Latest about ASML
ASML explores Hyper-NA chipmaking tools as the next step in shrinking transistors
ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s.
ASML warns that more U.S. sanctions against China could have a major impact on its business
ASML's backlog in China totals tens of billions of dollars, but geopolitical tensions could impact the company's ability to fulfill it.
ASML's High-NA chipmaking tool will cost $380 million
AMSL's High-NA lithography machine to cost more than twice as much as existing Low-NA tools.
Evidence mounts that TSMC won't adopt next-gen EUV chipmaking tools until 1nm debuts in the 2030 timeframe
Fab toolmaker tells DigiTimes that TSMC will likely adopt High-NA at 1nm.
ASML fires back at accusations that its next-gen High-NA EUV chipmaking tools are too expensive
ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools.
ASML triples order bookings in Q4 2023 thanks to demand for EUV tools
Driven by pre-orders for advanced wafer fab equipment, ASML's orders bookings increased to $10 billion in Q4 2023.
Intel CEO Gelsinger says China is ten years behind in chipmaking capabilities
Intel CEO Pat Gelsinger says China's semiconductor industry is a decade behind, and it is going to stay this way.
Taiwanese 'CHIPS Act'-Line law enacted
Taiwan is set to subsidize semiconductor-related R&D as well as production CapEx.