Latest about EUV
ASML ships its second High-NA EUV litho tool to unspecified client
ASML begins to ship its High-NA EUV lithography system to the second customer
ASML sets density record with latest chipmaking tools — High-NA EUV equipment prints first patterns
ASML has reached another milestone with its Twinscan EXE:5000 lithography system.
Critical EUV chipmaking tool supplier hacked, pressed to pay $10 million for ransomware unlock – Hoya dismisses hack as an ‘IT system incident’
1.7 million files were swiped by Hunters International, say reports.
Samsung to double investment in Texas fab, spend $44 billion to build leading-edge chips: Report
Samsung to add another fab module, an advanced packaging facility, and an R&D center to its Taylor, Texas, campus.
Taiwan earthquake causes estimated $62 million in damage and disruptions for TSMC
Insiders talk about broken beams, columns, and cracked walls.
ASML delivers cutting-edge new chipmaking tool
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
Samsung rep says High-NA EUV is good for logic, but might have cost issues for memory fabrication
Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.
Intel and ASML achieve 'First Light' milestone with world's most advanced chipmaking tool
ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.
