Latest about DRAM
Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026
Premium The Chinese semiconductor industry is working to localize production of HBM3 memory, in addition to the tools required for HBM assembly. However, the exact progress of these projects is unknown.
Micron acquires PSMC fab site in Taiwan for $1.8 billion, acquisition to expand the memory maker's operations within the region
Premium As fabs get dramatically more expensive than they used to be, technology for capacity partnerships lose their appeal, so Micron buys production facility from PSMC to upgrade it and run it itself.
SK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record
Premium Company prepares for next-gen HBM4E, HBM5, and HBM5E memory.
Modder saves $130 by building 32GB DDR5 desktop DIMMs from scavenged laptop memory
$218 cost of parts is about $130 cheaper than buying a similar desktop DIMM retail kit in the US.
Chinese researchers hail breakthrough in DRAM-like cells, which could be used in embedded or 3D stacked memory
Premium Uncertainties make it impossible to evaluate commercial viability
Micron to begin work on $100 billion New York 'megafab' imminently
Premium After numerous delays, Micron is about to start building its $100 billion site in New York to produce 40% of its DRAM output in the U.S. in the 2040s.
Boxes of 100 server-grade DDR5 memory now cost as much as property in Shanghai in China spot market
In China’s spot market, vendors are quoting prices that put a box of 100 high-capacity DDR5 server memory modules at roughly 5 million yuan,
Chinese memory maker CXMT prepares $4.2 billion USD IPO to take advantage of tight memory market
Chinese memory maker CXMT prepares to file for IPO in Beijing, aiming to raise $4.2 billion USD in order to expand production and fund next-gen DRAM development.
