Latest about Roadmaps
Silicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
Premium Bigger drives, a new controller, and a larger LDPC enabled by new tech.
Nvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
Premium Systems are planned to be up to 14 times faster than NVL72 by 2027.
HBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
Premium We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.
Inside the future of 3D NAND: The roadmap to 500 layers
Premium The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
Micron details new U.S. fab projects — HBM production coming to America
Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.
TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
TSMC plans to build or ramp up nine new production facilities in 2025 — the highest in its history — as it accelerates global expansion to meet demand and rising manufacturing complexity.