Latest about CHIPS and Science Act
The U.S. government will distribute $500 million from the CHIPS Act to fund R&D for packaging technology and a research institute
The Department of Commerce is signaling that it intends to distribute at least $500 million of CHIPS Act cash.
US Govt's sluggish Chips Act payouts slam the brakes on Samsung's fab
Samsung's Texas fab will be operational in 2024, but won't have mass production capability until 2025 at the earliest.
Billions in German subsidies secured for Intel and TSMC Fabs
German coalition finally agrees to provide Intel and TSMC billions of Euros in funding.
US doles out paltry $35 million of the $52 billion CHIPS Act
The U.S. government has begun doling out portions of the $52 billion CHIPS Act, beginning with just $35 million to BAE Systems. It also warns of possible delays in Intel and TSMC fab buildouts.
Apple to become first customer for Amkor's $2 billion Arizona chip packaging facility
Amkor to build $2 billion advanced chip packaging facility in the U.S. primarily targeting Apple.
Germany vows to subsidize Intel and TSMC fabs despite budget crisis
Germany vows to subsidize Intel and TSMC fabs despite a budget crisis, though Intel and Wolfspeed reportedly received firm fab funding commitments from the German government.
Intel and TSMC could lose billions in funding thanks to stalled German budget
Delayed German budget may have a drastic effect on German subsidies for new Intel's and TSMC's fabs in the country.
US gov't addresses domestic weaknesses with $3 billion advanced packaging program
The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.
