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Once this fab plant commences operation, it will make HBM for Nvidia AI GPUs made and packaged by TSMC's plant in Arizona
Due to several setbacks in its original plans to introduce its own modem SoC, Apple decided to extend its agreement with Qualcomm, extending its current patent license agreement until 2027.
The U.S. may make significant investments in Vietnam to boost its semiconductor sector.
Canon's nanoimprint lithography tools will ship either this year or next, they will address 3D NAND manufacturing first.
The Department of Commerce is signaling that it intends to distribute at least $500 million of CHIPS Act cash.
ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools.
OpenAI's Sam Altman will talk about the importance of advanced chips for AI workloads at Intel's upcoming Direct Connect event in Feb.
Intel, SK hynix, and NTT to develop silicon photonics-based interconnections for processors and memory.
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