CHIPS and Science Act
Amkor to build $2 billion advanced chip packaging facility in the U.S. primarily targeting Apple.
Germany vows to subsidize Intel and TSMC fabs despite a budget crisis, though Intel and Wolfspeed reportedly received firm fab funding commitments from the German government.
Delayed German budget may have a drastic effect on German subsidies for new Intel's and TSMC's fabs in the country.
The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.
Potential government shutdown and political turmoil threatens U.S.'s semiconductor drive.
Time will tell if Intel’s refocusing on manufacturing will pay off, but at least one AMD exec thinks IFS was a mistake.
U.S. Department of Commers prohibits receivers of CHIPS grants to invest in China, form R&D partnerships.
Stay on the Cutting Edge
Join the experts who read Tom's Hardware for the inside track on enthusiast PC tech news — and have for over 25 years. We'll send breaking news and in-depth reviews of CPUs, GPUs, AI, maker hardware and more straight to your inbox.