Roadmaps
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PremiumSamsung's fab roadmaps examinedDivided across two countries and four campuses, Samsung's fab roadmap runs from the Korean bases at Pyeongtaek, Hwaseong, and Giheung to the new U.S. site at Taylor.
By Luke James Published -
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PremiumChinese chipmaking tool roadmaps examined — Beijing's nascent lithography tools target DUV production at five machines a year, and an EUV prototype with no chipsUltimately, three markers will indicate whether China’s domestic DUV program is a legitimate rival or yet more state-sanctioned hot air.
By Luke James Published -
PremiumCo-Packaged Optics (CPO) foundry roadmaps — breaking down TSMC, Intel, Samsung, and GlobalFoundries' approach to next-generation scale-up connectivityThe CPO race is about to begin.
By Anton Shilov Published
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PremiumNeural atom quantum computing roadmap — how laser-cooled trapped atoms could pave the path beyond physical qubit countsA look at the players and roadmaps around neutral atom quantum computing
By Francisco Pires Published -
PremiumRapidus fab roadmap examinedRapidus is building Japan's entire return to leading-edge logic on one fab in Chitose, Hokkaido.
By Luke James Published -
PremiumImec's 2026 roadmap details 0.3nm nodes by 2038, CFET transistors become viable at 0.7nmAs CPP shrinking stalls, chipmakers find a new way to increase transistor density. Imec foresees 0.3nm in 2038, CFET insertion in 2038, HLSI era.
By Anton Shilov Published -
PremiumIntel's fab roadmap examined — Arizona, Ohio, Ireland, and the two deadlines deciding 14A process nodeThis roadmap provides an in-depth analysis of Intel's current plans for its chip production capacity.
By Luke James Published -
PremiumAnalyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecksTSMC kicks off unprecedented capacity expansion plan.
By Anton Shilov Published -
PremiumTrailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMICWe explore Globalfoundries, UMC, and SMIC's individual trailing-edge roadmaps, as each company is pursuing a fundamentally different strategy shaped by geography, regulation, and technology choices.
By Luke James Published -
PremiumLeading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond2nm is here, so what's next?
By Anton Shilov Published -
PremiumHigh-capacity HDD roadmap: the race to 100TB and zettabyte-scale storage — Toshiba, Seagate and WD outline three distinct strategiesAs data center demand surges toward zettabyte scale, Seagate, Toshiba, and Western Digital are pursuing sharply different technology strategies in their pursuit towards 100TB and beyond.
By Anton Shilov Published -
PremiumASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyondASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.
By Luke James Published
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