China to pivot $50 billion chip fund to fighting U.S. squeeze as trade war escalates — country to back local companies and projects to overcome export controls

China chip graphic
(Image credit: Getty /Yaorusheng)

Executives of China's Big Fund III are re-adjusting its purpose to address the most notorious gaps in the country's semiconductor industry, namely lithography tools and electronic design automation (EDA) software. Previously, it was designed to support makers of fab tools and the semiconductor ecosystem in general. This recalibration comes as the U.S. intensifies efforts to restrict the access of China-based chip designers and chipmakers to tools and technologies vital for advanced semiconductors.

The main purpose of the third installment of the National Integrated Circuit Industry Investment Fund, also called Big Fund III, was to strengthen local development and manufacturing of chipmaking equipment. This push has become urgent in recent years because companies like ASML, Applied Materials, KLA, Lam Research, and Tokyo Electron are now barred by export controls from selling their most advanced tools to Chinese entities without an export license.

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Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • Constellar
    I'm glad to see China finding yet another way to squander their precious tax money. The first approach at throwing away good money is through their BRI, which so far has netted China a couple billion in increased export sales to the global South out of an initial investment of nearly $2 trillion since 2013. Now we have this colossal failure in the making--China directing money away from nascent companies without a proven track record but with great potential, and direct it toward squandering it on EUV lithography tools--money that will never yield a viable way to generate the needed EUV in output power that can etch silicon in high yields and low defect rates. That tech has been thoroughly explored by both ASML and ASML's partner, the Lawrence Livermore laboratory in Berkeley, California (which recently discovered another innovation that's meant to be ASML's next breakthrough in lithography machinery). But as far as capable EUV light sources are concerned? China should just give up because LLNL and ASML have already been there, done that a thousand times over.
    If it took you years to discover how to blast a tin droplet of exacting mass with a precision, high energy plasma source to generate your EUV you can pretty much bet that all other methods to obtain that EUV have been tried and exhausted, as well.
    China spends their tax money almost as recklessly as our government does, for Christ's sake!
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