Latest about DUV
Chinese chipmaking tool roadmaps examined — Beijing's nascent lithography tools target DUV production at five machines a year, and an EUV prototype with no chips
Premium Ultimately, three markers will indicate whether China’s domestic DUV program is a legitimate rival or yet more state-sanctioned hot air.
Shanghai Aishengna named as the maker of China's first domestic immersion DUV chipmaking tools
Premium Aishengna has been named by a single source who declined to be named, and its shareholders, SMEE, and Yuliangsheng didn’t respond to requests for comment.
China begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims
A state-backed company in Shanghai has begun mass-producing immersion deep ultraviolet lithography machines and is due to deliver the first units this year.
Nikon weaponizes lower prices to break ASML's lithography monopoly
Nikon will try to claw back lithography customers by selling argon fluoride (ArF) tools for less than the market leader, ASML.
ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond
Premium ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.
U.S. lawmakers demand sales ban on chipmaking tools to China
Bipartisan group of lawmakers want the U.S. government to impose export controls on all wafer fab equipment bound to China except those that can be made locally and make allies do the following.
Chinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines
Premium Chinese fabs are quietly extending the useful life and performance of older ASML deep ultraviolet lithography systems by upgrading key subsystems, as Beijing pushes to sustain advanced chip output.
New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
Premium Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.
