ASML
Latest about ASML
China vexed at expansion of ASML chip tool export controls, reveals ministry statement
By Anton Shilov published
The Chinese government is not satisfied with the Dutch government's decision to export control ASML's Twinscan NXT:1970i and 1980i.
Russia bypasses sanctions and obtains spare parts for decades old ASML chip making machines: Report
By Anton Shilov published
Russian companies get spare parts for ASML's PAS 5500 lithography steppers from 1990s – 2000s through China-based intermediaries.
Japanese scientists develop simplified EUV scanner that can make production of chips considerably cheaper
By Anton Shilov published
OIST's simplified EUV litho system uses two mirrors instead of six.
New US government rules to allow export of some equipment to China by ASML, Tokyo Electron
By Anton Shilov published
The U.S. intends to add 120 Chinese entities to its Entity List, to close loopholes that enable Chinese chipmakers to obtain American chipmaking tools.
The U.S. has sanctioned 18 Chinese fabs, dozens remain in white zone
By Anton Shilov published
The U.S. government approves shipments of wafer fab equipment to many Chinese fabs, other are banned. Question is, can those tools be installed in banned fabs?
U.S. planning 'draconian' sanctions against China's semiconductor industry: Report
By Anton Shilov published
U.S. government wants to further restrict curbs for China's semiconductor sector as foreign companies still sell fairly advanced tools to Chinese entities.
US, China Chip War may continue for decades, says former ASML CEO
By Dallin Grimm published
The Chip War is fought over ideology, not factual basis, says tech boss
Japanese researchers testing particle accelerator for chipmaking — researchers claim EUV-like lithography capabilities
By Anton Shilov published
Free-electron laser generated by energy recovery linear accelerator could be used for chipmaking, perhaps, in the long-term future. Perhaps.
Huawei patent reveals 3nm-class process technology plans — China continues to move forward despite US sanctions
By Anton Shilov published
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
By Paul Alcorn published
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
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