Latest about HBM
Premium Divided across two countries and four campuses, Samsung's fab roadmap runs from the Korean bases at Pyeongtaek, Hwaseong, and Giheung to the new U.S. site at Taylor.
Free Premium Article Samsung uses FMS to unveil three next-generation memory technologies — zHBM, zNAND-O, and BV-NAND — that target different markets, but all rely on advanced wafer-bonding techniques.
Apacer warns DRAM allocations to module makers could fall below 30% of 2026 levels as AI demand tightens supply and pushes memory prices higher.
Technologies not yet proven as viable HBM alternatives
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
Micron has signed 16 LTAs with various customers to supply DRAM and NAND worth $100 billion.
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall.
SK hynix overtook Samsung Electronics on Monday to become South Korea’s most valuable listed company.
