HBM

Latest about HBM

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Micron invests $7 billion in HBM assembly facility amid AI boom

By Anton Shilov Published

Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026.

DRAM
China USA
US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans

By Hassam Nasir Published

The latest round of US sanctions imposes tighter control over the export of US technology to 200 more chip makers in China.

Tech Industry
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Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report

By Anton Shilov Published

SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.

GPUs
SK Hynix's 12-Hi HBM3E
SK hynix preps for Nvidia Blackwell Ultra and AMD Instinct MI325X with 12-Hi HBM3E

By Anton Shilov Published

SK hynix kicks off mass production of 12-Hi HBM3E for AMD's MI 325X, Nvidia's Blackwell Ultra, other high-performance processors.

GPUs
AMD
Rambus announces HBM4 memory controller for AI GPUs

By Anton Shilov Published

Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?

DRAM
AMD
Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report

By Anton Shilov Published

Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.

DRAM
SK Hynix
SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.

By Anton Shilov Published

SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.

DRAM
asdf
Ampere unveils monstrous 512-core AmpereOne Aurora processor — custom AI engine, support for HBM memory

By Paul Alcorn Published

Ampere is adding a 512-core AmpereOne Aurora processor to its roadmap, and it also divulged pricing for its AmpereOne lineup.

CPUs
AMD
Preliminary HBM4 specs point to major performance uplift for GPUs

By Anton Shilov Published

JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.

Tech Industry
AMD
Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026

By Anton Shilov Published

CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI.

DRAM
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