Latest about TSMC
Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S.
Taiwan's government is considering imposing N+2 export rule on TSMC's advanced process technologies, which would make it significantly harder for the foundry to develop overseas.
TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3mn months ahead of schedule
Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.
Sales of chip production equipment to reach $156 billion by 2027 due to AI and DRAM demand
Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
The data center cooling state of play (2025) — Liquid cooling is on the rise as thermal density demands skyrocket in AI data centers
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TSMC ponders upgrading 2nd Japan fab to 4nm
TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause.
TSMC could be inching closer to making 'all American' chips
TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor.
TSMC claims 4.2X efficiency gain over a decade from N7 to A14 fabrication process
TSMC clarifies A14 specifications: Even more performance, but better tools might be needed to extract the full potential of the latest process technologies.
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