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Apple to become first customer for Amkor's $2 billion Arizona chip packaging facility
By Anton Shilov published
Amkor to build $2 billion advanced chip packaging facility in the U.S. primarily targeting Apple.

Japan sets strict rules for chip subsidy recipients in the hopes of preventing leaks to China and Russia
By Anton Shilov published
Japan wants prevent technology secret leaks from companies getting chip-related subsidies from the government.

Google powering data centers with geothermal energy
By Mark Tyson published
A collaboration between Google and geothermal energy innovator Fervo uses modern oil/gas drilling techniques to harness round-the-clock clean geothermal energy.

Intel to spend $14 billion manufacturing its chips at TSMC
By Matthew Connatser published
In 2024, Intel will place $14 billion worth of orders with TSMC to fab 3nm Lunar Lake CPU tiles, per a report from semiconductor analyst Andrew Lu.

Germany vows to subsidize Intel and TSMC fabs despite budget crisis
By Anton Shilov published
Germany vows to subsidize Intel and TSMC fabs despite a budget crisis, though Intel and Wolfspeed reportedly received firm fab funding commitments from the German government.

Ericsson processors built on 'Intel 4' process node beat Meteor Lake to market
By Matthew Connatser published
IDM 2.0 is finally getting somewhere.

Nvidia sold half a million H100 AI GPUs in Q3 thanks to Meta/Facebook
By Anton Shilov published
Nvidia sold half a million H100 AI GPUs in Q3 thanks to Meta, Facebook, says research firm Omdia, with lead times stretching up to 52 weeks.

Booming demand from Chinese fabs causing a shortage of critical photomask element.
By Anton Shilov published
Rising demand from Chinese chip designers is fueling a global shortage of photomasks, a critical component to chipmaking.
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