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PremiumAnthropic says AI can boost U.S. GDP by 32%, up to $44.4 trillion in four yearsThe tech job market might argue that future has already arrived.
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PremiumOpenAI solution for the Navier-Stokes problem overshadowed by plagiarism controversyOpenAI announced that a team using one of its internal frontier models has solved the Navier-Stokes problem. However, the announcement has been mired in controversy.
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PremiumOpenAI claims GPT-6 Astra is an ethereal 'Alien Mind' with AGI-like qualitiesMeanwhile, low-cost, intelligent-enough solutions are exploding in popularity.
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PremiumHot Chips 2026: Intel details cutting-edge tech in entry-level Wildcat LakeIntel's Wildcat Lake is competing in the budget laptop market, but it takes a very different approach, leveraging a UCIe interconnect and Intel's latest 18A node.
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PremiumHot Chips 2026: Intel dives deep on Crescent Island AI acceleratorXe3P focuses on the most compute-intensive phases of AI inference.
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PremiumChina strategically slows exports of critical materials used in semiconductor fabrication to TaiwanChina slows exports of germanium, quartz-based materials, and magnets. The move potentially disrupts the optical connectivity, semiconductor, and robotics industries.
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PremiumHot Chips 2026: Micron warns HBM wafer penalty is widening with every generationMicron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
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PremiumHot Chips 2026: Nvidia breaks down 88-core Vera CPUNvidia has provided more color on its Vera CPU for agentic data centers at Hot Chips 2026, showcasing the benefits of spatial multithreading and the power benefits of the LPDDR5X memory system.
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PremiumHot Chips 2026: Intel Xeon 7 'Diamond Rapids' comes with up to 256 P-cores, 1.28 GB of last-level cacheIntel has pulled back the curtain on its next-gen Diamond Rapids Xeon CPUs, packing up to 256 P-cores and 1.28 TB of last-level cache.
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PremiumHot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceilingThe problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
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PremiumHot Chips 2026: IBM's first dual-ISA core natively executes ARM and z/Architecture in the same core; all cores run at 5.7 GHz base frequencyIBM is vastly expanding softwarte support on its mainframes with its first dual-ISA CPU core that natively supports z/Architecture and ARM instructions.
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PremiumMarvell VP pushes for DDR4 recycling for use in CXL memory, amid the worst DRAM shortage in years — company introduces three-tier AI memory infrastructureMarvell has introduced a three-tier "AI memory infrastructure" portfolio, announced at FMS 2026 in Santa Clara on August 4.
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