Latest about EUV
Corning's Extreme ULE glass debuts for next-gen High-NA EUV chipmaking
Corning introduces new Extreme ULE glass for photomasks and mirrors to be used with next-generation EUV and High-NA EUV tools.
China's SMEE files patent for an EUV chipmaking tool — tool aims to break the shackles of ASML export restrictions
Shanghai Microelectronics Equipment patents key components of an EUV lithography tool.
TSMC's first High-NA EUV litho tool to begin installation this month say industry insiders
TSMC to start installing High-NA EUV system for R&D purposes this month.
Intel to establish advanced chip R&D center in Japan: report
Intel and Japan's National Institute of Advanced Industrial Science and Technology to establish semiconductor R&D center to advance Japanese chip industry.
SK hynix says its 3D DRAM is half as expensive to produce
SK hynix says adopting 4F2 structures and 3D transistors will increase the cost-efficiency of EUV lithography usage in DRAM production.
Samsung may start installing its first High-NA EUV litho tool in late 2024
Samsung will be about a year behind Intel in installing ASML's Twinscan EXE:5000 High-NA litho tool for development purposes.
Japanese scientists develop simplified EUV scanner that can make production of chips considerably cheaper
OIST's simplified EUV litho system uses two mirrors instead of six.
The U.S. has sanctioned 18 Chinese fabs, dozens remain in white zone
The U.S. government approves shipments of wafer fab equipment to many Chinese fabs, other are banned. Question is, can those tools be installed in banned fabs?
