DRAM
Latest about DRAM
![Best RAM for gaming](https://cdn.mos.cms.futurecdn.net/aFrdtqm8QLfdsRBkwhDjcC-320-80.jpg)
Best RAM for Gaming: DDR4, DDR5 Kits for 2024
By Zhiye Liu last updated
Here is the best RAM for gaming we’ve tested: computer memory deal for video editing and graphics-heavy applications.
![AMD](https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-320-80.png)
Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026
By Anton Shilov published
CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI.
![Micron](https://cdn.mos.cms.futurecdn.net/XToWvWNEZrbQtmixi33Qan-320-80.jpg)
Micron is the last memory maker to join the EUV party
By Anton Shilov published
Micron reiterates its plans to use EUV for high-volume DRAM production next year as it starts pilot production on a 1-gamma node.
![Trident Z5 RGB](https://cdn.mos.cms.futurecdn.net/E3aohjQt4cz6AszzcxxrKW-320-80.jpg)
Leak suggests that DDR6 development has already started, aiming for 21 GT/s
By Anton Shilov published
Industry looking forward to develop DDR6 already: No decision on signaling standard have been made yet, but the final spec is expected in Q2 2025.
![AMD](https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-320-80.png)
Huawei backs HBM memory manufacturing in China to sidestep crippling US sanctions
By Anton Shilov published
Huawei is reportedly behind CXMT's development of HBM memory.
![SK hynix](https://cdn.mos.cms.futurecdn.net/NFsR7zzEc8asPnVCkk2HuY-320-80.png)
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
By Anton Shilov published
SK hynix selects Indiana for its first HBM packaging fab in the USA.
![Tokyo Electron](https://cdn.mos.cms.futurecdn.net/wiKEDqPjqjWsieqhjceHmJ-320-80.png)
Samsung puts 3D DRAM on the roadmap, stacked DRAM to follow
By Anton Shilov published
Samsung envisions vertical channel transistor, stacked DRAMs in the next 10 years.
![SK hynix](https://cdn.mos.cms.futurecdn.net/NFsR7zzEc8asPnVCkk2HuY-320-80.png)
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
By Anton Shilov published
Indiana chips and Indiana nights, starting in 2028.
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