Latest about EUV
Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC
Premium The plant, located in Yunlin County, is expected to come online as early as 2028 and will co-develop advanced photoresists with TSMC.
ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond
Premium ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.
SK hynix places record $8 billion order for ASML EUV lithography machines
SK hynix disclosed in a regulatory filing on Tuesday that it will purchase 11.9 trillion won ($7.9 billion) worth of EUV lithography equipment from ASML.
IBM and Lam's new partnership paves the way toward sub-1nm logic using High-NA EUV
Premium Under the new agreement, the focus will shift to validating full process flows for nanosheet and nanostack device architectures and backside power delivery.
China's top chip execs claim ASML alternative 'small, fragmented, and weak'
China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.
Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.
ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
ASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom
Premium ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.
