Anton Shilov

Anton Shilov

Contributing Writer

Anton Shilov has been in the PC industry since 1990s playing games, building PCs, and writing stories about pretty much everything that relates to PCs, Macs, smartphones, tablets, and even fab equipment. Over his career, he has worked at a variety of high-ranking websites, including AnandTech, EE Times, TechRadar, X-bit labs, and now Tom's Hardware. When Anton is not reading or writing about something high-tech, he is probably watching a good movie, playing a video game, or spending time with his family.

Articles by: Anton Shilov

Intel

Intel's Fab 52 is bigger and better equipped than TSMC's Arizona facilities — Intel's production volume dwarfs TSMC's operations in the U.S.

By Anton Shilov last updated

Intel's Fab 52 in Arizona is currently the most advanced chip production facility in America, but it has yet to reach its full 40,000-wafer capacity due to low 18A yields.

AMD

AMD publishes first Zen 6 document detailing ground-up redesign on 2nm process node — brand-new 8-wide CPU core with strong vector capabilities

By Anton Shilov published

AMD's Zen 6-based CPUs may be number crunching monsters, given their core design that is partially revealed in a performance counters document.

TSMC

Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion

By Anton Shilov published

Taiwan's government is considering imposing N+2 export rule on TSMC's advanced process technologies, which would make it significantly harder for the foundry to develop overseas.

SK hynix

Intel-certified 256 GB DDR5 stick could cut Xeon memory power by 18%, saving millions of dollars — a 32W-per-socket reduction could save millions per hyperscale data center

By Anton Shilov published

SK hynix first to validate 32Gb-based 256GB DDR5 module with Intel: up to 32.4W power savings per server, or millions of dollars per hyperscale data center.

TSMC

TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3mn months ahead of schedule — Arizona fab slated for production in 2027

By Anton Shilov published

Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.

ASML EUV machine

China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028

By Anton Shilov published

Well, kind of.

TSMC

Sales of chip production equipment to reach $156 billion by 2027 — China, Taiwan, and Korea lead intense demand

By Anton Shilov published

Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.

Intel Glass substrate

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

By Anton Shilov published

Wedding glass and PLP ahead of others?

Intel

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

By Anton Shilov published

2D materials are getting closer to manufacturability using industry-standard equipment.

ASML

Intel installs industry's first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A

By Anton Shilov published

Sets the stage for 14A process technology.

Kioxia LC9 123TB SSD

Kioxia's next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers

By Anton Shilov published

Premium Mass production of 332-layer BiCS10 accelerated from 2027 to 2026.

Nvidia

The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions

By Anton Shilov published

Premium From the air outside to de-ionized water inside.

Amazon Web Services

Amazon unveils 192-core Graviton5 CPU with massive 180 MB L3 cache in tow — ambitious server silicon challenges high-end AMD EPYC and Intel Xeon in the cloud

By Anton Shilov published

Premium AWS's new 192-core Graviton5 processor with a massive 180 MB L3 cache marks the company's most ambitious in-house CPU yet, which could enable it to replace more AMD and Intel servers in its cloud.

Micron

Industry preps new 'cheap' HBM4 memory spec with narrow interface, but it isn't a GDDR killer — JEDEC's new SPHBM4 spec weds HBM4 performance and lower costs to enable higher capacity

By Anton Shilov published

A GDDR killer from the HBM camp? Not quite.

Nvidia

Nvidia details new software that enables location tracking for AI GPUs — opt-in remote data center GPU fleet management includes power usage and thermal monitoring

By Anton Shilov published

Including tracking of physical location.

Oracle

Oracle reportedly delays several new OpenAI data centers because of shortages — tight material and labor supply frustrate expansion plans, possibly by a year or more

By Anton Shilov published

Oracle reportedly delays some of the data centers for OpenAI from 2027 to 2028, citing labor and materials shortages.

SMIC

Huawei's latest mobile is armed with China's most advanced process node to date despite using blacklisted chipmaker — Huawei Kirin 9030 mobile SoC made on SMIC N+3 process, but can't compete with 5nm node

By Anton Shilov published

But not a 5nm-class node.

Intel

Intel tests chipmaking tools from sanctioned China-focused tool maker, report claims — move could raise political and national security concerns, firm was backed by CEO Lip-Bu Tan's investment firm

By Anton Shilov published

Intel has evaluated wet etch tools from ACM Research for its 14A fabrication process, raising political and national security concerns.

TSMC

TSMC ponders upgrading 2nd Japan fab to 4nm — could pave the way for more advanced chips for Japanese customers (Updated)

By Anton Shilov last updated

TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause.

Huawei's FusionModule800, image for illustrative purposes only

China starts list of government-approved AI hardware suppliers: Cambricon and Huawei are in, Nvidia is not

By Anton Shilov published

Nvidia is not there... yet?

Nvidia Blackwell and GTC 2024

Nvidia develops software-based tracking for AI GPUs to quash smuggling concerns — solution devised to prevent shipments to nations with export controls in place

By Anton Shilov published

Officially, the capability is positioned for large CSPs as a way to manage their AI fleets.

Nvidia Hopper H100 die shot

Nvidia reportedly wins H200 exports to China — US Department of Commerce set to ease restrictions for full Hopper AI GPU

By Anton Shilov published

But will China let them in?

Apple

Apple's chief chip architect for the last decade has reportedly talked to CEO Tim Cook about leaving (Updated)

By Anton Shilov published

Johny Srouji, the man behind development of Apple's processors in the latest iPhones, Macs, and Watches, is reportedly pondering leaving the company.

TSMC

TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona

By Anton Shilov published

TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor.

Micron

TSMC claims 4.2X efficiency gain over a decade from N7 to A14 fabrication process

By Anton Shilov published

TSMC clarifies A14 specifications: Even more performance, but better tools might be needed to extract the full potential of the latest process technologies.

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