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Amazon’s European data center projects stalled by grid delays spanning up to seven years
By Luke James published
Premium AWS is encountering grid connection wait times of up to seven years for new European projects, a delay that far exceeds the usual two-year timelines.

Tesla's robotics ambitions rest on the knife-edge of US-China trade relations due to its supply chain
By Jon Martindale published
Premium In a reversal of trade dynamics over cutting-edge silicon, China holds the cards in robotics manufacturing.

Western Digital details 14-platter 3.5-inch HAMR HDD designs with 140 TB and beyond
By Anton Shilov published
Premium Western Digital outlines vision for hard drive platforms in 2030 and beyond: 14 platters, new laser technology, capacities of 140TB and beyond.

China’s CXMT and YMTC to memory output
By Luke James published
Premium China’s two largest memory manufacturers, CXMT and YMTC, are said to each be embarking on an unprecedented expansion spree as they see an opportunity to close the gap with the big-three incumbents.

Intel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers
By Jon Martindale published
Premium With the first prototypes expected in 2027.

Samsung, SK Hynix, Micron team up to block memory hoarding
By Jon Martindale published
Samsung, SK Hynix, and Micron are teaming up to block memory hoarding.

China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies
By Luke James published
Premium Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.

Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place
By Bruno Ferreira published
Premium The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.
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