RAM

Biwin introduces two new 192GB memory kits optimized for AM5-based Ryzen CPUs. The new kits are advertised towards AI-centric workloads and enterprise applications.

Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM.

Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.

Samsung unveils 16Gb LPDDR5-Ultra-Pro DRAM at 12,700 MT/s with 4-phase self-calibration and AC-coupled transceiver equalization.

Increased competition from Chinese makers may force leading DRAM makers to phase out DDR3 and DDR5 SDRAM by end of the year.

Nvidia is reportedly collaborating with memory makers on a new high-performance, compact memory standard, seemingly designed for AI workloads.

SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity.

G.Skill has introduced a pair of new memory modules, one boasting 6800MHz speeds at up to 96GB of capacity. The other is targeted at low-latency featuring 6400MHz speeds and a CL timing of 28.