Forward-looking analysis of hardware timelines and industry direction.
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PremiumUALink roadmap plots course to optimized AI data center interconnectsDespite broad industry support, UALink's adoption may be slowed by the absence of several features like In-Network Collectives and the 128G PHY spec.
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PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum futureIn this roadmap, we analyze what the future of Quantum Computing might look like over the next decade, including the future of qubit scaling, trapped ions, and superconducting chips.
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PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraintsHuawei eyes up extreme system-level scaling.
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PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decadeCompetition for Nvidia looms.
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PremiumThe future of DRAM: From DDR5 advancements to future ICsDDR5 continues to evolve with higher speeds, larger capacities, and new technologies like CUDIMMs and MRDIMMs, solidifying its dominance through the decade as DDR6 remains years away.
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PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 CelestialWe put our thinking caps on to come up with a desktop GPU roadmap for all brands, with all of the expected details for what's to come for Nvidia, AMD, and Intel's next-generation architectures.
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News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPCBigger drives, a new controller, and a larger LDPC enabled by new tech.
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PremiumInside the future of 3D NAND: The roadmap to 500 layersThe 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
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PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyondWe've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.
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