ASML
Latest about ASML

ASML CEO says Elon Musk is 'very serious' about TeraFab chipmaking megaproject, confirms direct talks
By Luke James published
ASML CEO Christophe Fouquet said on Wednesday that he has spoken directly with Elon Musk about the TeraFab semiconductor project.

ASML to equip India’s first commercial chip fab
By Luke James published
ASML and Tata Electronics have signed a memorandum of understanding to deploy ASML's equipment at India's first fab.

ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond
By Luke James published
Premium ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.

US lawmakers amend new restrictions on Chinese chipmakers — MATCH Act's blanket restrictions removed from select chipmaking tools
By Anton Shilov published
U.S. lawmakers remove countrywide exports ban on cryogenic etching tools from the MATCH Act, yet Chinese companies could barely get them anyway.

U.S. lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China
By Anton Shilov published
Chinese chipmakers will lose ability to buy advanced tools for trailing node fabs, if new proposes becomes the law.

SK hynix places record $8 billion order for ASML EUV lithography machines
By Luke James published
SK hynix disclosed in a regulatory filing on Tuesday that it will purchase 11.9 trillion won ($7.9 billion) worth of EUV lithography equipment from ASML.

'Silicon' is a new five-pound art book charting the semiconductor revolution with full-page die shots and commentary
By Mark Tyson published
Silicon, Arena’s stylish and premium “coffee table book like no other,” is up for pre-order now priced at $99.

ASML workers still in the dark seven weeks after 1,700 management cuts announced
By Luke James published
The prolonged uncertainty is generating internal unrest, according to an ASML spokesperson who spoke to Dutch broadcaster Omroep Brabant.

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
By Anton Shilov published
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
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