DRAM
Latest about DRAM
Best RAM for Gaming: DDR4, DDR5 Kits for 2024
By Zhiye Liu last updated
Here is the best RAM for gaming we’ve tested: computer memory deal for video editing and graphics-heavy applications.
Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026
By Anton Shilov published
CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI.
Micron is the last memory maker to join the EUV party
By Anton Shilov published
Micron reiterates its plans to use EUV for high-volume DRAM production next year as it starts pilot production on a 1-gamma node.
Leak suggests that DDR6 development has already started, aiming for 21 GT/s
By Anton Shilov published
Industry looking forward to develop DDR6 already: No decision on signaling standard have been made yet, but the final spec is expected in Q2 2025.
Huawei backs HBM memory manufacturing in China to sidestep crippling US sanctions
By Anton Shilov published
Huawei is reportedly behind CXMT's development of HBM memory.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
By Anton Shilov published
SK hynix selects Indiana for its first HBM packaging fab in the USA.
Samsung puts 3D DRAM on the roadmap, stacked DRAM to follow
By Anton Shilov published
Samsung envisions vertical channel transistor, stacked DRAMs in the next 10 years.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
By Anton Shilov published
Indiana chips and Indiana nights, starting in 2028.
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