Latest about HBM
Researchers turn HBM on its side to tackle AI memory’s heat wall
Technologies not yet proven as viable HBM alternatives
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
Micron inks long-term supply agreements worth $100 billion
Micron has signed 16 LTAs with various customers to supply DRAM and NAND worth $100 billion.
Qualcomm reveals HBC near-memory AI architecture, AI250 and AI350 accelerators
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall.
SK hynix passes Samsung as South Korea's most valuable company
SK hynix overtook Samsung Electronics on Monday to become South Korea’s most valuable listed company.
Industry coalition urges Trump administration to take urgent action as AI data centers' extreme memory consumption threatens other industries
Risks are emerging despite billions of dollars of US investment in domestic semiconductor supply chains
SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source
Technology may solve HBM's critical heating problem
TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029
Premium TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors.
Micron's $24 billion Singapore fab could need 500 transformers, more than double the output of any single manufacturer
Micron’s planned $24 billion NAND flash expansion in Singapore will require 400 to 500 power transformers, which is more than double the 100 to 150 units a standard wafer fab typically needs.
