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Third Chinese company begins HBM memory production for AI processors: Report
By Anton Shilov published
Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.
SK hynix posts record revenues and profits amid surge of HBM demand
By Anton Shilov published
Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.
Overclocker hits DDR5-12054 on pure air cooling
By Christopher Harper published
G.Skill Trident Z5 reaches a record-breaking DDR5-12054 frequency with a purely air-cooled system.
G.Skill launches DDR5-6400 C30 96GB memory kit for Intel and AMD CPUs
By Hassam Nasir published
G.Skill has launched new low-latency and large-capacity DDR5-6400 CL30 96GB (2x48GB) memory kits.
RAM Benchmark Hierarchy 2025: DDR5, DDR4 for AMD, Intel CPUs
By Zhiye Liu last updated
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
Patriot celebrates 40th Anniversary with Viper Xtreme 5 DDR5-9600 RAM
By Hassam Nasir published
Patriot marked its 40th Anniversary as it unveiled a handful of new products at CES 2025.
G.Skill showcases DDR5-10600 RAM overlock and DDR5-8133 CSODIMMs
By Aaron Klotz published
G.Skill demos DDR5-10600 and DDR5-6800 in a 1:1 ratio on AMD's X870 platform.
SK hynix to showcase 16-layer HBM3E, 122TB enterprise SSD, LPCAMM2, and more at CES
By Kunal Khullar published
The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance
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