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Sambanova introduces new AI accelerator, partners with Intel to deploy Xeon CPUs for inferencing and agentic workloads
By Anton Shilov published
Premium Intel teams up with a new kid on the block.

The world’s first transatlantic fiber-optic cable is being ripped up after 37 years on the sea floor
By Luke James published
Subsea Environmental Services is currently hauling TAT-8 off the seabed near Portugal, more than two decades after it was decommissioned.

DJI sues the FTC over its prohibition on importing new models of foreign-made drones into the U.S.
By Hassam Nasir published
Another legal battle for survival comes DJI's way.

US gov't warned Nvidia CEO Jensen Huang, Tim Cook, and Lisa Su that China could invade Taiwan by 2027
By Zak Killian published
A new report reveals that tech CEOs were cautioned in 2023, yet haven't really taken action on the info.

Qualcomm's 2019-vintage AI100 chip finally scores a major deployment
By Bruno Ferreira published
Qualcomm's 2019-vintage AI100 chip finally scores a major deployment

AI boosted US economy by 'basically zero' in 2025, says Goldman Sachs chief economist
By Jon Martindale published
Premium US companies are spending big, but most of that money goes overseas.

Apple to produce Mac Minis in Houston for the first time
By Luke James published
Apple announced that it will begin producing the Mac Mini in Houston, Texas later this year, marking the first time that the compact desktop has ever been manufactured in the United States.

AMD and Meta strike $100 billion AI deal that includes 10% stock deal
By Stephen Warwick published
AMD and Meta have announced an AI chips deal thought to be worth more than $100 billion.

AI tool OpenClaw wipes the inbox of Meta's AI Alignment director despite repeated commands to stop
By Bruno Ferreira published
Meta's AI Director of Alignment asked OpenClaw to clean up her inbox, only for the AI agent to nuke everything inside.

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
By Anton Shilov published
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
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