Latest about HBM
Nvidia's H20 follow-up in China won't be based on Hopper, says Jensen
Future AI accelerators for China will not use the Hopper architecture, as Jensen Huang hints at a potential switch to Blackwell.
Samsung to adopt hybrid bonding for HBM4 memory
News Analysis Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
Micron confirms memory price hikes as AI and data center demand surges
With demand surging across multiple sectors, the U.S. memory giant is adjusting prices to match the tightening supply.
Micron unveils DDR5-9200 memory: 1γ process technology with EUV
Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM.
SanDisk's new HBF memory enables 4TB of VRAM on GPUs
SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity.
Third Chinese company begins HBM memory production for AI processors: Report
Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.
SK hynix posts record revenues and profits amid surge of HBM demand
Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.
SK hynix to showcase 16-layer HBM3E, 122TB enterprise SSD, LPCAMM2, and more at CES
The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance
