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PremiumHot Chips 2026: Fujitsu's Monaka CPU stacks its entire cache on a separate 5nm die and narrows to 256-bit SVE2Fujitsu details its Monaka server CPU
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PremiumHot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limitedOXMIQ presented its High Bandwidth Flash (HBF) use-case scenarios at Hot Chips 2026, which dramatically narrow the circumstances under which HBF makes sense.
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PremiumHot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per cardHeading into production during the tightest DRAM market in more than a decade.
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PremiumAMD splits Zen 7 into three EPYC families for 2028 and starts selling server CPUs by the agentThe company named Florence, Ferrara, and Fidenza in its launch release, extended its annual CPU, GPU, networking, and rack cadence out to 2030.
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PremiumOpenAI's HuggingFace breach heralds an unprecedented age of AI cyber warfareContemporary AI bots are far too competent at cybersecurity, and humanity may have reached a tipping point where it's hard to keep up.
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PremiumNew semiconductor firm, TYLsemi, breaks cover, backed by $43 million in early-stage fundingTYLsemi is set to offer pre-validated chiplets, along with custom ASIC design services, and build highly custom multi-tile processors at relatively low costs.
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PremiumIntel 4 gets its first foundry customer in Fortinet following firewall ASIC dealIntel will design, package, and fabricate Fortinet's sixth-generation Security Processor (SP6) on its Intel 4 node.
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PremiumKimi K3 rocks the AI industry as Moonshot AI undercuts closed-source American competitors on priceMemory makers are the big winners, regardless of how it works out.
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PremiumTower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan
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PremiumIntel's EMIB packaging gains traction as chip designers look beyond TSMC's constrained CoWoSGoogle has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?
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PremiumIntel's big $5 billion bet on Ireland aims to right the wrongs of the cancelled Magdeburg, Germany complexThe announcement comes just shy of a year after CEO Lip-Bu Tan cancelled Intel's planned €30 billion fab complex in Germany and a €4.6 billion assembly and test plant in Poland.
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PremiumMicron commits $500 million to GlobalWafers' Texas wafer plant as it raises U.S. spending to $250 billionRunning until 2035, the $250 billion spending target is attached to a goal of making 40% of Micron's DRAM in the U.S. by the mid-2030s.
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