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                            <title><![CDATA[ Latest from Tom's Hardware UK in Semiconductors ]]></title>
                <link>https://www.tomshardware.com/uk/tech-industry/manufacturing/semiconductors</link>
        <description><![CDATA[ All the latest semiconductors content from the Tom's Hardware  UK team ]]></description>
                                    <lastBuildDate>Thu, 14 May 2026 11:55:32 +0000</lastBuildDate>
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                                                            <title><![CDATA[ Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/leading-edge-foundry-roadmaps-for-tsmc-intel-and-samsung-outlining-the-path-to-1-4nm-nodes-and-beyond</link>
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                            <![CDATA[ All three leading foundries have now entered the 2nm era, but their paths from now on diverge sharply: TSMC bets on predictability, Intel wagers on aggressive architectural shifts, and Samsung's primary focus is on improving yields. ]]>
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                                                                        <pubDate>Thu, 14 May 2026 11:55:32 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ZKF8RzvzwTi5U2yW395MGA-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa rules ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-allocates-usd20-billion-to-arizona-expansion-project-faces-water-and-labor-shortages-complicated-by-visa-rules</link>
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                            <![CDATA[ TSMC's Fab 21 becomes profitable in the first year of operations, though TSMC continues to struggle with labor shortage, water shortage, and is concerned about the long-term power supply. Nevertheless, it allocates $20 billion on further development of the project. ]]>
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                                                                        <pubDate>Tue, 12 May 2026 14:53:55 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/kT3cGxzfZdqUVF5pbVWu5a-1280-80.jpg">
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                                                            <title><![CDATA[ NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/nasa-partners-with-microchip-to-build-next-generation-spaceflight-chips-with-100x-the-power-of-current-offerings-chip-designed-to-withstand-radiation-for-extended-missions-on-the-moon-and-mars</link>
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                            <![CDATA[ The public-private partnership aims to develop an SoC that offers 100x the computing power of current chips designed for spaceflight. NASA envisions that the technologies developed from this project will also be widely implemented on Earth-bound applications, like the automotive and aerospace industries. ]]>
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                                                                        <pubDate>Tue, 12 May 2026 11:11:26 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/qCPNqgg27yc6Hec4nRu2Y5-1280-80.png">
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                                                                                                                                                                                                                                    <media:description><![CDATA[a Microchip SoC built for NASA]]></media:description>                                                            <media:text><![CDATA[a Microchip SoC built for NASA]]></media:text>
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                                                            <title><![CDATA[ Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-shares-surge-to-all-time-high-on-reports-of-intel-emib-partnership</link>
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                            <![CDATA[ The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology. ]]>
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                                                                        <pubDate>Mon, 11 May 2026 11:08:28 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/cfiMBTgaBMTgaoVrGUdtZj-1280-80.jpg">
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                                                            <title><![CDATA[ Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary agreement for Intel to make processors for Cupertino ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/apple-reportedly-strikes-deal-for-intel-to-make-some-of-its-chips-two-tech-giants-reached-a-preliminary-agreement-for-intel-to-make-processors-for-cupertino</link>
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                            <![CDATA[ Intel and Apple have reportedly reached a deal in which the former will manufacture chips for the latter. ]]>
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                                                                        <pubDate>Fri, 08 May 2026 18:09:03 +0000</pubDate>                                                                                                                                <updated>Fri, 08 May 2026 18:09:07 +0000</updated>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/CAcvpszp9CNXepVni2dP9K-1280-80.jpg">
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                                                            <title><![CDATA[ Global semiconductor sales hit nearly $300 billion in Q1 2026 — chips are on track to top $1 trillion for this year, says report  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/global-semiconductor-sales-hit-nearly-usd300-billion-in-q1-2026-chips-are-on-track-to-top-usd1-trillion-for-this-year-says-report</link>
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                            <![CDATA[ Sales of chips in Q1 2026 hit $298.5 billion and are on track to exceed $1 trillion this year, according to the Semiconductor Industry Association. ]]>
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                                                                        <pubDate>Wed, 06 May 2026 10:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/oZ82RyoRPstu3RQsYtkB7M-1280-80.jpg">
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                                                            <title><![CDATA[ Apple considering Intel and Samsung for US chip production, report claims — consumer electronics giant looks to diversify supply chain amid chip shortages ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/apple-considering-intel-and-samsung-for-us-chip-production-report-claims-consumer-electronics-giant-looks-to-diversify-supply-chain-amid-chip-shortages</link>
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                            <![CDATA[ Apple is reportedly in early talks with Intel and Samsung to secure more production for its advanced chips, as the company is constrained by the limited availability of advanced nodes that its SoCs are produced on. ]]>
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                                                                        <pubDate>Tue, 05 May 2026 12:30:03 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/nN9B34iLQ7hZALdk2wZ5Ek-1280-80.jpg">
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                                                            <title><![CDATA[ China pushes for 70% homegrown silicon wafer use as domestic firm ramps up 12-inch production — government seeking to localize critical chip supply chain amid AI boom and export restrictions ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-pushes-for-70-percent-homegrown-silicon-wafer-use-as-domestic-firm-ramps-up-12-inch-production-government-seeking-to-localize-critical-chip-supply-chain-amid-ai-boom-and-export-restrictions</link>
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                            <![CDATA[ China is targeting 70% local wafer sourcing as firms like Eswin scale 12-inch production, aiming to reduce reliance on foreign suppliers and support growing AI chip demand. ]]>
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                                                                        <pubDate>Tue, 05 May 2026 11:06:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Etiido Uko ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/CmM2jsgtAUNEHVoV48L8rh-1280-80.jpg">
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                                                            <title><![CDATA[ ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-lithograpy-roadmap-examined-from-duv-to-hyper-na</link>
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                            <![CDATA[ ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog. ]]>
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                                                                        <pubDate>Fri, 01 May 2026 11:30:00 +0000</pubDate>                                                                                                                                <updated>Mon, 04 May 2026 11:44:09 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/yigtYLnV9mYF7u9h27AiYi-1280-80.png">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Men working on Twinscan EUV machine ]]></media:description>                                                            <media:text><![CDATA[Men working on Twinscan EUV machine ]]></media:text>
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                                                            <title><![CDATA[ Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50% ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-details-18a-p-process-node-touts-higher-performance-lower-power-and-better-thermals-9-percent-more-performance-thermal-conductivity-improved-by-50-percent</link>
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                            <![CDATA[ Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more. ]]>
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                                                                        <pubDate>Fri, 01 May 2026 11:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/yy58ngAfSpXbtQwNK2cC88-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-soic-3d-stacking-roadmap-outlines-path-from-6-micron-pitches-today-to-4-5-micron-in-2029-fujitsus-monaka-cpu-to-benefit-from-face-to-face-chiplet-stacking</link>
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                            <![CDATA[ TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking. ]]>
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                                                                        <pubDate>Wed, 29 Apr 2026 13:26:22 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MdVbRdfhkVQBdUjLKbcjg8-1280-80.jpg">
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                                                            <title><![CDATA[ Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale — network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/google-splits-its-tpu-into-two-chips-for-the-first-time-with-training-and-inference-variants</link>
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                            <![CDATA[ Google announced its eighth-gen TPUs at Cloud Next, shipping two distinct chip designs for the first time in the TPU program's decade-long history. ]]>
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                                                                        <pubDate>Mon, 27 Apr 2026 17:12:59 +0000</pubDate>                                                                                                                                <updated>Mon, 27 Apr 2026 18:22:37 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/SJwcUNbmofFcDsiP5VBd6Y-1280-80.png">
                                                            <media:credit><![CDATA[Google]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[The Google TPU 8i and 8t]]></media:description>                                                            <media:text><![CDATA[The Google TPU 8i and 8t]]></media:text>
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                                                            <title><![CDATA[ TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and additional memory bandwidth jump ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmcs-details-next-gen-cowos-roadmap-over-14-reticle-packages-and-48x-leap-in-compute-power-expected-by-2029-massive-size-enables-24-hbm5e-stacks-and-additional-memory-bandwidth-jump</link>
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                            <![CDATA[ TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors. ]]>
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                                                                        <pubDate>Mon, 27 Apr 2026 11:56:06 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/5v5TynY3T6qoQvHBybftxE-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC CoWoS]]></media:description>                                                            <media:text><![CDATA[TSMC CoWoS]]></media:text>
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                                                            <title><![CDATA[ Bolt Graphics tapes out its first Zeus GPU test chip on TSMC 12nm — firm touts 17x lower cost of compute ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/bolt-graphics-tapes-out-its-first-zeus-gpu-test-chip-on-tsmc-12nm</link>
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                            <![CDATA[ Bolt Graphics has announced its completed tape-out of a test chip for its Zeus GPU, marking the startup's first move from FPGA emulation to manufactured silicon. ]]>
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                                                                        <pubDate>Thu, 23 Apr 2026 10:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/PaQrxNPWJVBseB4t9KkFTm-1280-80.png">
                                                            <media:credit><![CDATA[Bolt Graphics]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[The Zeus 1c26-032]]></media:description>                                                            <media:text><![CDATA[The Zeus 1c26-032]]></media:text>
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                                                            <title><![CDATA[ Elon Musk says his TeraFab facilities will use Intel's 14A process technology to make AI chips — SpaceX will be responsible for high-volume chip manufacturing in likely Intel tech licensing deal ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-says-terafab-will-use-intels-14a-process-technology-to-make-ai-chips-spacex-will-be-responsible-for-high-volume-chip-manufacturing-in-liekly-intel-tech-licensing-deal</link>
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                            <![CDATA[ Elon Musk reveals details about TeraFab: Intel provides technology, Tesla builds pilot line, SpaceX constructs high-volume fab. ]]>
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                                                                        <pubDate>Thu, 23 Apr 2026 01:24:43 +0000</pubDate>                                                                                                                                <updated>Thu, 23 Apr 2026 01:30:27 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EZCTC9MCaqNdiAMUCqPqEK-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel/X.com]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ TSMC unveils process technology roadmap through 2029 — A12, A13, N2U announced, A16 slips to 2027 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-unveils-process-technology-roadmap-through-2029-a12-a13-n2u-announced-a16-slips-to-2027</link>
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                            <![CDATA[ TSMC strengthens its bifurcated process technology development approach with A14, A13, and N2U aimed at client applications and A16, A12, and N2X for high-performance data center designs. ]]>
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                                                                        <pubDate>Wed, 22 Apr 2026 20:44:57 +0000</pubDate>                                                                                                                                <updated>Thu, 23 Apr 2026 01:29:28 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/dqa9GQXHrqhhgMVZAPVBNi-1280-80.png">
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                                                            <title><![CDATA[ Congress moves to strip the DoC of chip-export discretion with the MATCH Act — DUV lithography machines among those targeted in chipmaking tool crackdown ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/congress-moves-to-strip-commerce-of-chip-export-discretion-with-the-match-act</link>
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                            <![CDATA[ A bipartisan group of U.S. lawmakers introduced the Multilateral Alignment of Technology Controls on Hardware Act, or MATCH Act, in early April. ]]>
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                                                                        <pubDate>Wed, 22 Apr 2026 11:30:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/mLCnms8WXK8ay2PfvVvinN-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / Heather Diehl]]></media:credit>
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                                                            <title><![CDATA[ Enthusiast builds his own RAM in garden shed cleanroom — fledgling array of memory cells groundwork for much larger future project ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/dr-semiconductor-successfully-fabs-ram-in-garden-shed-cleanroom-array-of-memory-cells-with-12pf-capacitance-groundwork-for-much-larger-future-array</link>
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                            <![CDATA[ This is the ‘first time ever RAM has been made at home’ boasts a garden shed-based semiconductor maker. ]]>
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                                                                        <pubDate>Wed, 22 Apr 2026 10:00:00 +0000</pubDate>                                                                                                                                <updated>Wed, 22 Apr 2026 13:23:46 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/B5eSTUQDi88b2yTqQZJUcX-1280-80.jpg">
                                                            <media:credit><![CDATA[Future]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Best RAM deals]]></media:description>                                                            <media:text><![CDATA[Best RAM deals]]></media:text>
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                                                            <title><![CDATA[ 40 years ago we entered the megabit memory era with IBM’s DRAM breakthrough — a major leap beyond the 64 kilobit chips common at the time ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/40-years-ago-we-entered-the-megabit-memory-era-with-ibms-dram-breakthrough-a-major-leap-beyond-the-64-kilobit-chips-common-at-the-time</link>
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                            <![CDATA[ 40 years ago today IBM was in the news for becoming the first computer company with 1-megabit memory chips. ]]>
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                                                                        <pubDate>Sun, 19 Apr 2026 12:04:33 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/gZs6XpMVvANwnofht3NHz7-1280-80.jpg">
                                                            <media:credit><![CDATA[Norsk Telemuseum CC]]></media:credit>
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                                                            <title><![CDATA[ US lawmakers amend new restrictions on Chinese chipmakers — MATCH Act's blanket restrictions removed from select chipmaking tools ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/us-lawmakers-amend-new-restrictions-on-chinese-chipmakers-match-acts-blanket-restrictions-removed-from-select-chipmaking-tools</link>
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                            <![CDATA[ U.S. lawmakers remove countrywide exports ban on cryogenic etching tools from the MATCH Act, yet Chinese companies could barely get them anyway. ]]>
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                                                                        <pubDate>Fri, 17 Apr 2026 18:00:25 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/gXiiqKDVnZQpy3gNVhHB55-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Chip Fab]]></media:description>                                                            <media:text><![CDATA[Chip Fab]]></media:text>
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                                                            <title><![CDATA[ Intel hires tenured Samsung exec to lead Foundry Services — signals company focus on winning business from potential Foundry suitors ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-hires-tenured-samsung-exec-to-lead-foundry-services-signals-company-focus-on-winning-business-from-potential-foundry-suitors</link>
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                            <![CDATA[ Intel lures Shawn 'Seung Hoon' Han from Samsung Foundry to land new customers and maintain customer relationships at Intel Foundry. ]]>
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                                                                        <pubDate>Fri, 17 Apr 2026 13:13:48 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/tCxeFD6UhKMx7J9BAHkQ2J-1280-80.jpg">
                                                            <media:credit><![CDATA[Shawn Han/LinkedIn]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Shawn Han]]></media:description>                                                            <media:text><![CDATA[Shawn Han]]></media:text>
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                                                            <title><![CDATA[ Elon Musk pushing forward with Terafab at 'light speed' — staff reaching out to various suppliers and are reportedly willing to pay a premium to gain priority ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-pushing-forward-with-terafab-at-ight-speed-staff-reaching-out-to-various-suppliers-and-are-reportedly-willing-to-pay-a-premium-to-gain-priority</link>
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                            <![CDATA[ Elon Musk's people have begun reaching out to various semiconductor fab suppliers to ask for pricing and delivery timelines as the Terafab project ramps up. ]]>
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                                                                        <pubDate>Fri, 17 Apr 2026 13:07:34 +0000</pubDate>                                                                                                                                <updated>Fri, 17 Apr 2026 13:24:23 +0000</updated>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/YcsuCrWsLfu2BX3ijFziAU-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Elon Musk]]></media:description>                                                            <media:text><![CDATA[Elon Musk]]></media:text>
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                                                            <title><![CDATA[ TSMC ups revenue guidance and CapEx, buoyed by 'multiyear AI megatrend' — warns Middle East conflict may impact profitability as costs increase ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-ups-revenue-guidance-and-capex-buoyed-by-multiyear-ai-megatrend-warns-middle-east-conflict-may-impact-profitability-as-costs-increase</link>
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                            <![CDATA[ TSMC unveils aggressive plans to ramp up 3nm-capable capacity further in the coming years amid strong demand from the AI sector. ]]>
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                                                                        <pubDate>Fri, 17 Apr 2026 12:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/p2QqhVFP7dTRWfeVBCYBYV-1280-80.jpg">
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                                                            <title><![CDATA[ TSMC warns of Intel Foundry's growing prowess during the company's latest earnings call — 'We view Intel as our formidable competitor and do not underestimate them' ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-warns-of-intel-foundrys-growing-prowess-during-the-companys-latest-earnings-call-we-view-intel-as-our-formidable-competitor-and-do-not-underestimate-them</link>
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                            <![CDATA[ By now, TSMC has become a much bigger chipmaker than Intel has ever been, but the world's top foundry still calls its American peer a 'formidable' competitor. ]]>
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                                                                        <pubDate>Fri, 17 Apr 2026 09:58:04 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/cYadY8ki4zpB7RxErYHK7S-1280-80.jpg">
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                                                            <title><![CDATA[ YMTC's third Wuhan fab clears Beijing's 50% local tooling threshold as two more are planned — move positions company toward 3D NAND production to capitalize on wafer bonding strengths ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ymtcs-third-wuhan-fab-clears-beijings-50-percent-domestic-tooling-threshold-as-two-more-are-planned</link>
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                            <![CDATA[ China’s YMTC is expected to start operations at its Phase 3 Wuhan fab late this year as the first leading-edge memory plant built to comply with Beijing's unwritten 50% tooling requirement. ]]>
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                                                                        <pubDate>Wed, 15 Apr 2026 15:40:56 +0000</pubDate>                                                                                                                                <updated>Wed, 15 Apr 2026 15:58:34 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ZKF8RzvzwTi5U2yW395MGA-1280-80.jpg">
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                                                            <title><![CDATA[ China's premiere memory-maker YMTC plans two additional Wuhan fabs using homegrown chipmaking tools — Phase 3 crosses 50% domestic tooling threshold ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ymtc-planms-two-additional-wuhan-fabs</link>
                                                                            <description>
                            <![CDATA[ China’s Yangtze Memory Technologies plans to build two fabs beyond the Phase 3 plant that it’s due to complete in Wuhan this year. ]]>
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                                                                        <pubDate>Tue, 14 Apr 2026 14:31:08 +0000</pubDate>                                                                                                                                <updated>Tue, 14 Apr 2026 14:38:46 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/jgrPBDyZM4cBztnYG8QA33-1280-80.jpg">
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                                                            <title><![CDATA[ Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited,EMIB-T is preparing for advanced AI accelerator designs ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intels-emib-t-heads-for-fab-rollout-this-year</link>
                                                                            <description>
                            <![CDATA[ If these “billions per year” in deals close, it’d mark quite the turnaround for Intel Foundry, which generated just $307 million in external revenue last year. ]]>
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                                                                        <pubDate>Thu, 09 Apr 2026 15:09:42 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/qXjw6K9cVJzeNZurs6CD3H-1280-80.jpg">
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                                                            <title><![CDATA[ China intensifies efforts to poach semiconductor talent from Taiwan, claims report — international restrictions motivate illicit efforts to obtain talent and equipment  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-intensifies-efforts-to-poach-semiconductor-talent-from-taiwan-claims-report-international-restrictions-motivate-illicit-efforts-to-obtain-talent-and-equipment</link>
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                            <![CDATA[ Taiwan's National Security Bureau claims that China is intensifying efforts to steal semiconductor process technologies and other chip-related know-how from Taiwan as international restrictions get more severe. ]]>
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                                                                        <pubDate>Wed, 08 Apr 2026 10:05:58 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/jNq3T5Z4DQqsDU65zadz5A-1280-80.png">
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                                                            <title><![CDATA[ Intel joins Elon Musk's TeraFab project — 'Intel is proud to join the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology' ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-joins-elon-musks-terafab-project-intel-is-proud-to-join-the-terafab-project-with-spacex-xai-and-tesla-to-help-refactor-silicon-fab-technology</link>
                                                                            <description>
                            <![CDATA[ As Intel joins Elon Musk's TeraFab project, Lip-Bu Tan expects Elon Musk to reimagine the semiconductor industry. ]]>
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                                                                        <pubDate>Tue, 07 Apr 2026 15:34:11 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EZCTC9MCaqNdiAMUCqPqEK-1280-80.jpg">
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                                                            <title><![CDATA[ Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-reportedly-in-talks-with-google-and-amazon-over-advanced-packaging</link>
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                            <![CDATA[ Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs. ]]>
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                                                                        <pubDate>Tue, 07 Apr 2026 10:20:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/mmPcxQxEVpUKNJBz8zqMnA-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Justin Sullivan]]></media:credit>
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                                                            <title><![CDATA[ US lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China — bipartisan proposal would ban lithography equipment for Huawei, SMIC, and others ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/u-s-lawmakers-aim-to-ban-export-of-duv-chipmaking-and-etching-tools-to-leading-firms-in-china-bipartisan-proposal-would-ban-lithography-equipment-for-huawei-smic-and-others</link>
                                                                            <description>
                            <![CDATA[ Bipartisan group of U.S. senators propose to impose blanket ban on export of advanced DUV lithography and etching tools to Chinese companies known to have worked with China's military, such as CXMT, Huawei, SMIC, and YMTC. ]]>
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                                                                        <pubDate>Mon, 06 Apr 2026 19:59:55 +0000</pubDate>                                                                                                                                <updated>Mon, 06 Apr 2026 20:00:06 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/5Mq4J9jfCyPqV9qsyhUWe8-1280-80.jpg">
                                                            <media:credit><![CDATA[SMIC]]></media:credit>
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                                                            <title><![CDATA[ TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-reportedly-plans-to-build-12-fabs-four-packaging-facilities-in-arizona-plan-purportedly-part-of-taiwans-agreed-usd500-million-investment-in-the-us</link>
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                            <![CDATA[ New rumor indicates that TSMC is looking forward to expand its presence in the U.S. to 12 fabs and four packaging facilities. ]]>
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                                                                        <pubDate>Fri, 03 Apr 2026 11:55:07 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
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                                                            <title><![CDATA[ Intel buys back 49% stake in Ireland Fab Joint Venture — takes full control over Fab 34 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/intel-buys-back-49-percent-stake-in-ireland-fab-jv-gains-full-control-over-fab-34</link>
                                                                            <description>
                            <![CDATA[ In a mutually beneficial deal, Intel repurchases 49% of Fab 34 from Apollo for $14.2 billion, reducing pressure on its margins, but paying a hefty $3 billion premium to the financial company. ]]>
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                                                                        <pubDate>Thu, 02 Apr 2026 10:40:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XSmGCAUBerwsBhZgUEkxS-1280-80.jpg">
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                                                            <title><![CDATA[ The global helium shortage is a direct threat to the chipmaking supply chain — disruption impacts critical processes, high-capacity HDDs, and alternative supplies are plagued by delays ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/the-global-helium-shortage-is-a-direct-threat-to-chipmaking</link>
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                            <![CDATA[ Some industry analysts expect it will take Qatar around five years to regain lost capacity. ]]>
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                                                                        <pubDate>Tue, 31 Mar 2026 13:20:26 +0000</pubDate>                                                                                                                                <updated>Wed, 01 Apr 2026 16:58:09 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/kYurY4V2cEYRJHFrJ2ALxf-1280-80.png">
                                                            <media:credit><![CDATA[QatarEnergy]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[QatarEnergy Ras Laffan]]></media:description>                                                            <media:text><![CDATA[QatarEnergy Ras Laffan]]></media:text>
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                                                            <title><![CDATA[ TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case — former engineer accused of stealing 2nm technical info, faces a total of up to 20 years in prison if found guilty ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tsmc-industrial-espionage-saga-heading-to-verdict-next-month-in-unprecedented-taiwan-national-security-act-case-former-engineer-accused-of-stealing-2nm-technical-info-faces-a-total-of-up-to-20-years-in-prison-if-found-guilty</link>
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                            <![CDATA[ One of the three landmark cases involving the theft of trade secrets from TSMC has run through investigative and court proceedings, and a verdict is scheduled for April 27. ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 16:33:29 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Bruno Ferreira) ]]></author>                    <dc:creator><![CDATA[ Bruno Ferreira ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/BgRfzQhj7htYiYMyXELhKa-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Corporate espionage]]></media:description>                                                            <media:text><![CDATA[Corporate espionage]]></media:text>
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                                                            <title><![CDATA[ Analyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an unattainable dream? ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/analyzing-elon-musks-terafab-a-step-towards-tesla-and-spacexs-partial-vertical-integration-or-an-unattainable-dream</link>
                                                                            <description>
                            <![CDATA[ Elon Musk's TeraFab has been announced, and the first employees are now being hired. But can this venture scale to all of its terawatt glory? Or will it just help Tesla, SpaceX, and xAI land additional chips they cannot get from regular partners? ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 15:51:26 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/yQaGAkqxhQh83Cd9CuzDWg-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
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                                                            <title><![CDATA[ Chinese chip industry leaders admit the country lags five to ten years behind in AI data center chips — AI demand is straining equipment and talent supply  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chinese-chip-industry-leaders-say-ai-demand-is-straining-equipment-and-talent-supply</link>
                                                                            <description>
                            <![CDATA[ Senior Chinese semiconductor executives said AI-driven demand is creating bottlenecks across equipment, passive components, and workforce capacity. ]]>
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                                                                        <pubDate>Mon, 30 Mar 2026 13:27:40 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ScWkdXEcbCzcmrjizukTn7-1280-80.jpg">
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                                                            <title><![CDATA[ Air Liquide opens Taiwan factory as helium shortage tightens around chip makers — 200 specialized helium containers stranded near the Strait of Hormuz ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/air-liquide-opens-taiwan-factory-as-helium-shortage-tightens-around-chip-makers</link>
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                            <![CDATA[ French industrial gas supplier Air Liquide opened a new factory near the port of Taichung, Taiwan, on Wednesday, as the semiconductor industry faces a worsening helium shortage. ]]>
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                                                                        <pubDate>Fri, 27 Mar 2026 16:22:19 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Mar 2026 16:24:44 +0000</updated>
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                                                    <category><![CDATA[Tech Industry]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/vyGvmuYuEW77t9igShPB4U-1280-80.png">
                                                            <media:credit><![CDATA[Getty Images]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[The Strait of Hormuz]]></media:description>                                                            <media:text><![CDATA[The Strait of Hormuz]]></media:text>
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                                                            <title><![CDATA[ Elon Musk's Terafab semiconductor project could cost $5 trillion, Bernstein claims — herculean effort would cost more than 70% of the total yearly US government budget ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/elon-musks-terafab-semiconductor-project-could-cost-usd5-trillion-bernstein-claims-herculean-effort-would-cost-more-than-70-percent-of-the-total-yearly-us-government-budget</link>
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                            <![CDATA[ To build 1 TW of AI silicon per year, Elon Musk's TeraFab would need to process 22.4 million Rubin Ultra GPU wafers, 2.716 million Vera CPU wafers, and 15.824 million HBM4E wafers annually using from 142 to 358 fabs, according to Bernstein. ]]>
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                                                                        <pubDate>Thu, 26 Mar 2026 10:40:40 +0000</pubDate>                                                                                                                                <updated>Fri, 27 Mar 2026 12:41:33 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XSmGCAUBerwsBhZgUEkxS-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                        <media:description><![CDATA[To build compute chips that consume 1 TW per year, Elon Musk&#039;s TeraFab project will need to operate up to 358 modern fabs worth $5 trillion, according to Bernstein. ]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ SK hynix places record $8 billion order for ASML EUV lithography machines — should pay for up to 30 EUV machines over two years, serving HBM and advanced DRAM production ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-places-record-8-billion-order-for-asml-euv-lithography-machines</link>
                                                                            <description>
                            <![CDATA[ SK hynix disclosed in a regulatory filing on Tuesday that it will purchase 11.9 trillion won ($7.9 billion) worth of EUV lithography equipment from ASML. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 16:38:01 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/NzktnSTcWDJPvdfKLwMi9F-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Bloomberg]]></media:credit>
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                                                            <title><![CDATA[ Microsoft-backed start-up raises $40 million for helium atom beam lithography that could print chips at atomic resolution — 0.1nm beam is 135 times narrower than ASML's EUV light ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/norwegian-start-up-raises-40-million-for-helium-atom-beam-lithography</link>
                                                                            <description>
                            <![CDATA[ Lace Lithography raised $40 million in Series A funding on Monday to develop a chipmaking tool that uses a helium atom beam instead of light to pattern silicon wafers. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 13:02:21 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/iiBPT3tVuXkSdD4xCKSR9m-1280-80.png">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Trump administration targets $4 trillion Pax Silica investment fund for semiconductors — the US will start with a $250 million investment for global consortium ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/trump-administration-targets-4-trillion-pax-silica-investment-fund-for-semiconductors</link>
                                                                            <description>
                            <![CDATA[ The Trump administration is targeting $4 trillion Pax Silica investment for semiconductors. It’s not currently clear how the Trump administration arrived at the $4 trillion figure, or how it will ultimately materialize. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 10:30:00 +0000</pubDate>                                                                                                                                <updated>Thu, 26 Mar 2026 14:55:22 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/L4SJRSyzF4WTiszKTik7Fe-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel Xe Graphics]]></media:description>                                                            <media:text><![CDATA[Intel Xe Graphics]]></media:text>
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                                                            <title><![CDATA[ Elon Musk unveils $20 billion ‘TeraFab’ chip project to make chips, memory, and package processors all under one roof — targets a terawatt of annual compute ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/elon-musk-formally-launches-20-billion-terafab-chip-project</link>
                                                                            <description>
                            <![CDATA[ Tesla and SpaceX CEO, Elon Musk, announced Saturday night that his TeraFab semiconductor project will be built on the Tesla campus in eastern Travis County, Austin, Texas, as a joint venture. ]]>
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                                                                        <pubDate>Sun, 22 Mar 2026 15:34:22 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/PoCxHQ8gKEscb2NWQov7wZ-1280-80.png">
                                                            <media:credit><![CDATA[Tesla / SpaceX]]></media:credit>
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                                                            <title><![CDATA[ 'Silicon' is a new five-pound art book charting the semiconductor revolution with full-page die shots and commentary — 384 page tome is $99 to pre-order now ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/silicon-is-a-new-five-pound-art-book-charting-the-semiconductor-revolution-with-full-page-die-shots-and-commentary-384-page-tome-is-usd99-to-pre-order-now</link>
                                                                            <description>
                            <![CDATA[ Silicon, Arena’s stylish and premium “coffee table book like no other,” is up for pre-order now priced at $99. ]]>
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                                                                        <pubDate>Sun, 22 Mar 2026 12:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/KCXJiXMNkv46M7ty4Dy7HT-1280-80.jpg">
                                                            <media:credit><![CDATA[Arena Magazine]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Silicon]]></media:description>                                                            <media:text><![CDATA[Silicon]]></media:text>
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                                                            <title><![CDATA[ Supermicro employees accused of smuggling $2.5 billion worth of Nvidia hardware to China — perps used a hairdryer to move serial numbers between real hardware and thousands of dummy servers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/super-micro-employees-accused-of-smuggling-usd2-5-billion-worth-of-nvidia-hardware-to-china-perps-used-a-hairdryer-to-move-serial-numbers-between-real-hardware-and-thousands-of-dummy-servers</link>
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                            <![CDATA[ Three Super Micro employees have been charged with conspiring to unlawfully divert cutting edge U.S. artificial intelligence technology to China. ]]>
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                                                                        <pubDate>Fri, 20 Mar 2026 13:05:10 +0000</pubDate>                                                                                                                                <updated>Fri, 20 Mar 2026 17:28:39 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/7V9ueZXh85UyPKGS7ipzR8-1280-80.jpg">
                                                            <media:credit><![CDATA[US DOJ]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[CCTV scenes from the Southeast Asia warehouse]]></media:description>                                                            <media:text><![CDATA[CCTV scenes from the Southeast Asia warehouse]]></media:text>
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                                                            <title><![CDATA[ Tesla hiring semiconductor fabs construction manager — Elon Musk's ambitious Terafab project begins ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/tesla-hiring-semiconductor-fabs-construction-manager-elon-musks-ambitious-terafab-project-begins</link>
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                            <![CDATA[ Tesla begins to form a core team behind its Terafab project, which will define the fab and spearhead its construction and tamp. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 16:47:53 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/b7s6fZ6YvGNVJ486EieMkF-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Fabrice Coffrini]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Elon Musk]]></media:description>                                                            <media:text><![CDATA[Elon Musk]]></media:text>
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                                                            <title><![CDATA[ How Nvidia's $20 billion Groq 3 LPU deal reshapes the Nvidia Vera Rubin Platform — Samsung 4nm process serves as bedrock for SRAM-based AI accelerator chip ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/nvidias-20-billion-groq-deal-produces-its-first-chip</link>
                                                                            <description>
                            <![CDATA[ Nvidia unveiled the Groq 3 language processing unit at GTC 2026 in San Jose on Monday, marking the first chip to emerge from its $20 billion licensing and talent deal with Groq. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 15:45:10 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/49QX9DhQjJDwWiR2NPT9tD-1280-80.jpg">
                                                            <media:credit><![CDATA[Nvidia]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Rubin GPU next to Groq LPU]]></media:description>                                                            <media:text><![CDATA[Rubin GPU next to Groq LPU]]></media:text>
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                                                            <title><![CDATA[ Researchers reach superconductivity at ambient pressure, record high temperature — milestone of -122°C reached by using pressure quenching, still 140 degrees off room temperature target ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/researchers-reach-superconductivity-at-ambient-pressure-record-high-temperature-milestone-of-122-c-reached-by-using-pressure-quenching-still-140-degrees-off-room-temperature-target</link>
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                            <![CDATA[ Researchers from the University of Houston managed to increase the critical temperature for superconductivity by about 18 K at ambient pressure, but at −122°C, they are still 140°C away from the target. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 13:27:31 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/wS6jkGXv2vnZpFsMSa6kZN-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
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                                                            <title><![CDATA[ AMD and Samsung ink memory supply memorandum for EPYC and Instinct products — unprecedented deal also includes scope for foundry partnership ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/amd-and-samsung-ink-memory-supply-memorandum-for-epyc-and-instinct-products-unprecedented-deal-also-includes-scope-for-foundry-partnership</link>
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                            <![CDATA[ Samsung to remain primary HBM memory supplier for AMD's AI accelerators as the companies look into possible foundry relationship. ]]>
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                                                                        <pubDate>Thu, 19 Mar 2026 11:18:47 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/SUTR9jxWe8aiYRjXPCPnVj-1280-80.jpg">
                                                            <media:credit><![CDATA[AMD]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[AMD]]></media:description>                                                            <media:text><![CDATA[AMD]]></media:text>
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                                                            <title><![CDATA[ Meta's new MTIA lineup joins hyperscalers' unified push for dedicated inferencing chips — companies diversify AI chips in effort to diversify from sole reliance on Nvidia ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/metas-mtia-chip-lineup-joins-hyperscaler-push-to-replace-nvidia-at-inference</link>
                                                                            <description>
                            <![CDATA[ As Meta introduces its lineup of new AI chips, the company joins other tech giants in diversifying the AI accelerators used for specific workloads, and says that mainstream GPUs built for large-scale pre-training are less cost-effective for inference workloads. ]]>
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                                                                        <pubDate>Mon, 16 Mar 2026 18:19:56 +0000</pubDate>                                                                                                                                <updated>Fri, 20 Mar 2026 13:59:25 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/SeB9TjZd9YKNR5bhshrE4j-1280-80.png">
                                                            <media:credit><![CDATA[Meta]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Meta MTIA]]></media:description>                                                            <media:text><![CDATA[Meta MTIA]]></media:text>
                                <media:title type="plain"><![CDATA[Meta MTIA]]></media:title>
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