Forward-looking analysis of hardware timelines and industry direction.
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PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 CelestialWe put our thinking caps on to come up with a desktop GPU roadmap for all brands, with all of the expected details for what's to come for Nvidia, AMD, and Intel's next-generation architectures.
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News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPCBigger drives, a new controller, and a larger LDPC enabled by new tech.
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PremiumInside the future of 3D NAND: The roadmap to 500 layersThe 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
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PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyondWe've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.
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PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonicsSystems are planned to be up to 14 times faster than NVL72 by 2027.
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News AnalysisMicron details new U.S. fab projects — HBM production coming to AmericaMicron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.
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SemiconductorsTSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilitiesTSMC plans to build or ramp up nine new production facilities in 2025 — the highest in its history — as it accelerates global expansion to meet demand and rising manufacturing complexity.
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