As data center demand surges toward zettabyte scale, Seagate, Toshiba, and Western Digital are pursuing sharply different technology strategies in their pursuit towards 100TB and beyond.

ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.

TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors.

We analyze the approaches of PsiQuantum and Xanadu, who are each developing their own approaches to quantum photonic communications, with a vision that extends beyond 2029.

As time changes, so does technology.

We take a look at Noctua's current lineup of releases through Q2 2026, in addition to what products we might expect from them in the future, including the impressive Thermosiphon cooler.

We take an in-depth look at AMD's 2026 and 2027 roadmaps.

Intel's CPU roadmap is unlike any the company has published in recent years, because its manufacturing ambitions and its product launches have to succeed simultaneously.