Lenovo ThinkCentre X Ultra packs Gorgon Halo — AMD Ryzen AI Max+ Pro 495 shows up in mini workstation
Up to 128GB of integrated memory
AMD's Gorgon Halo is breaking cover at IFA. Ahead of the show, Lenovo revealed the ThinkCentre X Ultra with up to an AMD Ryzen AI Max+ Pro 495 processor, with an integrated AMD Radeon 8065S GPU, and 128GB of RAM.
The system is set to release in November 2026 with an "expected" starting price of $3,669, which is surely not for the top-end model.
CPU |
Up to AMD Ryzen AI Max+ Pro 495 processor |
GPU |
Up to Integrated AMD Radeon 8065S Graphics with up to 96GB of dedicated graphics memory |
Memory |
Up to 128GB LPDDR5x-8533, soldered |
Storage |
Up to 2× 4TB M.2 2280 Gen5 Performance SSD |
NPU |
Up to 55 TOPS |
Networking |
Wi-Fi 7 (RealTek or MediaTek), Bluetooth 5.4 |
Dimensions |
7.2 × 7.2 × 2 inches (183 × 183 × 51 mm) |
Availability |
November 2026 |
Starting Price |
$3,699.00 |
The system is fairly compact at 7.2 x 7.2 x 2 inches, about two inches longer than a Mac Mini on either side. The front of the system features two 10GBps USB-C ports and a headphone jack. The back boasts DisplayPort 2.1 and HDMI 2.1, two 10GBps USB Type-A ports, a pair of Thunderbolt 4 ports (USB 40GBps, rare on AMD platforms), a 10Gb Ethernet jack, and a punch-out port to add additional output. Lighting on the system that you can see through the front air intakes shows the system status at a glance.
Lenovo is offering both Linux and Windows options. The system will come with AMD Ryzen AI Developer Center, which includes preconfigured AI models and tools, as well as example workflows to use. Up to four ThinkCentre X Ultras can be used in a cluster to run larger models, more agents, extra requests, or longer context windows.
Lenovo and AMD are set to have some competition in the mini PC space this year, as Nvidia is launching systems with its RTX Spark from OEM companies sometime this fall.
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Andrew E. Freedman is a senior editor at Tom's Hardware focusing on laptops, desktops and gaming. He also keeps up with the latest news. A lover of all things gaming and tech, his previous work has shown up in Tom's Guide, Laptop Mag, Kotaku, PCMag and Complex, among others. Follow him on Threads @FreedmanAE and BlueSky @andrewfreedman.net. You can send him tips on Signal: andrewfreedman.01
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usertests A paltry 128 GB of memory! But it is running at 8533 MT/s so it will improve performance compared to older units.Reply -
emerth I like this kind of machine, also the machines made with the previous 300 series AI Pro CPUs.Reply
IDK that I would use it for AI, but as a compact dev machine certainly, only allocate most of the RAM to the CPU. I like a decent GPU in any desktop machine.
However at this price I would very much like to have SO-DIMMs not soldered. -
usertests Reply
AFAIK there have been no Strix Halo devices with socketed memory, even CAMM. Also, SO-DIMM is done after DDR5.emerth said:However at this price I would very much like to have SO-DIMMs not soldered.
So we have to ask ourselves if socketed memory is possible for future generations like Medusa Halo. The answer is NO so far. Medusa Halo could be using LPDDR6, possibly with a cheaper LPDDR5X option. If we aren't getting 256-bit LPCAMM for technical reasons now, are we getting it later?
Maybe the Nvidia-designed SOCAMM(2/3) can make it happen, even though it's not consumer-oriented (all you need is volume). But stakeholders need to come together for us to have a chance of getting upgradeable memory with these big APUs.
As long as soldered 192-256 GB is "cheap" post-crash, it doesn't matter that much. Max it out and move on. Except that soldered is going to be less repairable. -
emerth Reply
I don't really mind what variety of socketed RAM it is as long as it is a standardized form. I just want to be able to upgrade or move memory around. SOCAMM is fine, I am sure you are right about SO-DIMM going forward.usertests said:AFAIK there have been no Strix Halo devices with socketed memory, even CAMM. Also, SO-DIMM is done after DDR5.
So we have to ask ourselves if socketed memory is possible for future generations like Medusa Halo. The answer is NO so far. Medusa Halo could be using LPDDR6, possibly with a cheaper LPDDR5X option. If we aren't getting 256-bit LPCAMM for technical reasons now, are we getting it later?
Maybe the Nvidia-designed SOCAMM(2/3) can make it happen, even though it's not consumer-oriented (all you need is volume). But stakeholders need to come together for us to have a chance of getting upgradeable memory with these big APUs.
As long as soldered 192-256 GB is "cheap" post-crash, it doesn't matter that much. Max it out and move on. Except that soldered is going to be less repairable. -
usertests Reply
Yeah, we're entering a very uncertain situation with multiple standards competing over a shrinking piece of the pie (because companies would rather give you soldered and upsell you for more memory). It seems like LPCAMM isn't doing well. Low volume and high prices (compounded by memory crisis) hurt adoption.emerth said:I don't really mind what variety of socketed RAM it is as long as it is a standardized form. I just want to be able to upgrade or move memory around. SOCAMM is fine, I am sure you are right about SO-DIMM going forward.
SODIMM being dead after DDR5 is straight outta JEDEC. It is toast.