ASML

Elon Musk may prefer FEL light sources for in-house chip production, but Terafab will start with proven tech from ASML.

Centre for Technology & Statecraft (CTS) calls for banning exports of all immersion DUV tools to China, echoes the MATCH Act by U.S. legislators.

ASML calls EU authorities to help create demand for European chips as Europe's share in its revenue drops to 0% in 2026.

With progress that ASML makes with its LPP EUV light sources for its scanners, the company is barely interesting in adopting particle accelerator-based FEL sources.

TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.

Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.

TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.

Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.

Zeiss Semiconductor Manufacturing Technology is adding around 25,000 square meters of production and production-adjacent space at Oberkochen in southern Germany.

The Hague Centre for Strategic Studies has rated the Dutch semiconductor industry as being at very high risk of Chinese foreign interference.