Latest about ASML
Huawei patent reveals 3nm-class process technology plans — China continues to move forward despite US sanctions
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
ASML ships its second High-NA EUV litho tool to unspecified client
ASML begins to ship its High-NA EUV lithography system to the second customer
ASML sets density record with latest chipmaking tools — High-NA EUV equipment prints first patterns
ASML has reached another milestone with its Twinscan EXE:5000 lithography system.
Dutch gov't to invest $2.7 billion to keep ASML in the Netherlands - roads, trains and education included in package
The Dutch government has committed €2.5 billion ($2.7 billion) to enhance infrastructure, education, and housing in the Eindhoven region, where ASML is based.
ASML delivers cutting-edge new chipmaking tool
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
Samsung rep says High-NA EUV is good for logic, but might have cost issues for memory fabrication
Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.
Semiconductor group says China chipmaking sanctions should be the 'last resort,' cautions EU against further restrictions
SEMI Europe calls for clear and unified export control rules, international partnerships, simplified investments and ongoing dialog with European legislators.
