Latest about DRAM
Rising memory prices and AI demand gives SK Hynix its first profit since Q3 2022
Sales of DDR5, HBM3, and LPDDR helped SK Hynix to boost sales and narrow losses.
Chinese DRAM maker CXMT 18.5nm node allegedly complies with U.S. export rules
Chinese maker of DRAM renames its 17nm process technology to 18.5nm, claims it fell short of standard, to comply with U.S. export rules and get advanced fab tools.
TSMC tandem builds exotic new memory with radically lower latency and power consumption
TSMC and ITRI to jointly develop ultra-low-power spin-orbit-torque magnetic random-access memory.
Micron displays next-gen LPCAMM2 modules for laptops at CES 2024
Micron showcases next-generation memory LPCAMM2 modules for laptops and small form-factor desktops.
Samsung develops low-latency, low-power DRAM with performance that allegedly eclipses DDR5
Samsung talks Low Latency Wide I/O (LLW) DRAM: 128 GB/s per module.
Micron unveils LPCAMM2 - bringing LPDDR5X to smaller form factor memory modules
Micron puts LPDDR5X memory into LPCAMM2 modules to reduce power consumption and increase the performance of modern laptops.
TSMC to open Japan's most advanced semiconductor production facility in February
TSMC is set to formally open Japan's most advanced semiconductor production facility capable of making 28nm chips in late February.
Micron settles IP theft lawsuit with the Chinese state-owned chipmaker
Micron Technologies Inc. settled the matter with the state-owned chip maker 'Jinhua Integrated Circuit Co.' and also has investment plans to expand its chip manufacturing in the country.
