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PremiumPhotonics and high-speed data movement is the next big AI bottleneck
By Chris Stokel-Walker Published -
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
By Niels Broekhuijsen Published -
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
By Zak Killian Published -
PremiumAMD ROCm CES 2026 press Q&A roundtable transcript — 'ROCm from 2023 is completely unrecognizable to ROCm today' company details, as it seeks to break down barriers to AI development
By Zak Killian Published -
PremiumAMD FSR Redstone press Q&A roundtable CES 2026 transcript
By Zak Killian Published -
PremiumJensen Huang discusses the economics of inference, power delivery, and more at CES 2026 press Q&A session
By Luke James Published
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Roadmaps
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PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
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News Analysis
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Tesla's robotics ambitions rest on the knife-edge of US-China trade relations due to its supply chain
By Jon Martindale Published -

Western Digital details 14-platter 3.5-inch HAMR HDD designs with 140 TB and beyond
By Anton Shilov Published -
PremiumChina’s CXMT and YMTC to memory output
By Luke James Published -
PremiumIntel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers
By Jon Martindale Published -
PremiumApple concedes it is constrained by TSMC's supply of advanced chips; storage and memory are also in short supply
By Anton Shilov Published -

Samsung, SK Hynix, Micron team up to block memory hoarding
By Jon Martindale Published
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Latest
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Tesla's robotics ambitions rest on the knife-edge of US-China trade relations due to its supply chain
By Jon Martindale Published -

Western Digital details 14-platter 3.5-inch HAMR HDD designs with 140 TB and beyond
By Anton Shilov Published -
PremiumChina’s CXMT and YMTC to memory output
By Luke James Published -
PremiumIntel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers
By Jon Martindale Published -
PremiumPhotonics and high-speed data movement is the next big AI bottleneck
By Chris Stokel-Walker Published -
PremiumApple concedes it is constrained by TSMC's supply of advanced chips; storage and memory are also in short supply
By Anton Shilov Published -

Samsung, SK Hynix, Micron team up to block memory hoarding
By Jon Martindale Published -
PremiumChina moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies
By Luke James Published -
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
By Niels Broekhuijsen Published -
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
By Zak Killian Published -
PremiumOngoing trade war has TSMC and Taiwan stuck between a rock and a hard place
By Bruno Ferreira Published -
PremiumASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom
By Anton Shilov Published
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