Latest about ASML
US, China Chip War may continue for decades, says former ASML CEO
The Chip War is fought over ideology, not factual basis, says tech boss
Japanese researchers testing particle accelerator for chipmaking — researchers claim EUV-like lithography capabilities
Free-electron laser generated by energy recovery linear accelerator could be used for chipmaking, perhaps, in the long-term future. Perhaps.
Huawei patent reveals 3nm-class process technology plans — China continues to move forward despite US sanctions
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
ASML sets new chipmaking density record, proposes Hyper-NA tools
Smaller, faster transistors at unprecedented speed.
ASML claims US ban on servicing China chipmaking tools will not hurt the company
The Dutch government may ban ASML from servicing high-end wafer fab tools in China, but the outgoing ASML CEO says this will not be a major problem for earnings.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
ASML ships its second High-NA EUV litho tool to unspecified client
ASML begins to ship its High-NA EUV lithography system to the second customer
ASML sets density record with latest chipmaking tools — High-NA EUV equipment prints first patterns
ASML has reached another milestone with its Twinscan EXE:5000 lithography system.
