EUV
Latest about EUV
![ASML](https://cdn.mos.cms.futurecdn.net/8UBxmFkiTpTJkoES5eRCPi-320-80.jpg)
TSMC says it doesn't need High-NA EUV chipmaking tools for 1.6nm-class node, but Intel has championed the tech
By Anton Shilov published
TSMC says it will not need a high-NA litho tool for its A16 technology but will keep exploring it for A16 and beyond.
![ASML](https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-320-80.jpg)
ASML ships its second High-NA EUV litho tool to unspecified client
By Anton Shilov published
ASML begins to ship its High-NA EUV lithography system to the second customer
![Samsung](https://cdn.mos.cms.futurecdn.net/NQoPjDxnJHVZ5bhYsBdY34-320-80.jpg)
Samsung to double investment in Texas fab, spend $44 billion to build leading-edge chips: Report
By Anton Shilov published
Samsung to add another fab module, an advanced packaging facility, and an R&D center to its Taylor, Texas, campus.
![TSMC](https://cdn.mos.cms.futurecdn.net/kbr9DngyGsjQsXPV5EWmnV-320-80.jpg)
Taiwan earthquake causes estimated $62 million in damage and disruptions for TSMC
By Mark Tyson published
Insiders talk about broken beams, columns, and cracked walls.
![ASML](https://cdn.mos.cms.futurecdn.net/gnSjUMTXWUw4U9XVjK4Kri-320-80.jpg)
Samsung rep says High-NA EUV is good for logic, but might have cost issues for memory fabrication
By Anton Shilov published
Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.
![ASML EUV machine](https://cdn.mos.cms.futurecdn.net/VeUsd9vM4WBszDumWSs7gJ-320-80.jpg)
Intel and ASML achieve 'First Light' milestone with world's most advanced chipmaking tool
By Anton Shilov published
ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.
![ASML](https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-320-80.jpg)
ASML explores Hyper-NA chipmaking tools as the next step in shrinking transistors
By Anton Shilov published
ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s.
![Intel](https://cdn.mos.cms.futurecdn.net/bY2KNEZf57HJG4Rkadxbni-320-80.png)
Equipment delivery to Intel's Ohio fab delayed for several weeks
By Anton Shilov published
The transportation of Intel's oversized equipment to its Ohio fab is delayed to February 17.
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