Latest about TSMC
RAM Benchmark Hierarchy 2025: DDR5, DDR4 for AMD, Intel CPUs
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
ASML launches revolutionary lithography scanner for advanced 3D chip packaging — Twinscan XT:260 machine quadruples throughput
Premium For the 'More-than-Moore' era in chipmaking.
TSMC gives an ultra-rare video look inside its fabs
TSMC's new flyby video of its Fab 21 in Arizona offers a rare glimpse inside the fully operational N4/N5 cleanroom, highlighting ASML's EUV scanners producing chips for Apple, AMD, and Nvidia.
Nvidia and TSMC produce the first Blackwell wafer made in the U.S.
But advanced packaging is still conducted in Taiwan
TSMC moves up 2nm production plans in Arizona
TSMC is ramping up its construction to unlock N2 production in Arizona, while also mentioning that it's purchasing another plot of land to expand the fab.
China's latest round of rare-earth export controls give the country dominion over precious resources
Premium Export controls expand to knowledge, tools and equipment
TSMC posts record quarter results as skyrocketing AI and HPC demand drives two-thirds of revenue — company pulls in $33.1 billion
TSMC posted a record $33.1 billion in quarterly revenue driven by surging demand for AI and HPC processors, the ramp of Apple's latest SoCs, and the continued strength of advanced nodes.
Next-gen MRAM breakthrough can flip bits at SRAM-rivalling speeds with low power consumption
The major challenge that hampered the development and adoption of SOT-MRAM is now in the rearview mirror.
