Latest about DRAM
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
Micron shows massive 256GB DDR5-8800 memory sticks — High-capacity double-height 20-watt MCRDIMM modules come in different flavors
Micron demonstrates 256 GB DDR5-8800 MCRDIMM modules for Intel's Granite Rapids processors.
TSMC and SK Hynix team up for HBM4 co-production: Report
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
China's CXMT reportedly aims to make HBM memory for AI chips
CXMT to compete against Micron, Samsung, and SK Hynix for lucrative HBM memory market, says report.
Rising memory prices and AI demand gives SK Hynix its first profit since Q3 2022
Sales of DDR5, HBM3, and LPDDR helped SK Hynix to boost sales and narrow losses.
Chinese DRAM maker CXMT 18.5nm node allegedly complies with U.S. export rules
Chinese maker of DRAM renames its 17nm process technology to 18.5nm, claims it fell short of standard, to comply with U.S. export rules and get advanced fab tools.
TSMC tandem builds exotic new memory with radically lower latency and power consumption
TSMC and ITRI to jointly develop ultra-low-power spin-orbit-torque magnetic random-access memory.
Micron displays next-gen LPCAMM2 modules for laptops at CES 2024
Micron showcases next-generation memory LPCAMM2 modules for laptops and small form-factor desktops.
