EUV
Latest about EUV

Intel expands production of photomasks in California: EUV and High-NA EUV in the focal point
By Anton Shilov Published
Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.

ASML denies US government report that its EUV chipmaking tool was shipped to China
By Anton Shilov Published
U.S. Commerce Secretary Lutnick expresses concerns in a conversation with ASML executives that China has an EUV lithography system as ASML denies shipping such scanners to the PRC.

Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC
By Luke James Published
Premium The plant, located in Yunlin County, is expected to come online as early as 2028 and will co-develop advanced photoresists with TSMC.

ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond
By Luke James Published
Premium ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.

SK hynix places record $8 billion order for ASML EUV lithography machines
By Luke James Published
SK hynix disclosed in a regulatory filing on Tuesday that it will purchase 11.9 trillion won ($7.9 billion) worth of EUV lithography equipment from ASML.

IBM and Lam's new partnership paves the way toward sub-1nm logic using High-NA EUV
By Luke James Published
Premium Under the new agreement, the focus will shift to validating full process flows for nanosheet and nanostack device architectures and backside power delivery.

China's top chip execs claim ASML alternative 'small, fragmented, and weak'
By Luke James Published
China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.

Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips
By Anton Shilov Published
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
By Anton Shilov Published
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
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