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Intel details 14A performance and new 'Turbo Cells' that unlock maximum CPU and GPU frequency
By Paul Alcorn published
I. Am. Speed.

Intel Foundry Roadmap Update - New 18A-PT variant that enables 3D die stacking, 14A process node enablement
By Paul Alcorn last updated
Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California to outline the company's progress on its foundry initiative.

Taiwan puts new restrictions on exports of TSMC's most advanced process technologies
By Anton Shilov published
Plus, tighter control of Taiwanese companies investing in overseas assets.

TSMC discloses N2 defect density — lower than N3 at the same stage of development
By Anton Shilov published
TSMC claims N2 defect density is lower than N3 defect density two quarters before mass production starts, reveals N2 HVM time frame.

Intel posts flat year-over-year earnings and bleak outlook, warns about macroeconomic pressures
By Anton Shilov published
Intel reports flat revenue but deeper losses and lower margins in Q1 2025 as well as gives a bleak Q2 guidance driven by macroeconomic and trade-related uncertainties.

Intel's AI PC chips aren't selling well — instead, old Raptor Lake chips boom
By Paul Alcorn published
Intel's AI PC revolution will have to wait.

Intel CEO announces layoffs, restructuring, $1.5 billion in cost reductions, expanded return to office mandate
By Paul Alcorn published
Workforce and management cuts to become more severe.

TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models
By Anton Shilov published
TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120\00d7150 mm substrates with integrated power management for future AI and HPC processors.
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