                        <pubDate>Tue, 03 Feb 2026 11:24:19 +0000</pubDate>                                                                                                                                <updated>Tue, 03 Feb 2026 11:24:23 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Chris Stokel-Walker ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/zjF6jBbLk5mt7oCFCxwy9G-1280-80.jpg">
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                                                            <title><![CDATA[ Apple concedes it is constrained by TSMC's supply of advanced chips; storage and memory are also in short supply  — firm isn't projecting supply conditions beyond the second quarter ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/apple-concedes-it-is-constrained-by-tsmcs-supply-of-advanced-chips-storage-and-memory-are-also-in-short-supply-firm-isnt-projecting-supply-conditions-beyond-the-second-quarter</link>
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                            <![CDATA[ As Nvidia is ramping up production of the Rubin platform, other 3nm-class process suffer ]]>
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                                                                        <pubDate>Mon, 02 Feb 2026 20:50:27 +0000</pubDate>                                                                                                                                <updated>Fri, 06 Feb 2026 14:56:26 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/p2QqhVFP7dTRWfeVBCYBYV-1280-80.jpg">
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                                                            <title><![CDATA[ Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place — concerns mount surrounding U.S deals cracking the nation's silicon shield ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ongoing-trade-war-has-tsmc-and-taiwan-stuck-between-a-rock-and-a-hard-place-concerns-mount-surrounding-u-s-deals-cracking-the-nations-silicon-shield</link>
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                            <![CDATA[ The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC. ]]>
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                                                                        <pubDate>Thu, 29 Jan 2026 17:37:29 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Bruno Ferreira ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ZKF8RzvzwTi5U2yW395MGA-1280-80.jpg">
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                                                            <title><![CDATA[ Nvidia CEO denies that US wants to shift 40% of Taiwan's chipmaking capacity to America — Jensen Huang says onshoring is all new capacity, will preserve island nation's silicon shield ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/nvidia-ceo-denies-that-u-s-wants-to-shift-40-percent-of-taiwans-chipmaking-capacity-to-america-jensen-huang-says-onshoring-is-all-new-capacity-will-preserve-island-nations-silicon-shield</link>
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                            <![CDATA[ Nvidia's Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it. ]]>
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                                                                        <pubDate>Thu, 29 Jan 2026 17:36:38 +0000</pubDate>                                                                                                                                <updated>Thu, 29 Jan 2026 17:48:35 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/UgjkTRNxboDmQg66TrDumf-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Jensen Huang]]></media:description>                                                            <media:text><![CDATA[Jensen Huang]]></media:text>
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                                                            <title><![CDATA[ ASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom — China sales lag behind while company cashes in on high-end Twinscan systems ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-projects-usd71-billion-in-revenue-by-2030-as-demand-for-euv-lithography-machines-intensifies-due-to-ai-boom-china-sales-lag-behind-while-company-cashes-in-on-high-end-twinscan-systems</link>
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                            <![CDATA[ ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records. ]]>
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                                                                        <pubDate>Thu, 29 Jan 2026 12:39:22 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EGXamcWxVuFiTc6pCbeE25-1280-80.jpg">
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                                                            <title><![CDATA[ Where to buy AMD's Ryzen 7 9850X3D — the new king of gaming CPUs  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/cpus/where-to-buy-amds-ryzen-7-9850x3d-the-new-king-of-gaming-cpus</link>
                                                                            <description>
                            <![CDATA[ The Ryzen 7 9850X3D processor is AMD's latest CPU release. Here's where you can pick one up. ]]>
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                                                                        <pubDate>Thu, 29 Jan 2026 11:07:36 +0000</pubDate>                                                                                                                                <updated>Thu, 29 Jan 2026 14:49:36 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Stewart Bendle ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Uho6ASJNmbYTG3kKkMBhKX-1280-80.jpg">
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                                                            <title><![CDATA[ U.S. slashes Taiwan tariffs in new semiconductor trade deal — Washington to reduce tariffs to 15% in exchange for $500 billion stateside manufacturing investment ]]></title>
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                            <![CDATA[ The U.S. and Taiwan trade deal will reduce tariffs to 15% from 20%. It will also pour $250 billion in direct investments in U.S. chip manufacturing, as well as another $250 billion in credit guarantees to Taiwanese tech companies ]]>
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                                                                        <pubDate>Fri, 16 Jan 2026 12:32:15 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/4rNxKxgn7WreaLdrFacyYa-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC 'very nervous' about AI bubble concerns despite another record-setting quarter, but assured of demand — CEO says careless investment 'would be a disaster for TSMC for sure,' company will invest $52-$56 billion in capex ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-very-nervous-about-ai-bubble-concerns-despite-another-record-setting-quarter-but-assured-of-demand-ceo-says-careless-investment-would-be-a-disaster-for-tsmc-for-sure-company-will-invest-usd52-usd56-billion-in-capex</link>
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                            <![CDATA[ TSMC executive team expects continuous revenue growth in 2026, and onwards as rich AI companies will keep buying AI accelerators for years to come. ]]>
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                                                                        <pubDate>Thu, 15 Jan 2026 17:14:38 +0000</pubDate>                                                                                                                                <updated>Thu, 15 Jan 2026 19:24:46 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/p2QqhVFP7dTRWfeVBCYBYV-1280-80.jpg">
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                                                            <title><![CDATA[ Elon Musk wants to build a dirty 2nm chipmaking fab that you can smoke and eat cheeseburgers in — bets that Tesla will turn the concept of cleanrooms upside down ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-wants-to-build-a-dirty-fab-that-you-can-smoke-and-eat-cheeseburgers-in-bets-that-tesla-will-turn-the-concept-of-cleanrooms-upside-down</link>
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                            <![CDATA[ Elon Musk says that modern cleanrooms are built wrong, and if Tesla builds its own fab, he will be able to eat and smoke in that facility. ]]>
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                                                                        <pubDate>Wed, 07 Jan 2026 16:09:30 +0000</pubDate>                                                                                                                                <updated>Wed, 07 Jan 2026 17:40:15 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/No4Po8VzLyUaK3BZZSd9Fc-1280-80.jpg">
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                                                            <title><![CDATA[ U.S. allows TSMC to import chipmaking equipment to its China fabs — Samsung, SK hynix likewise receive go signal from Commerce Department ]]></title>
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                            <![CDATA[ The U.S. Department of Commerce didn't renew the validated end-user status of these chipmakers, requiring them to acquire annual licenses to import chipmaking tools containing U.S. tech into their Chinese fabs. ]]>
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                                                                        <pubDate>Thu, 01 Jan 2026 14:30:36 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/eGq7UjBhT7HrMXywisdXY6-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power ]]></title>
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                            <![CDATA[ TSMC has quietly begun volume production of its 2nm-class N2 process in Q4 2025 as planned, marking the company’s first GAA nanosheet node that will be ramping production at two new fabs to meet strong demand from various customers. ]]>
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                                                                        <pubDate>Mon, 29 Dec 2025 17:25:52 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/YAQU3zRSbuCHbUYm5L4oD4-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC's average wafer prices increased by over 15% each year since 2019, report suggests — gross profit margins increase by 3.3x in 2025 alone, facing no real challengers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmcs-average-wafer-prices-increased-by-over-15-percent-each-year-since-2019-report-suggests-gross-profit-margins-increase-by-3-3x-in-2025-alone-facing-no-real-challengers</link>
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                            <![CDATA[ EUV lithography era in chipmaking began in 2019 and there are no signs that this is going to stop as process technologies are getting more complex. However, there are fundamental reasons why TSMC's quotes are rising quicker than its costs and its customers are not leaving for other foundries. ]]>
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                                                                        <pubDate>Mon, 29 Dec 2025 15:37:33 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ccriH99hinz37Jq6RzYJFb-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC chipmaking factories rocked by magnitude 7.0 earthquake that was the strongest in 27 years, but facilities escaped unharmed — company's earthquake protection measures pay off ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-chipmaking-factories-rocked-by-magnitude-7-0-earthquake-that-was-the-strongest-in-27-years-but-facilities-escaped-unharmed-companys-earthquake-protection-measures-pay-off</link>
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                            <![CDATA[ Yesterday, the ground shook off the coast of Taiwan, slamming the country with the strongest earthquake in 27 years. The seismic wave registered 7.0 in Taiwan's scales, or 6.6 to 6.7 according to the USGS standard. Thankfully, according to reports, TSMC's factories are all intact, saving the world from yet another spike in chip prices. ]]>
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                                                                        <pubDate>Sun, 28 Dec 2025 17:40:55 +0000</pubDate>                                                                                                                                <updated>Sun, 28 Dec 2025 17:41:00 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Bruno Ferreira ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/EDYFceLibuUhkRr3w4qReK-1280-80.png">
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                                                            <title><![CDATA[ TSMC’s Christmas Card evokes a retro 8-bit winter wonderland — ‘pixelated’ kids play Breakout with snowballs, carving out a festive scene  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmcs-christmas-card-evokes-an-8-bit-winter-wonderland-pixelated-kids-play-breakout-with-snowballs-carving-out-a-festive-scene</link>
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                            <![CDATA[ TSMC has shared a super-cool digital greetings card with a retro-nostalgic 8-bit style gaming animation. ]]>
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                                                                        <pubDate>Thu, 25 Dec 2025 12:40:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/FVxAnvY5f43pqjMLKU4tJ4-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC via Neil Shah]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC shared a super-cool digital greetings card ]]></media:description>                                                            <media:text><![CDATA[TSMC shared a super-cool digital greetings card ]]></media:text>
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                                                            <title><![CDATA[ Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/taiwan-considers-tsmc-export-ban-that-would-prevent-manufacturing-its-newest-chip-nodes-in-u-s-limit-exports-to-two-generations-behind-leading-edge-nodes-could-slow-down-u-s-expansion</link>
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                            <![CDATA[ Taiwan's government is considering imposing N+2 export rule on TSMC's advanced process technologies, which would make it significantly harder for the foundry to develop overseas. ]]>
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                                                                        <pubDate>Fri, 19 Dec 2025 15:09:59 +0000</pubDate>                                                                                                                                <updated>Fri, 19 Dec 2025 15:10:04 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ccriH99hinz37Jq6RzYJFb-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3nm months ahead of schedule — Arizona fab slated for production in 2027 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-brings-its-most-advanced-chipmaking-node-to-the-us-yet-to-begin-equipment-installation-for-3mn-months-ahead-of-schedule-arizona-fab-slated-for-production-in-2027</link>
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                            <![CDATA[ Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027. ]]>
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                                                                        <pubDate>Thu, 18 Dec 2025 15:56:00 +0000</pubDate>                                                                                                                                <updated>Mon, 29 Dec 2025 12:08:50 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/kT3cGxzfZdqUVF5pbVWu5a-1280-80.jpg">
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                                                            <title><![CDATA[ Sales of chip production equipment to reach $156 billion by 2027 — China, Taiwan, and Korea lead intense demand ]]></title>
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                            <![CDATA[ Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI. ]]>
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                                                                        <pubDate>Wed, 17 Dec 2025 19:29:06 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/4eZrCtk8yyPbygdoere4cc-1280-80.jpg">
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                                                            <title><![CDATA[ The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/cooling/the-data-center-cooling-state-of-play-2025-liquid-cooling-is-on-the-rise-thermal-density-demands-skyrocket-in-ai-data-centers-and-tsmc-leads-with-direct-to-silicon-solutions</link>
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                            <![CDATA[ The rise of AI and hyperscale computing is driving a global shift from air-based to liquid and embedded cooling as various companies are developing silicon-integrated systems capable of handling multi-kilowatt system-in-packages that can be commercialized by 2027. ]]>
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                                                                        <pubDate>Tue, 16 Dec 2025 11:00:00 +0000</pubDate>                                                                                                                                <updated>Thu, 18 Dec 2025 03:27:03 +0000</updated>
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                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/rMEtrL4LyKa5zyZtuiwKpP-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC ponders upgrading 2nd Japan fab to 4nm — could pave the way for more advanced chips for Japanese customers (Updated) ]]></title>
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                            <![CDATA[ TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause. ]]>
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                                                                        <pubDate>Thu, 11 Dec 2025 13:00:07 +0000</pubDate>                                                                                                                                <updated>Fri, 12 Dec 2025 11:25:13 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/etoDBiTYKufSUuVbJbShrH-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-could-be-inching-closer-to-making-all-american-chips-report-says-it-is-accelerating-an-advanced-packaging-facility-in-arizona</link>
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                            <![CDATA[ TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor. ]]>
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                                                                        <pubDate>Sat, 06 Dec 2025 15:45:22 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ccriH99hinz37Jq6RzYJFb-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC claims 4.2X efficiency gain over a decade from N7 to A14 fabrication process ]]></title>
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                            <![CDATA[ TSMC clarifies A14 specifications: Even more performance, but better tools might be needed to extract the full potential of the latest process technologies. ]]>
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                                                                        <pubDate>Sat, 06 Dec 2025 14:44:41 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
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                                                            <title><![CDATA[ HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/hbm-undergoes-major-architectural-shakeup-as-tsmc-and-guc-detail-hbm4-hbm4e-and-c-hbm4e-3nm-base-dies-to-enable-2-5x-performance-boost-with-speeds-of-up-to-12-8gt-s-by-2027</link>
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                            <![CDATA[ HBM is undergoing its first major architectural overhaul in a decade, as HBM4, HBM4E, and C-HBM4E will introduce a 2048-bit interface, logic-node base dies, and optional custom memory logic inside base dies, enabling up to a 2.5X performance leap between 2025 and 2027. ]]>
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                                                                        <pubDate>Tue, 02 Dec 2025 18:30:06 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
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                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/SGkyZ5MswpGGR4PqwZ98FG-1280-80.jpg">
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                                                            <title><![CDATA[ Taiwan hits Japanese firm with indictment in TSMC data theft saga — Tokyo Electron charged with failing to prevent its staff from stealing trade secrets ]]></title>
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                            <![CDATA[ Taiwanese prosecutors are seeking financial compensation from Japanese semiconductor company, Tokyo Electron, claiming that it didn't take appropriate measures to prevent staff from trying to steal sensitive data from TSMC. ]]>
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                                                                        <pubDate>Tue, 02 Dec 2025 14:36:22 +0000</pubDate>                                                                                                                                <updated>Tue, 02 Dec 2025 14:46:02 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Jon Martindale ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/qcGrCncKJxWjf37VzvuEZZ-1280-80.jpg">
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                                                            <title><![CDATA[ Industry's first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/industrys-first-tsmc-coupe-based-optical-connectivity-solution-for-next-gen-ai-chips-displayed-alchip-and-ayar-labs-show-future-silicon-photonics-device</link>
                                                                            <description>
                            <![CDATA[ Alchip and Ayar Labs team up to build optical connectivity solution based on TSMC's COUPE framework that lets fabless chip designers to easily add optical connectivity to their designs. ]]>
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                                                                        <pubDate>Mon, 01 Dec 2025 13:46:49 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/tbjid9czAF6qgNMre6SAHX-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[First demonstration of TSMC COUPE-based silicon photonics subsystem.]]></media:description>                                                            <media:text><![CDATA[First demonstration of TSMC COUPE-based silicon photonics subsystem.]]></media:text>
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                                                            <title><![CDATA[ Intel moves closer to building Apple’s entry-level M-series chips on 18A from 2027 — insider claims chipmaking deal could be close at hand ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-moves-closer-to-building-apples-entry-level-m-series-chips-on-18a</link>
                                                                            <description>
                            <![CDATA[ Apple is preparing to qualify Intel’s 18A process for its lowest-end M-series processor, according to a post on X from analyst Ming-Chi Kuo. ]]>
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                                                                        <pubDate>Sun, 30 Nov 2025 15:30:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ADBoEQA3CwEZ7y6EuN4hKX-1280-80.jpg">
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                                                            <title><![CDATA[ Ex-TSMC executive’s homes raided in Intel trade-secret lawsuit — Taiwanese prosecutors seize digital devices in ongoing investigation ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ex-tsmc-executives-home-raised-after-lawsuit-filings</link>
                                                                            <description>
                            <![CDATA[ Taiwanese prosecutors have searched the homes of former TSMC Senior Vice President Lo Wen-jen, days after the company filed a civil lawsuit alleging that Lo may have leaked trade secrets to Intel. ]]>
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                                                                        <pubDate>Thu, 27 Nov 2025 16:36:11 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/eGq7UjBhT7HrMXywisdXY6-1280-80.jpg">
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                                                            <title><![CDATA[ Intel fully backs its controversial new hire that TSMC alleges took company secrets with him — CEO Lip-Bu Tan highlights Team Blue's strict ethics policy in internal memo amid high-stakes lawsuit ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-fully-backs-its-controversial-new-hire-that-tsmc-alleges-took-company-secrets-with-him-ceo-lip-bu-tan-highlights-team-blues-strict-ethics-policy-in-internal-memo-amid-high-stakes-lawsuit</link>
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                            <![CDATA[ A new legal battle is taking shape in the semiconductor industry, with TSMC suing its former employee, Wei-Jen Lo, after he joined Intel following his retirement at the Taiwanese firm. Intel CEO Lip-Bu Tan argues that TSMC's claims of trade-secret theft are unwarranted and that Lo has the company's full support. ]]>
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                                                                        <pubDate>Thu, 27 Nov 2025 10:28:05 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/bDty4GEkdqfMhvTW6ZP3S4-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Lip-Bu Tan, chief executive of Intel]]></media:description>                                                            <media:text><![CDATA[Lip-Bu Tan, chief executive of Intel]]></media:text>
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                                                            <title><![CDATA[ TSMC confirms September power outage at Fab 21 in Arizona — loss of wafers and financial impact unclear ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-confirms-september-power-outage-at-fab-21-in-arizona-loss-of-wafers-and-financial-impact-unclear</link>
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                            <![CDATA[ A supplier power fault briefly stopped TSMC’s Fab 21 in Arizona and led to some wafer losses. But TSMC has learnt from the occurrence, says the company. ]]>
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                                                                        <pubDate>Wed, 26 Nov 2025 10:00:20 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/kT3cGxzfZdqUVF5pbVWu5a-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-gains-ground-in-ai-packaging-as-cowos-capacity-remains-stretched</link>
                                                                            <description>
                            <![CDATA[ As TSMC hits a supply-side wall with CoWoS, Intel may be positioned to provide reprive with EMIB and Foveros. ]]>
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                                                                        <pubDate>Tue, 25 Nov 2025 16:19:10 +0000</pubDate>                                                                                                                                <updated>Tue, 25 Nov 2025 16:22:52 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/HXntLDMEzSHkCjDjoDayJX-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC sues former executive over defection to Intel, says it's highly likely he stole trade secrets — chipmaker claims Wei-Jen Lo broke non-disclosure and non-compete agreements ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-sues-former-executive-over-defection-to-intel-says-its-highly-likely-he-stole-trade-secrets-chipmaker-claims-wei-jen-lo-broke-non-disclosure</link>
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                            <![CDATA[ TSMC initiates legal action against Wei-Jen Lo, who retired from TSMC this summer, signed a non-compete agreement, but subsequently joined Intel as Executive Vice President. ]]>
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                                                                        <pubDate>Tue, 25 Nov 2025 12:07:37 +0000</pubDate>                                                                                                                                <updated>Tue, 25 Nov 2025 21:17:04 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/JSqcDcxuFoFQUzrrQSpGrB-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / BING-JHEN HONG]]></media:credit>
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                                                            <title><![CDATA[ TSMC says advanced‑node capacity falls ‘about three times short’ of AI demand — company's wafer capacity is 'still not enough' as demand continues to rise ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-csays-advanced-node-capacity-falls-short-of-ai-demand</link>
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                            <![CDATA[ TSMC Chairman-CEO C. C. Wei says capacity is roughly three times short of what its major customers plan to consume. ]]>
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                                                                        <pubDate>Tue, 25 Nov 2025 11:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/Dv4UjoPp5mqpwrVkTNyTHS-1280-80.png">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Lisa Su sits alongside TSMC CEO C C Wei and former Chairman Mark Liu on-stage at the 2025 SIA Awards. ]]></media:description>                                                            <media:text><![CDATA[Lisa Su sits alongside TSMC CEO C C Wei and former Chairman Mark Liu on-stage at the 2025 SIA Awards. ]]></media:text>
                                <media:title type="plain"><![CDATA[Lisa Su sits alongside TSMC CEO C C Wei and former Chairman Mark Liu on-stage at the 2025 SIA Awards. ]]></media:title>
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                                                            <title><![CDATA[ Intel CEO rejects reports the company is obtaining TSMC secrets from former executive — Taiwan's investigation into Intel's controversial recent hire continues ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-ceo-rejects-reports-the-company-is-obtaining-tsmc-secrets-from-former-executive-taiwans-investigation-into-intels-controversial-recent-hire-continues</link>
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                            <![CDATA[ Intel CEO Lip-Bu Tan dismisses speculation that former TSMC executive Wei-Jen Lo could have brought advanced TSMC process secrets to Intel. ]]>
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                                                                        <pubDate>Fri, 21 Nov 2025 11:35:36 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/bDty4GEkdqfMhvTW6ZP3S4-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Lip-Bu Tan, chief executive of Intel]]></media:description>                                                            <media:text><![CDATA[Lip-Bu Tan, chief executive of Intel]]></media:text>
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                                                            <title><![CDATA[ High-ranking TSMC executive faces Taiwan legal investigation over murky return to Intel — report alleges employee took technical documents with him ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/high-ranking-tsmc-executive-faces-taiwan-legal-investigation-over-murky-return-to-intel-report-alleges-employee-took-technical-documents-with-him</link>
                                                                            <description>
                            <![CDATA[ Wei-Jen Lo, a longtime TSMC leader who quietly reappeared at Intel only months after retiring, is now reported to have left with extensive N2, A16, A14, and post-A14 process documents, triggering scrutiny over his sudden move and a TSMC investigation into possible stealing of trade secrets. ]]>
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                                                                        <pubDate>Tue, 18 Nov 2025 16:16:33 +0000</pubDate>                                                                                                                                <updated>Tue, 18 Nov 2025 16:16:55 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/QZU4LiEEqJKst2rDMTv64b-1280-80.jpg">
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                                                            <title><![CDATA[ Elon Musk wants foundry partners to build astounding '100 – 200 billion AI chips' per year — Musk says chipmaking industry can't deliver on his goals ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/artificial-intelligence/elon-musk-wants-foundry-partners-to-build-100-200-billion-ai-chips-per-year-musk-says-chipmaking-industry-cant-deliver-on-his-goals</link>
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                            <![CDATA[ Elon Musk claims Tesla may need 100 – 200 billion AI chips per year, a volume far beyond what TSMC and Samsung can supply, which is why he is considering building Tesla's own fab, as he believes existing foundries cannot scale fast enough for him. ]]>
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                                                                        <pubDate>Tue, 18 Nov 2025 12:00:00 +0000</pubDate>                                                                                                                                <updated>Tue, 18 Nov 2025 13:44:03 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/9dzjRNYRQ4KFMZ5ckM96ak-1280-80.jpg">
                                                            <media:credit><![CDATA[xAI on Twitter/X]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Musk helps out at Memphis]]></media:description>                                                            <media:text><![CDATA[Musk helps out at Memphis]]></media:text>
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                                                            <title><![CDATA[ OpenAI’s colossal AI data center targets would consume as much electricity as entire nation of India — 250GW target would require 30 million GPUs annually to ensure continuous operation, emit twice as much carbon dioxide as ExxonMobil ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/artificial-intelligence/openais-colossal-ai-data-center-targets-would-consume-as-much-electricity-as-entire-nation-of-india-250gw-target-would-require-30-million-gpus-annually-to-ensure-continuous-operation-emit-twice-as-much-carbon-dioxide-as-exxonmobil</link>
                                                                            <description>
                            <![CDATA[ The AI race is exerting a massive toll on our environment. ]]>
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                                                                        <pubDate>Thu, 13 Nov 2025 13:20:09 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Artificial Intelligence]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Gap4q25HY47X2VQsx8BwD6-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Stock image of a data center]]></media:description>                                                            <media:text><![CDATA[Stock image of a data center]]></media:text>
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                                                            <title><![CDATA[ Taiwan to up defense spending and develop Iron Dome-inspired missile protection — expert warns one well-placed Chinese missile could make it 'impossible to get a new iPhone for three years' ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/taiwan-to-up-defense-spending-and-develop-iron-dome-inspired-missile-protection-expert-warns-one-well-placed-chinese-missile-could-make-it-impossible-to-get-a-new-iphone-for-three-years</link>
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                            <![CDATA[ An expert from the Taiwan NSTC Hsinchu Science Park Bureau estimates that a single missile strike could disrupt iPhone production for three years, with another suggesting that such an event could result in a 6% to 10% contraction of the global GDP. ]]>
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                                                                        <pubDate>Thu, 13 Nov 2025 11:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Jp9VrZtDe3VQtHQ7vDJkvh-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC R&amp;D Center]]></media:description>                                                            <media:text><![CDATA[TSMC R&amp;D Center]]></media:text>
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                                                            <title><![CDATA[ Musk confirms Tesla AI5 and AI6 will be made at both Samsung and TSMC, reinforcing dual-foundry strategy ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/musk-confirms-tesla-ai5-and-ai6-will-be-made-at-samsung-and-tsmc</link>
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                            <![CDATA[ Elon Musk has confirmed that Tesla’s AI6 chip will be manufactured at both Samsung’s Taylor facility and TSMC’s Arizona fab. The update from the company’s CEO follows earlier comments in which he described Samsung’s site as technically superior. ]]>
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                                                                        <pubDate>Mon, 10 Nov 2025 18:59:19 +0000</pubDate>                                                                                                                                <updated>Tue, 11 Nov 2025 13:14:19 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/aDQbDpY8n3iFusBi82QeF5-1280-80.jpg">
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