Latest about TSMC
TSMC's 3nm update: N3P in production, N3X on track
TSMC has begun production of chips on its performance-enhanced N3P node, plans to follow with the high-frequency N3X variant.
TSMC unveils 1.4nm technology: 2nd Gen GAA transistors, full node advantages, coming in 2028
TSMC unveils its A14 process technology featuring 2nd generation GAA nanosheet transistors and NanoFlex Pro DTCO with production slated for 2028.
Russia on track to manufacture 28nm chips in domestic fabs by 2030, 19 years after tech first debuted
Russia aims to begin local mass production of Elbrus-based CPUs using domestic 28nm-class process technology by 2030, despite sanctions, tool limitations, and talent shortages.
TSMC's N2 process reportedly lands orders from Intel
Rumors suggest that Intel is contracting TSMC to utilize its N2 process node for Nova Lake, likely alongside its own 18A node.
TSMC says it cannot guarantee that its chips don't end up in China
In its annual report, TSMC acknowledged it cannot fully track how its chips are ultimately used, highlighting ongoing risks of unintentional export control violations.
Intel details next-gen 18A fab tech: significantly more performance, lower power, higher density
GAA transistors and backside power delivery seemingly do wonders.
Huawei introduces the Ascend 920 AI chip to fill the void left by Nvidia's H20
Huawei launches the Ascend 920 to take advantage of the gap that the banning of the Nvidia H20 chip will leave.
TSMC to build 30% of its 2nm and more advanced chips in the U.S., to speed up Fab 21 build out
TSMC plans to produce 30% of its 2nm and 1.6nm chips in Arizona as part of a its effort to transform its Fab 21 site into a major U.S. semiconductor hub.
