TSMC
Latest about TSMC

TSMC confirms significant yield and performance improvements in A14 update
By Anton Shilov Published
TSMC's A14 process technology progresses faster than N2 at this stage of development as developers of both client and AI/HPC plan to use it.

ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
By Anton Shilov Published
ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.

TSMC commits another $100 billion to Arizona for at least four more 2nm fabs
By Luke James Published
TSMC will invest an additional $100 billion in the U.S. to build at least four more chipmaking plants and advanced packaging facilities in Arizona.

Intel's EMIB packaging gains traction as chip designers look beyond TSMC's constrained CoWoS
By Anton Shilov Published
Premium Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

Japanese chipmaker Rapidus to offer lower wafer pricing than TSMC — 2nm class silicon to be priced around $20,000 on 2027 launch
By Anton Shilov Published
Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business
By Etiido Uko Published
TSMC has reportedly told customers to prepare for 5% to 10% price hikes across advanced chip nodes, extending beyond 3nm to include 7nm and some legacy processes.

Rare ASML Special Edition Monopoly board unearthed in social media trade
By Mark Tyson Published
We just witnessed a significant semiconductor industry related non-cash trade deal take place on Twitter/X.

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech
By Luke James Published
Imec, ASML, and TSMC have integrated both n-type and p-type transistors with atomically thin 2D channels on a single 300mm wafer.
Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.

