ASML
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Zeiss expands German site that caps ASML's EUV scanner output
By Luke James Published
Zeiss Semiconductor Manufacturing Technology is adding around 25,000 square meters of production and production-adjacent space at Oberkochen in southern Germany.

Dutch chip sector at very high risk of Chinese interference, government-funded study warns
By Luke James Published
The Hague Centre for Strategic Studies has rated the Dutch semiconductor industry as being at very high risk of Chinese foreign interference.

ASML's planned Low-NA EUV machine price hikes reportedly anger TSMC
By Anton Shilov Published
Premium Low-NA, high stakes

ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
By Anton Shilov Published
ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV
By Etiido Uko Published
Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

US Secures Netherlands for Pax Silica Alliance in key win for strategic chip alliance
By Jon Martindale Published
Premium Inside the US Pax Silica Alliance with the Netherlands.

Rare ASML Special Edition Monopoly board unearthed in social media trade
By Mark Tyson Published
We just witnessed a significant semiconductor industry related non-cash trade deal take place on Twitter/X.

ASML denies US government report that its EUV chipmaking tool was shipped to China
By Anton Shilov Published
U.S. Commerce Secretary Lutnick expresses concerns in a conversation with ASML executives that China has an EUV lithography system as ASML denies shipping such scanners to the PRC.

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech
By Luke James Published
Imec, ASML, and TSMC have integrated both n-type and p-type transistors with atomically thin 2D channels on a single 300mm wafer.

Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%
By Etiido Uko Published
Chinese startup Prinano claims it produced 8-inch photonic chip wafers without DUV lithography, using nanoimprint technology that cuts costs by 90%.
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