Noctua Unveils 3D-Printable Direct Die Kit for Delidded AM5 CPUs

Noctua
(Image credit: Noctua)

Noctua on Tuesday introduced its NM-DD1, a special kit that allows installation of the company's coolers on delidded AMD processors in AM5 packaging. This kit can be purchased direct from the manufacturer, or you can 3D print the needed spacers and source your own fasteners. The kit was co-developed with Roman 'Der8auer' Hartung, a professional overclocker and an exotic cooling expert.

One of the ways to enhance cooling for overclocked AMD's Ryzen 7000-series processors is to remove their integrated heat spreader (delidding them) and attach the cooler directly to the dies. According to Noctua, this ensures more efficient heat transfer from the heat-generating CCD chiplets to the cooler and reduces CPU temperatures by 10C – 15C. Such a boost in thermal headroom can be leveraged to significantly reduce fan speeds and related noise levels, increase CPU turbo boost frequencies, or increase the overclocking potential.

Standard coolers are not designed for use with delidded CPUs, which complicates the endeavor. But Noctua's direct die kit for AMD's delidded processors greatly simplifies the task. Of course, the greatest concerns associated with removing the IHS are the risks of damaging the processor during the delidding process and voiding the warranty. Those risks remain, but at least using Noctua's coolers with delidded CPUs is simpler.

The NM-DD1 kit contains spacers placed beneath the heatsink's securing brackets to counterbalance the height of the removed IHS and extended custom screws for reattachment of the brackets with the spacers installed. The other hardware required for delidding must be purchased separately. To further improve cooling performance, the NM-DD1 can be coupled with Noctua's recently introduced offset AM5 mounting bars, potentially leading to an additional 2C drop in temperature.

(Image credit: Noctua)

"Delidding and direct die cooling will void your CPU's warranty and bear a certain risk of damaging it, so this certainly isn't for everyone," said Roland Mossig (Noctua CEO). "However, the performance gains to be had are simply spectacular, typically ranging from 10 to 15°C but in some cases, we have even seen improvements of almost 20°C in combination with our offset mounting bars, so we are confident that this is an attractive option for enthusiast users. Thanks to Roman for teaming up with us in order to enable customers to implement this exciting tuning measure with our CPU coolers!"

The NM-DD1 kit can be obtained exclusively from Noctua's website for €4.90. Alternatively, customers can 3D-print the kit's spacers at home using STL files from Printables.com. For assembly, either four M3x12 screws (for NM-DDS1) or one M4x10 screw (for NM-DDS2) will be needed.

Anton Shilov
Freelance News Writer

Anton Shilov is a Freelance News Writer at Tom’s Hardware US. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • -Fran-
    If only AMD would sell a CPU variant without the IHS... Le sigh.

    Regards.
    Reply
  • bit_user
    How accurate are 3D printers? This is one of those cases where it seems like you'd really want at least 0.1 mm accuracy. It seems like you'd also really need to worry about the compressability of the plastic. I'd rather just use a precision-machined metal shim, TBH. It's not worth saving a few bucks, when the life of a several-hundred $ CPU could be at stake.

    -Fran- said:
    If only AMD would sell a CPU variant without the IHS...
    They won't. It'd be too fragile for a consumer product.

    Just use this, and it's simple enough:
    https://www.thermal-grizzly.com/en/products/595-amd-ryzen-7000-delid-die-mate-en
    Reply
  • hotaru251
    bit_user said:
    How accurate are 3D printers?
    came here to say this.

    The accuracy/levelness of prints varies and someone who doesnt understand how to print properly on a lower end model may not have a correct print w/o knowing.
    when you are direct die cooling if its not right you can very easily kill your cpu.
    Reply
  • Co BIY
    Probably worth confirming the measurements of your final print before final assembly. Micrometers are pretty easy to come by.

    Seems like this would be more worthwhile on the Intel heaters. But maybe their IHS's are more efficient so less gains available.
    Reply
  • thestryker
    -Fran- said:
    If only AMD would sell a CPU variant without the IHS... Le sigh.

    Regards.
    While I think this would be the best solution given that they could sell them with direct die frames to replace the ILM I also don't think it would ever happen. I'd happily take an IHS that isn't super thick which would conduct heat better.
    Reply
  • -Fran-
    thestryker said:
    While I think this would be the best solution given that they could sell them with direct die frames to replace the ILM I also don't think it would ever happen. I'd happily take an IHS that isn't super thick which would conduct heat better.
    I don't disagree. I would be ok with a better IHS, but if they actually did that, then the Z height would have to change and AM4 cooler compatibility would break anyway. At that point, may as well just re-work the whole cooler compatibility.

    Considering the alternative of having that horrible IHS, as I said, I would not mind them re-working the IHS and breaking AM4 cooler compatibility if it improves thermals close to what delidding does.

    They save cost on materials, but add a headache from a support/warranty standpoint. I don't think it's impossible to price accordingly, but it'll depend on whether or not AMD wants to segment their small market even more.

    Regards.
    Reply
  • thestryker
    -Fran- said:
    I don't disagree. I would be ok with a better IHS, but if they actually did that, then the Z height would have to change and AM4 cooler compatibility would break anyway. At that point, may as well just re-work the whole cooler compatibility.
    I'd like them to do just that and integrate some form of offset while they're at it. While nothing will be as good as direct die (which can be done totally safely see the Thermal Grizzly direct die frames) I think this and a better IHS would be good enough.
    Reply
  • bit_user
    thestryker said:
    I'd like them to do just that and integrate some form of offset while they're at it. While nothing will be as good as direct die (which can be done totally safely see the Thermal Grizzly direct die frames) I think this and a better IHS would be good enough.
    I'd love to see a CPU use a vapor chamber instead of an IHS. It'd probably be too expensive for non-XTreme models. But, AM5 is probably just a little too short for that.

    Vapor chambers are so good at distributing heat that I think you wouldn't even need any offsetting brackets.
    Reply
  • thestryker
    bit_user said:
    I'd love to see a CPU use a vapor chamber instead of an IHS. It'd probably be too expensive for non-XTreme models. But, AM5 is probably just a little too short for that.

    Vapor chambers are so good at distributing heat that I think you wouldn't even need any offsetting brackets.
    I don't think a vapor chamber would be better without being directly hooked into the CPU cooler. While they are much better at heat distribution you still have less thermal transfer than through a single thin layer due to how you have to strengthen a vapor chamber.

    I think Cooler Master at Computex had a prototype vapor chamber air cooler which has the potential to be huge for exactly the reason you said: heat distribution. MTL has CPU cores on one side with GPU on the opposite so I don't think standard cooler design is going to work much longer at the high end as things are now. I'm also curious how AIO/waterblock designs might change as well given that the primary heat sources won't be centered for any consumer CPUs.
    Reply
  • bit_user
    thestryker said:
    I don't think a vapor chamber would be better without being directly hooked into the CPU cooler.
    My ideal scenario is die -> vapor chamber -> "direct-touch" heat pipes

    thestryker said:
    While they are much better at heat distribution you still have less thermal transfer than through a single thin layer due to how you have to strengthen a vapor chamber.
    The problem with direct-die cooling is that you can't go from die -> heat pipes. You need a heat spreader of some sort, whether it's part of the heatsink or the CPU. Even a waterblock effectively acts as a heat spreader. The best heat spreader is a vapor chamber.

    High-end GPUs have shown that crazy amounts of heat can be dissipated by going die -> vapor chamber -> heat pipes.
    Reply