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Chip and memory manufacturer Fujian Jinhua was found not guilty on economic espionage charges.
ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.
Leading U.S. wafer fab equipment maker under investigation for supplying fab tools to Chinese chipmakers.
IBM uses AI-enhanced FlashCore Module (FCM) technology to increase data resilience against cyberattacks by detecting and addressing malware near-instantly.
Tiny Corp. offers TinyBox with six Radeon RX 7900 XTX for AI workloads for $15,000.
AI processor developers reportedly asking TSMC to significantly boost spending on new fabs as they struggle to meet demand for their products.
The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
Nvidia's retaliatory shipments delays are more common than one might think, says AMD's VP Scott Herkelman, who used to work at Nvidia.
When distributing CHIPS and Science Act money, the U.S. government will give preferences to large projects.
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