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Neural atom quantum computing roadmap — how laser-cooled trapped atoms could pave the path beyond physical qubit counts
By Francisco Pires Published
Premium A look at the players and roadmaps around neutral atom quantum computing

Tower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028
By Luke James Published
Premium Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan

Elon Musk spent $1 billion on an energy company to power xAI
By Jowi Morales Published
SpaceXAI is doubling down on its mobile natural gas turbine generators.

TSMC commits another $100 billion to Arizona for at least four more 2nm fabs
By Luke James Published
TSMC will invest an additional $100 billion in the U.S. to build at least four more chipmaking plants and advanced packaging facilities in Arizona.

Scientists synchronize 105,000 nano-oscillators in just 45 nanoseconds — paving the way for a highly efficient and fast alternative to transistors
By Bruno Ferreira Published
Scientists synchronize 105,000 nano-oscillators in just 45 nanoseconds — paving way for highly efficient and fast alternative to transistors

Nvidia's Huang vows to deliver 'giant amounts' of Vera Rubin — company says that 'our roadmap is intact'
By Anton Shilov Published
Chief executive of Nvidia says the company is on track to produce 'giant amounts' of Vera Rubin-based machines, but fails to address rumored delays of Kyber NVL144 racks from 2027 to 2028.

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV
By Etiido Uko Published
Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

Intel's EMIB packaging gains traction as chip designers look beyond TSMC's constrained CoWoS
By Anton Shilov Published
Premium Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

Intel's big $5 billion bet on Ireland aims to right the wrongs of the cancelled Magdeburg, Germany complex
By Luke James Published
Premium The announcement comes just shy of a year after CEO Lip-Bu Tan cancelled Intel's planned €30 billion fab complex in Germany and a €4.6 billion assembly and test plant in Poland.
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