Anton Shilov

Intel is to cut hundreds of jobs in Israel, including hundreds at its Fab 28 plant near Kiryat Gat. The company is reportedly considering shutting down the aging facility altogether.

GlobalFoundries will acquire MIPS to integrate RISC-V-based CPU and AI IP into its portfolio, shifting from a pure-play foundry to a provider of complete compute solutions.

And that's without new tariffs on products from Japan and South Korea.

They'll take effect from August 1

Problems continue.

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.

Intel's upcoming Xeon 7 'Diamond Rapids' processors will feature up to 192 Panther Cove cores, 16 DDR5 memory channels, PCIe Gen 6 support, and a 500W TDP.

Asus first with Ascend GX10 Nvidia Grace Blackwell desktop platform launch, coming later this month

No smoke without fire, or an unsubstantiated rumor?

The U.S. government is drafting export rules to require licenses for shipping Nvidia’s advanced AI GPUs to Malaysia and Thailand, aiming to block possible re-exports to China.

Single thread is a different story...

Elon Musk's xAI is set to build million-GPU data center expected to draw up to 2 GW of power, prompting Musk to buy and import an entire power plant.

CoreWeave deploys first Dell GB300 cluster with Switch: Up to 1.1 ExaFLOPS of AI inference performance per rack.

ZLUDA has expanded its team and made steady technical progress in Q1: Expands support for LLM.c, attempts to bring back PhysX 32-bit.

EDA software in exchange for antimony, gallium, and germanium?

Server demand is expected to continue for the next four years.

TSMC's N2 and A16 may have no rivals

SK hynix revealed that Intel's upcoming Xeon 'Diamond Rapids' CPUs will adopt 2nd Gen MRDIMMs and its next-generation Gaudi AI accelerator 'Jaguar Shores' will feature SK hynix HBM4 memory.

Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.

Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced production capacity by 69% through 2028.

Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.

The focus will be on lithography and chip design software

ASML launches an online competition in China to boost lithography awareness and recruit talented engineers for its operations in the country.

No hardware, no AI?

And also a 30% increase in density