EUV

Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.

ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.

ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s.

The transportation of Intel's oversized equipment to its Ohio fab is delayed to February 17.

Intel reportedly delays $20 billion Ohio fab project due to govt incentives and chip demand.

ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools.

Driven by pre-orders for advanced wafer fab equipment, ASML's orders bookings increased to $10 billion in Q4 2023.

German coalition finally agrees to provide Intel and TSMC billions of Euros in funding.

Germany vows to subsidize Intel and TSMC fabs despite a budget crisis, though Intel and Wolfspeed reportedly received firm fab funding commitments from the German government.

Delayed German budget may have a drastic effect on German subsidies for new Intel's and TSMC's fabs in the country.