Latest about Semiconductors
TSMC fab equipment demand nearly doubles in six months
TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
The current state of Hybrid Bonding in 2026
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
China's DUV technology 'at a similar stage to ASML in 2004,' analyst claims
Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.
Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
Intel 14A defect density is dropping faster than the company expected
David Zinsner, chief financial officer of Intel, boasted at a conference
EPA faces lawsuit over claims it fast-tracked approval of toxic 'data center chemicals'
These chemicals are crucial for semiconductor manufacturing, but they must also come with a lot of safety rules to prevent them from leaking out and poisoning the environment.
Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark
Premium Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX rack's architecture and published the first third-party benchmark of the hardware.
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card
Premium Heading into production during the tightest DRAM market in more than a decade.
